The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

In this paper, the effect of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects is presented. Extensive numerical modeling is conducted for mechanical analysis of which the results are correlated with in-situ experimental observations. The numerical results rev...

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Veröffentlicht in:	Thin solid films 2011-01, Vol.519 (7), p.2225-2234
Hauptverfasser:	Hsu, Yung-Yu, Gonzalez, Mario, Bossuyt, Frederick, Axisa, Fabrice, Vanfleteren, Jan, De Wolf, Ingrid
Format:	Artikel
Sprache:	eng
Schlagworte:	Cohesive failure Condensed matter: structure, mechanical and thermal properties Conductors (devices) Deformation Delaminating Delamination Elongation Encapsulation Exact sciences and technology Failure mechanisms Interfacial delamination Physics Stretchable device Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology
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