Design Assessments of a Refined DC Magnetron Sputter With Multiple Magnetron Arrangements
The DC magnetron sputtering systems (MSS) are widely applied in the microelectronic industries for thin film depositions. With their large installation volume in the related production lines, many efforts have been devoted to explore the possible refinements of the MSS structures that can improve th...
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| Veröffentlicht in: | IEEE transactions on magnetics 2010-06, Vol.46 (6), p.1614-1617 |
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| creator | Liu, Cheng-Tsung Lai, Ming-Chih Hwang, Chang-Chou |
| description | The DC magnetron sputtering systems (MSS) are widely applied in the microelectronic industries for thin film depositions. With their large installation volume in the related production lines, many efforts have been devoted to explore the possible refinements of the MSS structures that can improve the operational performance and reduce the target material consumption rates. Supported by qualitative and quantitative investigations, this paper describes a general guidance that can be applied to those commercial in-line DC MSS to control the magnetic field affecting the electron trajectories inside the sputterers. Results obtained from detailed studies on the systems with both single cylindrical magnetron and multiple rectangular magnetron structures showed that the proposed refinement scheme can increase the sputtering efficiency by over 25%, and the corresponding enhancements of substrate deposition rates are also to be expected. In addition, compared with those obtained without the refinements, the target erosion profiles with the refinements are more evenly spread out, thus reduction in the target material consumptions can also be expected. |
| doi_str_mv | 10.1109/TMAG.2009.2037976 |
| format | Article |
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With their large installation volume in the related production lines, many efforts have been devoted to explore the possible refinements of the MSS structures that can improve the operational performance and reduce the target material consumption rates. Supported by qualitative and quantitative investigations, this paper describes a general guidance that can be applied to those commercial in-line DC MSS to control the magnetic field affecting the electron trajectories inside the sputterers. Results obtained from detailed studies on the systems with both single cylindrical magnetron and multiple rectangular magnetron structures showed that the proposed refinement scheme can increase the sputtering efficiency by over 25%, and the corresponding enhancements of substrate deposition rates are also to be expected. In addition, compared with those obtained without the refinements, the target erosion profiles with the refinements are more evenly spread out, thus reduction in the target material consumptions can also be expected.</description><identifier>ISSN: 0018-9464</identifier><identifier>EISSN: 1941-0069</identifier><identifier>DOI: 10.1109/TMAG.2009.2037976</identifier><identifier>CODEN: IEMGAQ</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Assessments ; Cross-disciplinary physics: materials science; rheology ; Deposition ; Design engineering ; Direct current ; Electrons ; Erosion ; Exact sciences and technology ; Magnetic confinement ; Magnetic fields ; Magnetic flux ; Magnetic materials ; Magnetism ; Magnetron sputtering system ; Materials science ; Metals. Metallurgy ; Microelectronics ; Other topics in materials science ; permanent magnet ; Physics ; Positioning ; Production techniques ; Refining ; Spreads ; Sputtering ; substrate deposition ; Substrates ; Surface treatment ; target erosion ; Thin films ; Trajectory</subject><ispartof>IEEE transactions on magnetics, 2010-06, Vol.46 (6), p.1614-1617</ispartof><rights>2015 INIST-CNRS</rights><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. 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With their large installation volume in the related production lines, many efforts have been devoted to explore the possible refinements of the MSS structures that can improve the operational performance and reduce the target material consumption rates. Supported by qualitative and quantitative investigations, this paper describes a general guidance that can be applied to those commercial in-line DC MSS to control the magnetic field affecting the electron trajectories inside the sputterers. Results obtained from detailed studies on the systems with both single cylindrical magnetron and multiple rectangular magnetron structures showed that the proposed refinement scheme can increase the sputtering efficiency by over 25%, and the corresponding enhancements of substrate deposition rates are also to be expected. In addition, compared with those obtained without the refinements, the target erosion profiles with the refinements are more evenly spread out, thus reduction in the target material consumptions can also be expected.