Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

► Demonstration of flexible COF and embedded CIF packages by WLP process. ► COF assembly had stable bending characteristic at 20 mm of static bending radius. ► Good 85 °C/85% RH reliability of CIF packages. ► Higher T g reduced Von Mises stress of CIF packages for better HTST reliability. Due to inc...

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Veröffentlicht in:	Microelectronics and reliability 2012, Vol.52 (1), p.225-234
Hauptverfasser:	Suk, Kyoung-Lim, Son, Ho-Young, Chung, Chang-Kyu, Kim, Joong Do, Lee, Jin-Woo, Paik, Kyung-Wook
Format:	Artikel
Sprache:	eng
Schlagworte:	Anisotropy Applied sciences Assembly Bend tests Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Finite element method Flexibility Integrated circuits Materials Packages Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Wafers Weight reduction
Online-Zugang:	Volltext
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