Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
► Demonstration of flexible COF and embedded CIF packages by WLP process. ► COF assembly had stable bending characteristic at 20 mm of static bending radius. ► Good 85 °C/85% RH reliability of CIF packages. ► Higher T g reduced Von Mises stress of CIF packages for better HTST reliability. Due to inc...
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| Veröffentlicht in: | Microelectronics and reliability 2012, Vol.52 (1), p.225-234 |
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| creator | Suk, Kyoung-Lim Son, Ho-Young Chung, Chang-Kyu Kim, Joong Do Lee, Jin-Woo Paik, Kyung-Wook |
| description | ► Demonstration of flexible COF and embedded CIF packages by WLP process. ► COF assembly had stable bending characteristic at 20
mm of static bending radius. ► Good 85
°C/85% RH reliability of CIF packages. ► Higher
T
g
reduced Von Mises stress of CIF packages for better HTST reliability.
Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in electronic devices, extensive studies on flexible electronic packages have been carried out. However, there has been little research on flexible packages by wafer level package (WLP) technology using anisotropic conductive films (ACFs) and flex substrates, an innovative packaging technology that requires fewer process steps and lower process temperature, and also provides flexible packages. This study demonstrated and evaluated the reliability of flexible packages that consisted of a flexible Chip-on-Flex (COF) assembly and embedded Chip-in-Flex (CIF) packages by applying a WLP process.
The WLP process was successfully performed for the cases of void-free ACF lamination on a 50
μm thin wafer, wafer dicing without ACF delamination, and a flip-chip assembly which showed stable bump contact resistances. The fabricated COF assembly was more flexible than the conventional COF whose chip thickness is about 700
μm. To evaluate the flexibility of the COF assembly, a static bending test was performed under different bending radiuses: 35
mm, 30
mm, 25
mm, and 20
mm. Adopting optimized bonding processes of COF assembly and Flex-on-Flex (FOF) assembly, CIF packages were then successfully fabricated. The reliability of the CIF packages was evaluated via a high temperature/humidity test (85
°C/85% RH) and high temperature storage test (HTST). From the reliability test results, the CIF packages showed excellent 85
°C/85% RH reliability. Furthermore, guideline of ACF material property was suggested by Finite Element Analysis (FEA) for better HTST reliability. |
| doi_str_mv | 10.1016/j.microrel.2011.08.003 |
| format | Article |
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mm of static bending radius. ► Good 85
°C/85% RH reliability of CIF packages. ► Higher
T
g
reduced Von Mises stress of CIF packages for better HTST reliability.
Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in electronic devices, extensive studies on flexible electronic packages have been carried out. However, there has been little research on flexible packages by wafer level package (WLP) technology using anisotropic conductive films (ACFs) and flex substrates, an innovative packaging technology that requires fewer process steps and lower process temperature, and also provides flexible packages. This study demonstrated and evaluated the reliability of flexible packages that consisted of a flexible Chip-on-Flex (COF) assembly and embedded Chip-in-Flex (CIF) packages by applying a WLP process.
The WLP process was successfully performed for the cases of void-free ACF lamination on a 50
μm thin wafer, wafer dicing without ACF delamination, and a flip-chip assembly which showed stable bump contact resistances. The fabricated COF assembly was more flexible than the conventional COF whose chip thickness is about 700
μm. To evaluate the flexibility of the COF assembly, a static bending test was performed under different bending radiuses: 35
mm, 30
mm, 25
mm, and 20
mm. Adopting optimized bonding processes of COF assembly and Flex-on-Flex (FOF) assembly, CIF packages were then successfully fabricated. The reliability of the CIF packages was evaluated via a high temperature/humidity test (85
°C/85% RH) and high temperature storage test (HTST). From the reliability test results, the CIF packages showed excellent 85