</description><subject>Applied sciences</subject><subject>Assessments</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Deposition</subject><subject>Design engineering</subject><subject>Direct current</subject><subject>Electrons</subject><subject>Erosion</subject><subject>Exact sciences and technology</subject><subject>Magnetic confinement</subject><subject>Magnetic fields</subject><subject>Magnetic flux</subject><subject>Magnetic materials</subject><subject>Magnetism</subject><subject>Magnetron sputtering system</subject><subject>Materials science</subject><subject>Metals. Metallurgy</subject><subject>Microelectronics</subject><subject>Other topics in materials science</subject><subject>permanent magnet</subject><subject>Physics</subject><subject>Positioning</subject><subject>Production techniques</subject><subject>Refining</subject><subject>Spreads</subject><subject>Sputtering</subject><subject>substrate deposition</subject><subject>Substrates</subject><subject>Surface treatment</subject><subject>target erosion</subject><subject>Thin films</subject><subject>Trajectory</subject><issn>0018-9464</issn><issn>1941-0069</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpdkE1Lw0AQhhdRsFZ_gHhZEMFL6n5lN3sMrVahRdCKeArbdLampEncTQ7-eze2FPEywzDPvAwPQpeUjCgl-m4xT6cjRogOhSut5BEaUC1oRIjUx2hACE0iLaQ4RWfeb8IoYkoG6GMCvlhXOPUevN9C1XpcW2zwC9iighWejPHcrCtoXV3h16ZrW3D4vWg_8bwr26Ip4c8-dc5Ua_iNOUcn1pQeLvZ9iN4e7hfjx2j2PH0ap7Mo57FsoyVYzoQ1PFc6Dk_JZaIVY8paa-LYkpwtRUCITCgXK06sShK20omEXMZMWz5Et7vcxtVfHfg22xY-h7I0FdSdz6hUlLPA0oBe_0M3deeq8F1GCVPBFxEkUHRH5a723oHNGldsjfsOUNbLznrZWS8728sONzf7ZONzU9qgIS_84ZBxShPF--yrHVcAwGEdC6kEV_wHB6eGjw</recordid><startdate>20100601</startdate><enddate>20100601</enddate><creator>Liu, Cheng-Tsung</creator><creator>Lai, Ming-Chih</creator><creator>Hwang, Chang-Chou</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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Metallurgy</topic><topic>Microelectronics</topic><topic>Other topics in materials science</topic><topic>permanent magnet</topic><topic>Physics</topic><topic>Positioning</topic><topic>Production techniques</topic><topic>Refining</topic><topic>Spreads</topic><topic>Sputtering</topic><topic>substrate deposition</topic><topic>Substrates</topic><topic>Surface treatment</topic><topic>target erosion</topic><topic>Thin films</topic><topic>Trajectory</topic><toplevel>online_resources</toplevel><creatorcontrib>Liu, Cheng-Tsung</creatorcontrib><creatorcontrib>Lai, Ming-Chih</creatorcontrib><creatorcontrib>Hwang, Chang-Chou</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on magnetics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liu, Cheng-Tsung</au><au>Lai, Ming-Chih</au><au>Hwang, Chang-Chou</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Design Assessments of a Refined DC Magnetron Sputter With Multiple Magnetron Arrangements</atitle><jtitle>IEEE transactions on magnetics</jtitle><stitle>TMAG</stitle><date>2010-06-01</date><risdate>2010</risdate><volume>46</volume><issue>6</issue><spage>1614</spage><epage>1617</epage><pages>1614-1617</pages><issn>0018-9464</issn><eissn>1941-0069</eissn><coden>IEMGAQ</coden><abstract>The DC magnetron sputtering systems (MSS) are widely applied in the microelectronic industries for thin film depositions. With their large installation volume in the related production lines, many efforts have been devoted to explore the possible refinements of the MSS structures that can improve the operational performance and reduce the target material consumption rates. Supported by qualitative and quantitative investigations, this paper describes a general guidance that can be applied to those commercial in-line DC MSS to control the magnetic field affecting the electron trajectories inside the sputterers. Results obtained from detailed studies on the systems with both single cylindrical magnetron and multiple rectangular magnetron structures showed that the proposed refinement scheme can increase the sputtering efficiency by over 25%, and the corresponding enhancements of substrate deposition rates are also to be expected. 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| subjects | Applied sciences Assessments Cross-disciplinary physics: materials science rheology Deposition Design engineering Direct current Electrons Erosion Exact sciences and technology Magnetic confinement Magnetic fields Magnetic flux Magnetic materials Magnetism Magnetron sputtering system Materials science Metals. Metallurgy Microelectronics Other topics in materials science permanent magnet Physics Positioning Production techniques Refining Spreads Sputtering substrate deposition Substrates Surface treatment target erosion Thin films Trajectory |
| title | Design Assessments of a Refined DC Magnetron Sputter With Multiple Magnetron Arrangements |
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