Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure
► Mitigation method of the Sn whisker by thin metal layer formation. ► Au, Pd and Ni layers with the thickness from 50nm to 200nm were deposited on matte Sn plating by flash-coating process. ► No Sn whisker was observed on Au/Sn and Pd/Sn plating samples in room ambient environment over 10,000h. The...
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| Veröffentlicht in: | Journal of alloys and compounds 2013-05, Vol.558, p.125-130 |
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| container_title | Journal of alloys and compounds |
| container_volume | 558 |
| creator | Kim, Keun-Soo Kim, Sun-Sik Yorikado, Yuuhi Suganuma, Katsuaki Tsujimoto, Masanobu Yanada, Isamu |
| description | ► Mitigation method of the Sn whisker by thin metal layer formation. ► Au, Pd and Ni layers with the thickness from 50nm to 200nm were deposited on matte Sn plating by flash-coating process. ► No Sn whisker was observed on Au/Sn and Pd/Sn plating samples in room ambient environment over 10,000h.
The establishment of lead-free plating technology and countermeasures for whisker formation are some of the critical issues remaining to be solved for lead-free electronics packaging. This study examined a method for mitigating Sn whisker formation by depositing a thin metal layer, such as Au, Pd and Ni, on pure Sn plating. Au, Pd and Ni layers with thicknesses ranging from 50nm to 200nm were deposited on matte Sn plating using a flash-coating process. The Sn whisker growth behavior of pure Sn plating and metal layer/Sn plating samples at room ambient over a period of 10,000h was observed. The metal layer/Sn plating was considerably more stable against Sn whisker formation in room ambient environment than the pure Sn plating. |
| doi_str_mv | 10.1016/j.jallcom.2013.01.051 |
| format | Article |
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The establishment of lead-free plating technology and countermeasures for whisker formation are some of the critical issues remaining to be solved for lead-free electronics packaging. This study examined a method for mitigating Sn whisker formation by depositing a thin metal layer, such as Au, Pd and Ni, on pure Sn plating. Au, Pd and Ni layers with thicknesses ranging from 50nm to 200nm were deposited on matte Sn plating using a flash-coating process. The Sn whisker growth behavior of pure Sn plating and metal layer/Sn plating samples at room ambient over a period of 10,000h was observed. The metal layer/Sn plating was considerably more stable against Sn whisker formation in room ambient environment than the pure Sn plating.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2013.01.051</identifier><language>eng</language><publisher>Kidlington: Elsevier B.V</publisher><subject>Applied sciences ; Deposition ; Exact sciences and technology ; Flash-coating ; Gold ; Lead free ; Mattes ; Metals. Metallurgy ; Nickel ; Palladium ; Plating ; Production techniques ; Sn whisker ; Surface treatment ; Tin</subject><ispartof>Journal of alloys and compounds, 2013-05, Vol.558, p.125-130</ispartof><rights>2013 Elsevier B.V.</rights><rights>2014 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c372t-1a2fd4552e065b8504690d94b31d564e98ef2a2800b06c5d94eba81c5a64f6e73</citedby><cites>FETCH-LOGICAL-c372t-1a2fd4552e065b8504690d94b31d564e98ef2a2800b06c5d94eba81c5a64f6e73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jallcom.2013.01.051$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=27175330$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kim, Keun-Soo</creatorcontrib><creatorcontrib>Kim, Sun-Sik</creatorcontrib><creatorcontrib>Yorikado, Yuuhi</creatorcontrib><creatorcontrib>Suganuma, Katsuaki</creatorcontrib><creatorcontrib>Tsujimoto, Masanobu</creatorcontrib><creatorcontrib>Yanada, Isamu</creatorcontrib><title>Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure</title><title>Journal of alloys and compounds</title><description>► Mitigation method of the Sn whisker by thin metal layer formation. ► Au, Pd and Ni layers with the thickness from 50nm to 200nm were deposited on matte Sn plating by flash-coating process. ► No Sn whisker was observed on Au/Sn and Pd/Sn plating samples in room ambient environment over 10,000h.