°C/85% RH reliability. Furthermore, guideline of ACF material property was suggested by Finite Element Analysis (FEA) for better HTST reliability.</description><identifier>ISSN: 0026-2714</identifier><identifier>EISSN: 1872-941X</identifier><identifier>DOI: 10.1016/j.microrel.2011.08.003</identifier><identifier>CODEN: MCRLAS</identifier><language>eng</language><publisher>Kidlington: Elsevier Ltd</publisher><subject>Anisotropy ; Applied sciences ; Assembly ; Bend tests ; Design. Technologies. Operation analysis. Testing ; Electronics ; Exact sciences and technology ; Finite element method ; Flexibility ; Integrated circuits ; Materials ; Packages ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Wafers ; Weight reduction</subject><ispartof>Microelectronics and reliability, 2012, Vol.52 (1), p.225-234</ispartof><rights>2011 Elsevier Ltd</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c375t-72ddb30b47c521486eff179ebd61bbbba28dd7b97163c39038a0cb90a574a3873</citedby><cites>FETCH-LOGICAL-c375t-72ddb30b47c521486eff179ebd61bbbba28dd7b97163c39038a0cb90a574a3873</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0026271411003635$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,4010,27900,27901,27902,65306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=25403883$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Suk, Kyoung-Lim</creatorcontrib><creatorcontrib>Son, Ho-Young</creatorcontrib><creatorcontrib>Chung, Chang-Kyu</creatorcontrib><creatorcontrib>Kim, Joong Do</creatorcontrib><creatorcontrib>Lee, Jin-Woo</creatorcontrib><creatorcontrib>Paik, Kyung-Wook</creatorcontrib><title>Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)</title><title>Microelectronics and reliability</title><description>► Demonstration of flexible COF and embedded CIF packages by WLP process. ► COF assembly had stable bending characteristic at 20
mm of static bending radius. ► Good 85
°C/85% RH reliability of CIF packages. ► Higher
T
g
reduced Von Mises stress of CIF packages for better HTST reliability.
Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in electronic devices, extensive studies on flexible electronic packages have been carried out. However, there has been little research on flexible packages by wafer level package (WLP) technology using anisotropic conductive films (ACFs) and flex substrates, an innovative packaging technology that requires fewer process steps and lower process temperature, and also provides flexible packages. This study demonstrated and evaluated the reliability of flexible packages that consisted of a flexible Chip-on-Flex (COF) assembly and embedded Chip-in-Flex (CIF) packages by applying a WLP process.
The WLP process was successfully performed for the cases of void-free ACF lamination on a 50
μm thin wafer, wafer dicing without ACF delamination, and a flip-chip assembly which showed stable bump contact resistances. The fabricated COF assembly was more flexible than the conventional COF whose chip thickness is about 700
μm. To evaluate the flexibility of the COF assembly, a static bending test was performed under different bending radiuses: 35
mm, 30
mm, 25
mm, and 20
mm. Adopting optimized bonding processes of COF assembly and Flex-on-Flex (FOF) assembly, CIF packages were then successfully fabricated. The reliability of the CIF packages was evaluated via a high temperature/humidity test (85
°C/85% RH) and high temperature storage test (HTST). From the reliability test results, the CIF packages showed excellent 85
°C/85% RH reliability. Furthermore, guideline of ACF material property was suggested by Finite Element Analysis (FEA) for better HTST reliability.</description><subject>Anisotropy</subject><subject>Applied sciences</subject><subject>Assembly</subject><subject>Bend tests</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Finite element method</subject><subject>Flexibility</subject><subject>Integrated circuits</subject><subject>Materials</subject><subject>Packages</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Wafers</subject><subject>Weight reduction</subject><issn>0026-2714</issn><issn>1872-941X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2012</creationdate><recordtype>article</recordtype><recordid>eNqFkU2P0zAQhi0EEmXhLyBfkNpDgu18OLmxiiisVGk5gOBm-WPSdXHiYKeF_pr9q-uou3tlJGukeZ-Zsf0i9J6SnBJafzzkg9XBB3A5I5TmpMkJKV6gFW04y9qS_nqJVoSwOmOclq_RmxgPhBCe2BW63zr4Z5UD3N3ZKfNjthTwurvdbrAcDYZBgTFgLrp91m-SPkn9W-4hYnXGcprc2Y57_Ff2ELCDE7gnAK9_7r5t8Az6bvTO78_4GBdUjjb6OfjJaqz9aI56tifAvXVDxOvrbhs3b9GrXroI7x7zFfqx_fy9-5rtbr_cdNe7TBe8mjPOjFEFUSXXFaNlU0PfU96CMjVVKSRrjOGq5bQudNGSopFEq5bIipeyaHhxhdaXuVPwf44QZzHYqME5OYI_RkFrTlk6VZnQ-oKmT48xQC-mYAcZzoISsTgiDuLJEbE4IkgjkiOp8cPjDhm1dH2Qo7bxuZtVZbpXs3CfLhykB58sBBG1hVGDsQH0LIy3_1v1AGoopPM</recordid><startdate>2012</startdate><enddate>2012</enddate><creator>Suk, Kyoung-Lim</creator><creator>Son, Ho-Young</creator><creator>Chung, Chang-Kyu</creator><creator>Kim, Joong