Dynamic deformation of a wafer above a lift hole and influence on flatness due to chucking

A site flatness of less than 26nm will be required when fabricating next-generation devices. A pin chuck is used to flatten warped wafers. This chuck has lift holes for loading and unloading wafers and a ring seal around its periphery. The lift holes and seal deteriorate the local flatness. This pap...

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Veröffentlicht in:	Microelectronic engineering 2011-08, Vol.88 (8), p.2163-2166
Hauptverfasser:	Une, Atsunobu, Yoshitomi, Kenichiro, Mochida, Masaaki
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Deformation Deterioration Dynamic deformation Dynamics Exact sciences and technology Flatness Fractures Lift Local deformation Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy Pin diameter Pin pitch Polishing Polishing step Ring seal Seals Vacuum pin chuck Wafer flatness Wafers
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