Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide
We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazona...
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| Veröffentlicht in: | Journal of Photopolymer Science and Technology 2010/12/27, Vol.23(6), pp.775-779 |
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| container_issue | 6 |
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| container_title | Journal of Photopolymer Science and Technology |
| container_volume | 23 |
| creator | Yuba, Tomoyuki Okuda, Ryoji Tomikawa, Masao Kim, Jae Hyun |
| description | We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazonaphthoquinone sulfonate. After soft baking, 10-14% of solvent was remained. Below 120°C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130°C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120°C for 4min is suitable soft baking condition in this study. |
| doi_str_mv | 10.2494/photopolymer.23.775 |
| format | Article |
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After soft baking, 10-14% of solvent was remained. Below 120°C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130°C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120°C for 4min is suitable soft baking condition in this study.</description><identifier>ISSN: 0914-9244</identifier><identifier>ISSN: 1349-6336</identifier><identifier>EISSN: 1349-6336</identifier><identifier>DOI: 10.2494/photopolymer.23.775</identifier><language>eng</language><publisher>Hiratsuka: The Society of Photopolymer Science and Technology(SPST)</publisher><subject>Baking ; Decomposition ; development loss ; Esterification ; PAC decomposition ; Photopolymers ; Photosensitivity ; Polyimide resins ; residual solvent ; Solvents ; Sulfonates</subject><ispartof>Journal of Photopolymer Science and Technology, 2010/12/27, Vol.23(6), pp.775-779</ispartof><rights>2010 The Society of Photopolymer Science and Technology (SPST)</rights><rights>Copyright Japan Science and Technology Agency 2010</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c569t-7ed59c0214c0e0b41a2ecccf10bf1adee04570ffcd72bdbfdb59c476cd8e51b73</citedby><cites>FETCH-LOGICAL-c569t-7ed59c0214c0e0b41a2ecccf10bf1adee04570ffcd72bdbfdb59c476cd8e51b73</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,1877,27901,27902</link.rule.ids></links><search><creatorcontrib>Yuba, Tomoyuki</creatorcontrib><creatorcontrib>Okuda, Ryoji</creatorcontrib><creatorcontrib>Tomikawa, Masao</creatorcontrib><creatorcontrib>Kim, Jae Hyun</creatorcontrib><title>Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide</title><title>Journal of Photopolymer Science and Technology</title><addtitle>J. Photopol. Sci. Technol.</addtitle><description>We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazonaphthoquinone sulfonate. After soft baking, 10-14% of solvent was remained. Below 120°C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130°C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120°C for 4min is suitable soft baking condition in this study.</description><subject>Baking</subject><subject>Decomposition</subject><subject>development loss</subject><subject>Esterification</subject><subject>PAC decomposition</subject><subject>Photopolymers</subject><subject>Photosensitivity</subject><subject>Polyimide resins</subject><subject>residual solvent</subject><subject>Solvents</subject><subject>Sulfonates</subject><issn>0914-9244</issn><issn>1349-6336</issn><issn>1349-6336</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2010</creationdate><recordtype>article</recordtype><recordid>eNplkFFLwzAQx4MoOKefwJeAL750Jk3arI861AkDB07wLaTpZctsm5pkwr69HRtD9OUOjt_v7vgjdE3JKOUFv-tWLrrO1dsG_ChlIyGyEzSgjBdJzlh-igakoDwpUs7P0UUIa0IYy7JigD7enIn4QX3adokfjQEdsWvxzMaVW3rVrazGc_DG-Ua1GnC5xXMXbLTfgBeuBTzfnQ7QHmbz_gnb2Aou0ZlRdYCrQx-i96fHxWSazF6fXyb3s0RneRETAVVWaJJSrgmQklOVgtbaUFIaqioAwjNBjNGVSMuqNFXZ41zkuhpDRkvBhuh2v7fz7msDIcrGBg11rVpwmyBpLmg6pmRMe_TmD7p2G9_230nKOc95Ica8p9ie0t6F4MHIzttG-a2kRO7Slr_TlimTfdq9Nd1b6xDVEo6O8tHqGv45-b706hHRK-UltOwH-OiT7A</recordid><startdate>20100101</startdate><enddate>20100101</enddate><creator>Yuba, Tomoyuki</creator><creator>Okuda, Ryoji</creator><creator>Tomikawa, Masao</creator><creator>Kim, Jae Hyun</creator><general>The Society of Photopolymer Science and Technology(SPST)</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20100101</creationdate><title>Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide</title><author>Yuba, Tomoyuki ; Okuda, Ryoji ; Tomikawa, Masao ; Kim, Jae Hyun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c569t-7ed59c0214c0e0b41a2ecccf10bf1adee04570ffcd72bdbfdb59c476cd8e51b73</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2010</creationdate><topic>Baking</topic><topic>Decomposition</topic><topic>development loss</topic><topic>Esterification</topic><topic>PAC decomposition</topic><topic>Photopolymers</topic><topic>Photosensitivity</topic><topic>Polyimide resins</topic><topic>residual solvent</topic><topic>Solvents</topic><topic>Sulfonates</topic><toplevel>online_resources</toplevel><creatorcontrib>Yuba, Tomoyuki</creatorcontrib><creatorcontrib>Okuda, Ryoji</creatorcontrib><creatorcontrib>Tomikawa, Masao</creatorcontrib><creatorcontrib>Kim, Jae Hyun</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of Photopolymer Science and Technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yuba, Tomoyuki</au><au>Okuda, Ryoji</au><au>Tomikawa, Masao</au><au>Kim, Jae Hyun</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide</atitle><jtitle>Journal of Photopolymer Science and Technology</jtitle><addtitle>J. Photopol. Sci. Technol.</addtitle><date>2010-01-01</date><risdate>2010</risdate><volume>23</volume><issue>6</issue><spage>775</spage><epage>779</epage><pages>775-779</pages><issn>0914-9244</issn><issn>1349-6336</issn><eissn>1349-6336</eissn><abstract>We investigated the soft baking condition effect on residual solvent amount, decomposition of photo sensitive diazonaphthoquinone group, photosensitivity, and development loss amount of positive photosensitive polyimide, which composed of partial esterified poly(amic acid) and photosensitive diazonaphthoquinone sulfonate. After soft baking, 10-14% of solvent was remained. Below 120°C baking, the naphthoquinone group was remained more than 90%. More than 40% of the naphthoquinone group was decomposed when 130°C baking. Photosensitivity seems to be determined by development loss of photosensitive polyimide. 120°C for 4min is suitable soft baking condition in this study.</abstract><cop>Hiratsuka</cop><pub>The Society of Photopolymer Science and Technology(SPST)</pub><doi>10.2494/photopolymer.23.775</doi><tpages>5</tpages><oa>free_for_read</oa></addata></record> |
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| subjects | Baking Decomposition development loss Esterification PAC decomposition Photopolymers Photosensitivity Polyimide resins residual solvent Solvents Sulfonates |
| title | Soft Baking Effect on Lithographic Performance by Positive Tone Photosensitive Polyimide |
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