Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

Wafer direct bonding refers to the process of adhesion of two flat mirror-polished wafers without using any intermediate gluing layers in ambient air or vacuum at room temperature. The adhesion of the two wafers occurs due to attractive long range van der Waals or hydrogen bonding forces. At room te...

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Veröffentlicht in:	Proceedings of the IEEE 2006-12, Vol.94 (12), p.2060-2106
Hauptverfasser:	Christiansen, Silke H., Singh, Rajendra, Gosele, Ulrich
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesive bonding Adhesives Annealing Applied sciences Bonded interface Bonding bonding energy Bonding forces complementary metal-oxide semiconductor (CMOS) Design. Technologies. Operation analysis. Testing Electronics Energy measurement Exact sciences and technology Fabrication hybrid substrates Hydrogen Integrated circuits layer transfer micro-/nano-electro-mechnical systems (M/NEMS) micro/nanoelectronics Microelectronic fabrication (materials and surfaces technology) Molecular electronics, nanoelectronics Nanocomposites Nanoelectronics Nanomaterials Nanostructure Power engineering and energy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices silicon-on-insulator (SOI) smart cut strained silicon-on-insulator (sSOI) Temperature Transistors twist bonding Wafer bonding wafer direct bonding Wafers
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