Experimental investigation and flow visualization to determine the optimum dimension range of microgap heat sinks

The rapid increase of heat flux in high performance electronic devices has necessitated the development of high capacity thermal management techniques that can support extremely high heat transfer rates. Flow boiling in microgap is very promising for this purpose due to its high heat transfer rate a...

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Veröffentlicht in:	International journal of heat and mass transfer 2012-12, Vol.55 (25-26), p.7623-7634
Hauptverfasser:	Alam, Tamanna, Lee, Poh Seng, Yap, Christopher R., Jin, Liwen, Balasubramanian, K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Boiling Confinement Confinement effect Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Flow boiling Flow visualization Heat flux Heat transfer Heat transfer coefficients Instabilities Integrated circuits Microgap heat sink Pressure drop Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Wall temperature
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