Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders

Purpose - The purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. The practical aspect of the obtained results is the main goal of these investigations.Design methodol...

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Veröffentlicht in:Soldering & surface mount technology 2012-02, Vol.24 (1), p.4-11
Hauptverfasser: Bukat, Krystyna, Sitek, Janusz, Koscielski, Marek, Moser, Zbigniew, Gasior, Wladyslaw, Pstrus, Janusz
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container_end_page 11
container_issue 1
container_start_page 4
container_title Soldering & surface mount technology
container_volume 24
creator Bukat, Krystyna
Sitek, Janusz
Koscielski, Marek
Moser, Zbigniew
Gasior, Wladyslaw
Pstrus, Janusz
description Purpose - The purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. The practical aspect of the obtained results is the main goal of these investigations.Design methodology approach - The authors applied the wetting balance method for the wetting measurements at 230 and 250°C, in nitrogen atmosphere, in the presence of the ORM0 type flux. The PCBs with the SnCu (HASL) and Snimm finishes were investigated in the state "as received". To establish the wetting properties of the SnCu (HASL) and Snimm finishes on the PCBs, wetted by the investigated SnZnBiIn alloys, the SEM and EDX analyses were performed.Findings - The authors obtained very good wetting results of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloys. By applying the SEM and EDX methods, it was possible to establish that the barrier layer which was created during the HASL process between the copper and the SnCu solder is efficient enough to protect the copper against the influence of the Zn atoms from the SnZn7Bi3In4 solder. This is the reason for an improvement of the wetting properties. An immersion tin finish does not create such barrier layer with the copper. It results in a worse wetting than for the SnCu finishes but a better one than that for the copper. Immersion tin dissolves in the alloys during the soldering and this process delays the reaction between the copper and the Zn atoms from the SnZn7Bi3In4 solder.Research limitations implications - It is suggested that further studies are necessary for the confirmation of the practical application, but they should be limited to the reliability of the solder joint performance.Practical implications - The best wetting results of the PCBs with "tin finishes", especially with SnCu, wetted by the SnZn7Bi3In4 alloy, at 230 and 250°C and in nitrogen atmosphere, suggest a possibility of a practical usage of the tin-zinc-bismuth-indium alloys for soldering in electronics.Originality value - The wetting balance method combined with the SEM and EDX analyses were used as the quickest way to determine the mechanism of the better wettability properties in the case of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloy, compared to those of the PCBs on the Cu substrate.
doi_str_mv 10.1108/09540911211198504
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The practical aspect of the obtained results is the main goal of these investigations.Design methodology approach - The authors applied the wetting balance method for the wetting measurements at 230 and 250°C, in nitrogen atmosphere, in the presence of the ORM0 type flux. The PCBs with the SnCu (HASL) and Snimm finishes were investigated in the state "as received". To establish the wetting properties of the SnCu (HASL) and Snimm finishes on the PCBs, wetted by the investigated SnZnBiIn alloys, the SEM and EDX analyses were performed.Findings - The authors obtained very good wetting results of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloys. By applying the SEM and EDX methods, it was possible to establish that the barrier layer which was created during the HASL process between the copper and the SnCu solder is efficient enough to protect the copper against the influence of the Zn atoms from the SnZn7Bi3In4 solder. This is the reason for an improvement of the wetting properties. An immersion tin finish does not create such barrier layer with the copper. It results in a worse wetting than for the SnCu finishes but a better one than that for the copper. Immersion tin dissolves in the alloys during the soldering and this process delays the reaction between the copper and the Zn atoms from the SnZn7Bi3In4 solder.Research limitations implications - It is suggested that further studies are necessary for the confirmation of the practical application, but they should be limited to the reliability of the solder joint performance.Practical implications - The best wetting results of the PCBs with "tin finishes", especially with SnCu, wetted by the SnZn7Bi3In4 alloy, at 230 and 250°C and in nitrogen atmosphere, suggest a possibility of a practical usage of the tin-zinc-bismuth-indium alloys for soldering in electronics.Originality value - The wetting balance method combined with the SEM and EDX analyses were used as the quickest way to determine the mechanism of the better wettability properties in the case of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloy, compared to those of the PCBs on the Cu substrate.