Effects of Ti addition to Sn–Ag and Sn–Cu solders
► Ti additions to Sn–Cu and Sn–Ag solders can effectively reduce the undercooling. ► Increasing the cooling rate will increase the hardness of Ti-added solders. ► Ti2Sn3 networks stabilize the morphology of β-Sn even in a severe aging condition. ► The orientation distribution of β-Sn can be preserve...
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| Veröffentlicht in: | Journal of alloys and compounds 2012-04, Vol.520, p.244-249 |
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| container_end_page | 249 |
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| container_title | Journal of alloys and compounds |
| container_volume | 520 |
| creator | Chen, W.M. Kang, S.K. Kao, C.R. |
| description | ► Ti additions to Sn–Cu and Sn–Ag solders can effectively reduce the undercooling. ► Increasing the cooling rate will increase the hardness of Ti-added solders. ► Ti2Sn3 networks stabilize the morphology of β-Sn even in a severe aging condition. ► The orientation distribution of β-Sn can be preserved after a minor addition of Ti. ► Ti-added solder may be a superior candidate for enhanced electromigration resistance.
Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn–Cu and Sn–Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions. |
| doi_str_mv | 10.1016/j.jallcom.2012.01.032 |
| format | Article |
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Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn–Cu and Sn–Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2012.01.032</identifier><language>eng</language><publisher>Kidlington: Elsevier B.V</publisher><subject>Alloying ; Alloys ; Applied sciences ; Brazing. Soldering ; Correlation ; Exact sciences and technology ; Joining, thermal cutting: metallurgical aspects ; Metals. Metallurgy ; Microstructure ; Minor alloying elements ; Pb-free solders ; Solders ; Supercooling ; Ti addition ; Tin ; Titanium</subject><ispartof>Journal of alloys and compounds, 2012-04, Vol.520, p.244-249</ispartof><rights>2012 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c485t-a30c3f76a7285ca4fe9067485210100782a827dbac012bde74e48e80e00b4d413</citedby><cites>FETCH-LOGICAL-c485t-a30c3f76a7285ca4fe9067485210100782a827dbac012bde74e48e80e00b4d413</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jallcom.2012.01.032$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=25611062$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chen, W.M.</creatorcontrib><creatorcontrib>Kang, S.K.</creatorcontrib><creatorcontrib>Kao, C.R.</creatorcontrib><title>Effects of Ti addition to Sn–Ag and Sn–Cu solders</title><title>Journal of alloys and compounds</title><description>► Ti additions to Sn–Cu and Sn–Ag solders can effectively reduce the undercooling. ► Increasing the cooling rate will increase the hardness of Ti-added solders. ► Ti2Sn3 networks stabilize the morphology of β-Sn even in a severe aging condition. ► The orientation distribution of β-Sn can be preserved after a minor addition of Ti. ► Ti-added solder may be a superior candidate for enhanced electromigration resistance.
Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn–Cu and Sn–Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions.</description><subject>Alloying</subject><subject>Alloys</subject><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Correlation</subject><subject>Exact sciences and technology</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Metals. Metallurgy</subject><subject>Microstructure</subject><subject>Minor alloying elements</subject><subject>Pb-free solders</subject><subject>Solders</subject><subject>Supercooling</subject><subject>Ti addition</subject><subject>Tin</subject><subject>Titanium</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNqFkM9KAzEQxoMoWKuPIOxF8LLrJNlNsicpxX9Q8GA9hzR_JMt2U5Ot4M138A19ElNavHqagfm-mW9-CF1iqDBgdtNVnep7HdYVAUwqwBVQcoQmWHBa1oy1x2gCLWlKQYU4RWcpdQCAW4onqLlzzuoxFcEVS18oY_zow1CMoXgZfr6-Z2-FGsy-n2-LFHpjYzpHJ071yV4c6hS93t8t54_l4vnhaT5blLoWzVgqCpo6zhQnotGqdrYFxvOI5NwAXBAlCDcrpXPulbG8trWwAizAqjY1plN0vd-7ieF9a9Mo1z5p2_dqsGGbJGYcU8Exb7O02Ut1DClF6-Qm-rWKnxKD3GGSnTxgkjtMErDMmLLv6nBCJa16F9Wgffozk4ZhDGynu93rbP73w9sok_Z20Nb4mAFKE_w_l34BdpJ_SQ</recordid><startdate>20120415</startdate><enddate>20120415</enddate><creator>Chen, W.M.</creator><creator>Kang, S.K.</creator><creator>Kao, C.R.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20120415</creationdate><title>Effects of Ti addition to Sn–Ag and Sn–Cu solders</title><author>Chen, W.M. ; Kang, S.K. ; Kao, C.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c485t-a30c3f76a7285ca4fe9067485210100782a827dbac012bde74e48e80e00b4d413</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Alloying</topic><topic>Alloys</topic><topic>Applied sciences</topic><topic>Brazing. Soldering</topic><topic>Correlation</topic><topic>Exact sciences and technology</topic><topic>Joining, thermal cutting: metallurgical aspects</topic><topic>Metals. Metallurgy</topic><topic>Microstructure</topic><topic>Minor alloying elements</topic><topic>Pb-free solders</topic><topic>Solders</topic><topic>Supercooling</topic><topic>Ti addition</topic><topic>Tin</topic><topic>Titanium</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chen, W.M.</creatorcontrib><creatorcontrib>Kang, S.K.</creatorcontrib><creatorcontrib>Kao, C.R.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chen, W.M.</au><au>Kang, S.K.</au><au>Kao, C.R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of Ti addition to Sn–Ag and Sn–Cu solders</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2012-04-15</date><risdate>2012</risdate><volume>520</volume><spage>244</spage><epage>249</epage><pages>244-249</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>► Ti additions to Sn–Cu and Sn–Ag solders can effectively reduce the undercooling. ► Increasing the cooling rate will increase the hardness of Ti-added solders. ► Ti2Sn3 networks stabilize the morphology of β-Sn even in a severe aging condition. ► The orientation distribution of β-Sn can be preserved after a minor addition of Ti. ► Ti-added solder may be a superior candidate for enhanced electromigration resistance.
Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solder joints. In this study, a small amount of Ti was added to Sn–Cu and Sn–Ag solders, and their microstructures, solidification behaviors, mechanical properties, and high temperature aging characteristics were investigated. Thermal analysis confirmed Ti addition being very effective in reducing the undercooling. Correlations between cooling rates, microstructure, and microhardness were established. One pronounced feature of Ti addition was that Ti-added solders had microstructures very stable against extreme aging conditions.</abstract><cop>Kidlington</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2012.01.032</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | Journal of alloys and compounds, 2012-04, Vol.520, p.244-249 |
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| language | eng |
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| subjects | Alloying Alloys Applied sciences Brazing. Soldering Correlation Exact sciences and technology Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Microstructure Minor alloying elements Pb-free solders Solders Supercooling Ti addition Tin Titanium |
| title | Effects of Ti addition to Sn–Ag and Sn–Cu solders |
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