Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders
To enhance the reliability of Pb-free solders in high temperature and high humidity conditions, the minor alloying elements of Be and Co are investigated in terms of the growth of Sn whiskers and various properties of Sn-based Pb-free solders. Sn whisker growth is suppressed by adding up to 0.02 wt%...
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| Veröffentlicht in: | Journal of materials research 2012-07, Vol.27 (14), p.1877-1886 |
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| container_issue | 14 |
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| container_title | Journal of materials research |
| container_volume | 27 |
| creator | Chang, Jaewon Seo, Sun-Kyoung Cho, Moon Gi Lee, Dong Nyung Kang, Kyoo-Sik Lee, Hyuck Mo |
| description | To enhance the reliability of Pb-free solders in high temperature and high humidity conditions, the minor alloying elements of Be and Co are investigated in terms of the growth of Sn whiskers and various properties of Sn-based Pb-free solders. Sn whisker growth is suppressed by adding up to 0.02 wt% Be to Sn-based solders. Adding Be and Co can effectively reduce the undercooling of Sn–1.0Ag–0.5Cu (wt%) solders. And the microstructures of Sn–1.0Ag–0.5Cu–0.02Be solders are similar to those of Sn–1.0Ag–0.5Cu. Furthermore, adding Co to solders increases the microhardness number as a result of the solid solution hardening. Adding Be causes no changes in the morphology or thickness of Cu6Sn5 at the Cu/OSP (organic solderability preservative) under bump metallurgy interface. However, the scallop-like Cu6Sn5 microstructure changes to a flat (Cu,Co)6Sn5 microstructure when 0.05 wt% of Co is added to Sn–1.0Ag–0.5Cu–0.02Be solders. |
| doi_str_mv | 10.1557/jmr.2012.182 |
| format | Article |
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Sn whisker growth is suppressed by adding up to 0.02 wt% Be to Sn-based solders. Adding Be and Co can effectively reduce the undercooling of Sn–1.0Ag–0.5Cu (wt%) solders. And the microstructures of Sn–1.0Ag–0.5Cu–0.02Be solders are similar to those of Sn–1.0Ag–0.5Cu. Furthermore, adding Co to solders increases the microhardness number as a result of the solid solution hardening. Adding Be causes no changes in the morphology or thickness of Cu6Sn5 at the Cu/OSP (organic solderability preservative) under bump metallurgy interface. However, the scallop-like Cu6Sn5 microstructure changes to a flat (Cu,Co)6Sn5 microstructure when 0.05 wt% of Co is added to Sn–1.0Ag–0.5Cu–0.02Be solders.</description><identifier>ISSN: 0884-2914</identifier><identifier>EISSN: 2044-5326</identifier><identifier>DOI: 10.1557/jmr.2012.182</identifier><identifier>CODEN: JMREEE</identifier><language>eng</language><publisher>New York, USA: Cambridge University Press</publisher><subject>Applied and Technical Physics ; Biomaterials ; Cooling ; Experiments ; High temperature ; Humidity ; Inorganic Chemistry ; Intermetallic compounds ; Lead (metal) ; Materials Engineering ; Materials research ; Materials Science ; Mechanical properties ; Nanotechnology ; Solders ; Studies ; Tin ; Toxicity</subject><ispartof>Journal of materials research, 2012-07, Vol.27 (14), p.1877-1886</ispartof><rights>Copyright © Materials Research Society 2012</rights><rights>The Materials Research Society 2012</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c373t-99d41222bd67a7baed0ff8d3278f7e3950a6c149222ac0841e0e21cf8b5549693</citedby><cites>FETCH-LOGICAL-c373t-99d41222bd67a7baed0ff8d3278f7e3950a6c149222ac0841e0e21cf8b5549693</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1557/jmr.2012.182$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://www.cambridge.org/core/product/identifier/S0884291412001823/type/journal_article$$EHTML$$P50$$Gcambridge$$H</linktohtml><link.rule.ids>164,314,776,780,27901,27902,41464,42533,51294,55603</link.rule.ids></links><search><creatorcontrib>Chang, Jaewon</creatorcontrib><creatorcontrib>Seo, Sun-Kyoung</creatorcontrib><creatorcontrib>Cho, Moon Gi</creatorcontrib><creatorcontrib>Lee, Dong Nyung</creatorcontrib><creatorcontrib>Kang, Kyoo-Sik</creatorcontrib><creatorcontrib>Lee, Hyuck Mo</creatorcontrib><title>Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders</title><title>Journal of materials research</title><addtitle>Journal of Materials Research</addtitle><description>To enhance the reliability of Pb-free solders in high temperature and high humidity conditions, the minor alloying elements of Be and Co are investigated in terms of the growth of Sn whiskers and various properties of Sn-based Pb-free solders. Sn whisker growth is suppressed by adding up to 0.02 wt% Be to Sn-based solders. Adding Be and Co can effectively reduce the undercooling of Sn–1.0Ag–0.5Cu (wt%) solders. And the microstructures of Sn–1.0Ag–0.5Cu–0.02Be solders are similar to those of Sn–1.0Ag–0.5Cu. Furthermore, adding Co to solders increases the microhardness number as a result of the solid solution hardening. Adding Be causes no changes in the morphology or thickness of Cu6Sn5 at the Cu/OSP (organic solderability preservative) under bump metallurgy interface. 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Sn whisker growth is suppressed by adding up to 0.02 wt% Be to Sn-based solders. Adding Be and Co can effectively reduce the undercooling of Sn–1.0Ag–0.5Cu (wt%) solders. And the microstructures of Sn–1.0Ag–0.5Cu–0.02Be solders are similar to those of Sn–1.0Ag–0.5Cu. Furthermore, adding Co to solders increases the microhardness number as a result of the solid solution hardening. Adding Be causes no changes in the morphology or thickness of Cu6Sn5 at the Cu/OSP (organic solderability preservative) under bump metallurgy interface. However, the scallop-like Cu6Sn5 microstructure changes to a flat (Cu,Co)6Sn5 microstructure when 0.05 wt% of Co is added to Sn–1.0Ag–0.5Cu–0.02Be solders.</abstract><cop>New York, USA</cop><pub>Cambridge University Press</pub><doi>10.1557/jmr.2012.182</doi><tpages>10</tpages></addata></record> |
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| subjects | Applied and Technical Physics Biomaterials Cooling Experiments High temperature Humidity Inorganic Chemistry Intermetallic compounds Lead (metal) Materials Engineering Materials research Materials Science Mechanical properties Nanotechnology Solders Studies Tin Toxicity |
| title | Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders |
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