Do</creator><creator>Lee, Jin-Woo</creator><creator>Paik, Kyung-Wook</creator><general>Elsevier Ltd</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>2012</creationdate><title>Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)</title><author>Suk, Kyoung-Lim ; Son, Ho-Young ; Chung, Chang-Kyu ; Kim, Joong Do ; Lee, Jin-Woo ; Paik, Kyung-Wook</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c375t-72ddb30b47c521486eff179ebd61bbbba28dd7b97163c39038a0cb90a574a3873</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Anisotropy</topic><topic>Applied sciences</topic><topic>Assembly</topic><topic>Bend tests</topic><topic>Design. Technologies. Operation analysis. Testing</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Finite element method</topic><topic>Flexibility</topic><topic>Integrated circuits</topic><topic>Materials</topic><topic>Packages</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Wafers</topic><topic>Weight reduction</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Suk, Kyoung-Lim</creatorcontrib><creatorcontrib>Son, Ho-Young</creatorcontrib><creatorcontrib>Chung, Chang-Kyu</creatorcontrib><creatorcontrib>Kim, Joong Do</creatorcontrib><creatorcontrib>Lee, Jin-Woo</creatorcontrib><creatorcontrib>Paik, Kyung-Wook</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Microelectronics and reliability</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Suk, Kyoung-Lim</au><au>Son, Ho-Young</au><au>Chung, Chang-Kyu</au><au>Kim, Joong Do</au><au>Lee, Jin-Woo</au><au>Paik, Kyung-Wook</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)</atitle><jtitle>Microelectronics and reliability</jtitle><date>2012</date><risdate>2012</risdate><volume>52</volume><issue>1</issue><spage>225</spage><epage>234</epage><pages>225-234</pages><issn>0026-2714</issn><eissn>1872-941X</eissn><coden>MCRLAS</coden><abstract>► Demonstration of flexible COF and embedded CIF packages by WLP process. ► COF assembly had stable bending characteristic at 20
mm of static bending radius. ► Good 85
°C/85% RH reliability of CIF packages. ► Higher
T
g
reduced Von Mises stress of CIF packages for better HTST reliability.
Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in electronic devices, extensive studies on flexible electronic packages have been carried out. However, there has been little research on flexible packages by wafer level package (WLP) technology using anisotropic conductive films (ACFs) and flex substrates, an innovative packaging technology that requires fewer process steps and lower process temperature, and also provides flexible packages. This study demonstrated and evaluated the reliability of flexible packages that consisted of a flexible Chip-on-Flex (COF) assembly and embedded Chip-in-Flex (CIF) packages by applying a WLP process.
The WLP process was successfully performed for the cases of void-free ACF lamination on a 50
μm thin wafer, wafer dicing without ACF delamination, and a flip-chip assembly which showed stable bump contact resistances. The fabricated COF assembly was more flexible than the conventional COF whose chip thickness is about 700
μm. To evaluate the flexibility of the COF assembly, a static bending test was performed under different bending radiuses: 35
mm, 30
mm, 25
mm, and 20
mm. Adopting optimized bonding processes of COF assembly and Flex-on-Flex (FOF) assembly, CIF packages were then successfully fabricated. The reliability of the CIF packages was evaluated via a high temperature/humidity test (85
°C/85% RH) and high temperature storage test (HTST). From the reliability test results, the CIF packages showed excellent 85
°C/85% RH reliability. Furthermore, guideline of ACF material property was suggested by Finite Element Analysis (FEA) for better HTST reliability.</abstract><cop>Kidlington</cop><pub>Elsevier Ltd</pub><doi>10.1016/j.microrel.2011.08.003</doi><tpages>10</tpages></addata></record> |
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| language | eng |
| recordid | cdi_proquest_miscellaneous_1671267154 |
| source | Elsevier ScienceDirect Journals |
| subjects | Anisotropy Applied sciences Assembly Bend tests Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Finite element method Flexibility Integrated circuits Materials Packages Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Wafers Weight reduction |
| title | Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) |
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