An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip

[Display omitted] •We adopt the post-CMOS procedure to develop a novel probe chip.•The procedure includes lithography, EN plating, grinding, and etching.•The chip designs a TSV structure to combine with the multi-layer interconnections.•TSVs can simplify the wiring layout between probe heads and oth...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Microelectronic engineering 2014-01, Vol.113, p.147-151
Hauptverfasser:	Lee, Kuo-Yu, Huang, Jung-Tang, Chao, Pen-Shan, Lin, Jian-Ming, Hsu, Hou-Jun
Format:	Artikel
Sprache:	eng
Schlagworte:	Chip formation Chips CMOS CMOS-MEMS Dry etching Drying Electroless nickel plating Etching Plating Probe chip Semiconductors
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!