Dopant effects on the photoluminescence of interstitial-related centers in ion implanted silicon

The dopant dependence of photoluminescence (PL) from interstitial-related centers formed by ion implantation and a subsequent anneal in the range 175-525°C is presented. The evolution of these centers is strongly effected by interstitial-dopant clustering even in the low temperature regime. There is...

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Veröffentlicht in:Journal of applied physics 2012-05, Vol.111 (9), p.094910-094910-8
Hauptverfasser: Johnson, B. C., Villis, B. J., Burgess, J. E., Stavrias, N., McCallum, J. C., Charnvanichborikarn, S., Wong-Leung, J., Jagadish, C., Williams, J. S.
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container_end_page 094910-8
container_issue 9
container_start_page 094910
container_title Journal of applied physics
container_volume 111
creator Johnson, B. C.
Villis, B. J.
Burgess, J. E.
Stavrias, N.
McCallum, J. C.
Charnvanichborikarn, S.
Wong-Leung, J.
Jagadish, C.
Williams, J. S.
description The dopant dependence of photoluminescence (PL) from interstitial-related centers formed by ion implantation and a subsequent anneal in the range 175-525°C is presented. The evolution of these centers is strongly effected by interstitial-dopant clustering even in the low temperature regime. There is a significant decrease in the W line (1018.2meV) PL intensity with increasing B concentration. However, an enhancement is also observed in a narrow fabrication window in samples implanted with either P or Ga. The anneal temperature at which the W line intensity is optimized is sensitive to the dopant concentration and type. Furthermore, dopants which are implanted but not activated prior to low temperature thermal processing are found to have a more detrimental effect on the resulting PL. Splitting of the X line (1039.8meV) arising from implantation damage induced strain is also observed.
doi_str_mv 10.1063/1.4710991
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The anneal temperature at which the W line intensity is optimized is sensitive to the dopant concentration and type. Furthermore, dopants which are implanted but not activated prior to low temperature thermal processing are found to have a more detrimental effect on the resulting PL. Splitting of the X line (1039.8meV) arising from implantation damage induced strain is also observed.</abstract><pub>American Institute of Physics</pub><doi>10.1063/1.4710991</doi><oa>free_for_read</oa></addata></record>
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source AIP Journals Complete; AIP Digital Archive; Alma/SFX Local Collection
subjects Annealing
Dopants
Evolution
Gallium
Implantation
Photoluminescence
Splitting
Strain
title Dopant effects on the photoluminescence of interstitial-related centers in ion implanted silicon
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