Effects of humidity on tin whisker growth — Investigated on Ni and Ag underplated layer construction

The effect of humidity on nickel and silver underlayered tin platings has been observed in relation to whisker formation. Using nickel or silver underlayers between the copper substrate and the tin coating is known to be a useful technique for mitigating the occurrence of whiskers. The underlayer bl...

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Veröffentlicht in:	Thin solid films 2011-10, Vol.520 (1), p.384-390
Hauptverfasser:	Horváth, Barbara, Illés, Balázs, Shinohara, Tadashi, Harsányi, Gábor
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Exact sciences and technology Humidity Intermetallic compounds Materials science Methods of deposition of films and coatings film growth and epitaxy Nickel Physics Relative humidity Roots Silver Silver and nickel underlayer Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Theory and models of film growth Thin films Tin Tin plating Tin whisker Whiskers and dendrites (growth, structure, and nonelectronic properties)
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