Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure

► Mitigation method of the Sn whisker by thin metal layer formation. ► Au, Pd and Ni layers with the thickness from 50nm to 200nm were deposited on matte Sn plating by flash-coating process. ► No Sn whisker was observed on Au/Sn and Pd/Sn plating samples in room ambient environment over 10,000h. The...

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Veröffentlicht in:Journal of alloys and compounds 2013-05, Vol.558, p.125-130
Hauptverfasser: Kim, Keun-Soo, Kim, Sun-Sik, Yorikado, Yuuhi, Suganuma, Katsuaki, Tsujimoto, Masanobu, Yanada, Isamu
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Sprache:eng
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