Thermal investigation of a high brightness LED array package assembly for various placement algorithms

This paper presents a thermal management analysis and experimental validation of natural convective heat transfer of a high brightness LED array package assembly in various placement algorithms. The operating conditions include thermal conductivity of the PCB, heat sink design, and LED placement des...

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Veröffentlicht in:	Applied thermal engineering 2014-02, Vol.63 (1), p.105-118
Hauptverfasser:	Yung, K.C., Liem, H., Choy, H.S., Cai, Z.X.
Format:	Artikel
Sprache:	eng
Schlagworte:	Algorithms Applied sciences Arrays Assembly Design engineering Effectiveness Energy Energy. Thermal use of fuels Exact sciences and technology Heat transfer High brightness LED Optical performance Packages PCB Placement Theoretical studies. Data and constants. Metering Thermal management
Online-Zugang:	Volltext
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