Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders

Purpose - The purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. The practical aspect of the obtained results is the main goal of these investigations.Design methodol...

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Veröffentlicht in:	Soldering & surface mount technology 2012-02, Vol.24 (1), p.4-11
Hauptverfasser:	Bukat, Krystyna, Sitek, Janusz, Koscielski, Marek, Moser, Zbigniew, Gasior, Wladyslaw, Pstrus, Janusz
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Contact angle Copper Experiments Finishes Indium Influence Intermetallic compounds Investigations Scanning electron microscopy Soldering Solders Studies Tin Wetting
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