Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization

A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating...

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Veröffentlicht in:Journal of Photopolymer Science and Technology 2008/06/24, Vol.21(2), pp.219-224
Hauptverfasser: Okubo, Masaaki, Tahara, Mitsuru, Kuroki, Tomoyuki, Hibino, Toshitomo, Saeki, Noboru
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container_end_page 224
container_issue 2
container_start_page 219
container_title Journal of Photopolymer Science and Technology
container_volume 21
creator Okubo, Masaaki
Tahara, Mitsuru
Kuroki, Tomoyuki
Hibino, Toshitomo
Saeki, Noboru
description A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating on the treated PTFE (polytetrafluoroethylene) film is approximately 46 times greater than that on the untreated film. With scanning electron microscope analysis of the surface of the copper plating on the treated PTFE, it is confirmed that the hydrophilic surface of the treated film contributes to uniform copper plating.
doi_str_mv 10.2494/photopolymer.21.219
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subjects Copper plating
fluorocarbon polymer
Fluorocarbons
graft-polymerization
nonthermal plasma
Peeling
Plating
Polymeric films
Polymerization
Polytetrafluoroethylenes
Scanning electron microscopy
title Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization
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