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/09540911211198504</identifier><identifier>CODEN: SSMOEO</identifier><language>eng</language><publisher>Bradford: Emerald Group Publishing Limited</publisher><subject>Alloys ; Contact angle ; Copper ; Experiments ; Finishes ; Indium ; Influence ; Intermetallic compounds ; Investigations ; Scanning electron microscopy ; Soldering ; Solders ; Studies ; Tin ; Wetting</subject><ispartof>Soldering &amp; surface mount technology, 2012-02, Vol.24 (1), p.4-11</ispartof><rights>Emerald Group Publishing Limited</rights><rights>Copyright Emerald Group Publishing Limited 2012</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c298t-96565dc52c62458f58e18693c6631ca503aac221797339e16ead0f3b17383fda3</citedby><cites>FETCH-LOGICAL-c298t-96565dc52c62458f58e18693c6631ca503aac221797339e16ead0f3b17383fda3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/09540911211198504/full/pdf$$EPDF$$P50$$Gemerald$$H</linktopdf><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/09540911211198504/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,11635,27924,27925,52686,52689</link.rule.ids></links><search><creatorcontrib>Bukat, Krystyna</creatorcontrib><creatorcontrib>Sitek, Janusz</creatorcontrib><creatorcontrib>Koscielski, Marek</creatorcontrib><creatorcontrib>Moser, Zbigniew</creatorcontrib><creatorcontrib>Gasior, Wladyslaw</creatorcontrib><creatorcontrib>Pstrus, Janusz</creatorcontrib><title>Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders</title><title>Soldering &amp; surface mount technology</title><description>Purpose - The purpose of this article is to establish why the wetting on PCBs with SnCu (HASL) and Snimm finishes in the presence of a flux is better than the wetting of those on a copper substrate. 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The practical aspect of the obtained results is the main goal of these investigations.Design methodology approach - The authors applied the wetting balance method for the wetting measurements at 230 and 250°C, in nitrogen atmosphere, in the presence of the ORM0 type flux. The PCBs with the SnCu (HASL) and Snimm finishes were investigated in the state "as received". To establish the wetting properties of the SnCu (HASL) and Snimm finishes on the PCBs, wetted by the investigated SnZnBiIn alloys, the SEM and EDX analyses were performed.Findings - The authors obtained very good wetting results of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloys. By applying the SEM and EDX methods, it was possible to establish that the barrier layer which was created during the HASL process between the copper and the SnCu solder is efficient enough to protect the copper against the influence of the Zn atoms from the SnZn7Bi3In4 solder. This is the reason for an improvement of the wetting properties. An immersion tin finish does not create such barrier layer with the copper. It results in a worse wetting than for the SnCu finishes but a better one than that for the copper. Immersion tin dissolves in the alloys during the soldering and this process delays the reaction between the copper and the Zn atoms from the SnZn7Bi3In4 solder.Research limitations implications - It is suggested that further studies are necessary for the confirmation of the practical application, but they should be limited to the reliability of the solder joint performance.Practical implications - The best wetting results of the PCBs with "tin finishes", especially with SnCu, wetted by the SnZn7Bi3In4 alloy, at 230 and 250°C and in nitrogen atmosphere, suggest a possibility of a practical usage of the tin-zinc-bismuth-indium alloys for soldering in electronics.Originality value - The wetting balance method combined with the SEM and EDX analyses were used as the quickest way to determine the mechanism of the better wettability properties in the case of the PCBs with the SnCu and Snimm finishes, wetted by the SnZn7Bi3In4 alloy, compared to those of the PCBs on the Cu substrate.</abstract><cop>Bradford</cop><pub>Emerald Group Publishing Limited</pub><doi>10.1108/09540911211198504</doi><tpages>8</tpages></addata></record>
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identifier ISSN: 0954-0911
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1758-6836
language eng
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source Emerald A-Z Current Journals
subjects Alloys
Contact angle
Copper
Experiments
Finishes
Indium
Influence
Intermetallic compounds
Investigations
Scanning electron microscopy
Soldering
Solders
Studies
Tin
Wetting
title Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders
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