The establishment of lead-free plating technology and countermeasures for whisker formation are some of the critical issues remaining to be solved for lead-free electronics packaging. This study examined a method for mitigating Sn whisker formation by depositing a thin metal layer, such as Au, Pd and Ni, on pure Sn plating. Au, Pd and Ni layers with thicknesses ranging from 50nm to 200nm were deposited on matte Sn plating using a flash-coating process. The Sn whisker growth behavior of pure Sn plating and metal layer/Sn plating samples at room ambient over a period of 10,000h was observed. The metal layer/Sn plating was considerably more stable against Sn whisker formation in room ambient environment than the pure Sn plating.</description><subject>Applied sciences</subject><subject>Deposition</subject><subject>Exact sciences and technology</subject><subject>Flash-coating</subject><subject>Gold</subject><subject>Lead free</subject><subject>Mattes</subject><subject>Metals. Metallurgy</subject><subject>Nickel</subject><subject>Palladium</subject><subject>Plating</subject><subject>Production techniques</subject><subject>Sn whisker</subject><subject>Surface treatment</subject><subject>Tin</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFkEFv1DAQhS0EEkvhJyD5gsQl6UwcO86pQhUtlSr1UDhbXmfS9ZLEqe2w8O-bZVdcOT3pzfdmNI-xjwglAqrLfbm3w-DCWFaAogQsQeIrtkHdiKJWqn3NNtBWstBC67fsXUp7AMBW4Ib1jxM_7Hz6SZE_xXDIOx4mvprzYLOfnvjBH634V8OSeVpibx3xHMnmkabMuyUewbwjHkMYeaZxpmjzEonT7zmsCXrP3vR2SPThrBfsx83X79ffivuH27vrL_eFE02VC7RV39VSVgRKbrWEWrXQtfVWYCdVTa2mvrKVBtiCcnKd0NZqdNKqulfUiAv2-bR3juF5oZTN6JOjYbAThSUZVA3KutG1WlF5Ql0MKUXqzRz9aOMfg2COvZq9Ofdqjr0aQLP2uuY-nU_Y5OzQRzs5n_6FqwYbKQSs3NWJo_XfX56iSc7T5KjzkVw2XfD_ufQCjA-SMg</recordid><startdate>20130505</startdate><enddate>20130505</enddate><creator>Kim, Keun-Soo</creator><creator>Kim, Sun-Sik</creator><creator>Yorikado, Yuuhi</creator><creator>Suganuma, Katsuaki</creator><creator>Tsujimoto, Masanobu</creator><creator>Yanada, Isamu</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20130505</creationdate><title>Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure</title><author>Kim, Keun-Soo ; Kim, Sun-Sik ; Yorikado, Yuuhi ; Suganuma, Katsuaki ; Tsujimoto, Masanobu ; Yanada, Isamu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c372t-1a2fd4552e065b8504690d94b31d564e98ef2a2800b06c5d94eba81c5a64f6e73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Applied sciences</topic><topic>Deposition</topic><topic>Exact sciences and technology</topic><topic>Flash-coating</topic><topic>Gold</topic><topic>Lead free</topic><topic>Mattes</topic><topic>Metals. Metallurgy</topic><topic>Nickel</topic><topic>Palladium</topic><topic>Plating</topic><topic>Production techniques</topic><topic>Sn whisker</topic><topic>Surface treatment</topic><topic>Tin</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kim, Keun-Soo</creatorcontrib><creatorcontrib>Kim, Sun-Sik</creatorcontrib><creatorcontrib>Yorikado, Yuuhi</creatorcontrib><creatorcontrib>Suganuma, Katsuaki</creatorcontrib><creatorcontrib>Tsujimoto, Masanobu</creatorcontrib><creatorcontrib>Yanada, Isamu</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kim, Keun-Soo</au><au>Kim, Sun-Sik</au><au>Yorikado, Yuuhi</au><au>Suganuma, Katsuaki</au><au>Tsujimoto, Masanobu</au><au>Yanada, Isamu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2013-05-05</date><risdate>2013</risdate><volume>558</volume><spage>125</spage><epage>130</epage><pages>125-130</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>► Mitigation method of the Sn whisker by thin metal layer formation. ► Au, Pd and Ni layers with the thickness from 50nm to 200nm were deposited on matte Sn plating by flash-coating process. ► No Sn whisker was observed on Au/Sn and Pd/Sn plating samples in room ambient environment over 10,000h.
The establishment of lead-free plating technology and countermeasures for whisker formation are some of the critical issues remaining to be solved for lead-free electronics packaging. This study examined a method for mitigating Sn whisker formation by depositing a thin metal layer, such as Au, Pd and Ni, on pure Sn plating. Au, Pd and Ni layers with thicknesses ranging from 50nm to 200nm were deposited on matte Sn plating using a flash-coating process. The Sn whisker growth behavior of pure Sn plating and metal layer/Sn plating samples at room ambient over a period of 10,000h was observed. The metal layer/Sn plating was considerably more stable against Sn whisker formation in room ambient environment than the pure Sn plating.</abstract><cop>Kidlington</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2013.01.051</doi><tpages>6</tpages></addata></record> |
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| ispartof | Journal of alloys and compounds, 2013-05, Vol.558, p.125-130 |
| issn | 0925-8388 1873-4669 |
| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Applied sciences Deposition Exact sciences and technology Flash-coating Gold Lead free Mattes Metals. Metallurgy Nickel Palladium Plating Production techniques Sn whisker Surface treatment Tin |
| title | Sn whisker growth on Sn plating with or without surface treatment during the room temperature exposure |
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