Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization
A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating...
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Veröffentlicht in: | Journal of Photopolymer Science and Technology 2008/06/24, Vol.21(2), pp.219-224 |
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creator | Okubo, Masaaki Tahara, Mitsuru Kuroki, Tomoyuki Hibino, Toshitomo Saeki, Noboru |
description | A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating on the treated PTFE (polytetrafluoroethylene) film is approximately 46 times greater than that on the untreated film. With scanning electron microscope analysis of the surface of the copper plating on the treated PTFE, it is confirmed that the hydrophilic surface of the treated film contributes to uniform copper plating. |
doi_str_mv | 10.2494/photopolymer.21.219 |
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The results of the T-type peeling test show that the peeling strength of copper plating on the treated PTFE (polytetrafluoroethylene) film is approximately 46 times greater than that on the untreated film. With scanning electron microscope analysis of the surface of the copper plating on the treated PTFE, it is confirmed that the hydrophilic surface of the treated film contributes to uniform copper plating.</description><identifier>ISSN: 0914-9244</identifier><identifier>ISSN: 1349-6336</identifier><identifier>EISSN: 1349-6336</identifier><identifier>DOI: 10.2494/photopolymer.21.219</identifier><language>eng</language><publisher>Hiratsuka: The Society of Photopolymer Science and Technology(SPST)</publisher><subject>Copper plating ; fluorocarbon polymer ; Fluorocarbons ; graft-polymerization ; nonthermal plasma ; Peeling ; Plating ; Polymeric films ; Polymerization ; Polytetrafluoroethylenes ; Scanning electron microscopy</subject><ispartof>Journal of Photopolymer Science and Technology, 2008/06/24, Vol.21(2), pp.219-224</ispartof><rights>2008 The Society of Photopolymer Science and Technology (SPST)</rights><rights>Copyright Japan Science and Technology Agency 2008</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c568t-5aeb53578e9e856642ff48e5c5828216184d52c3cc2e5c1a84bf53c2f90fd84b3</citedby><cites>FETCH-LOGICAL-c568t-5aeb53578e9e856642ff48e5c5828216184d52c3cc2e5c1a84bf53c2f90fd84b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,1877,27903,27904</link.rule.ids></links><search><creatorcontrib>Okubo, Masaaki</creatorcontrib><creatorcontrib>Tahara, Mitsuru</creatorcontrib><creatorcontrib>Kuroki, Tomoyuki</creatorcontrib><creatorcontrib>Hibino, Toshitomo</creatorcontrib><creatorcontrib>Saeki, Noboru</creatorcontrib><title>Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization</title><title>Journal of Photopolymer Science and Technology</title><addtitle>J. Photopol. Sci. Technol.</addtitle><description>A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating on the treated PTFE (polytetrafluoroethylene) film is approximately 46 times greater than that on the untreated film. With scanning electron microscope analysis of the surface of the copper plating on the treated PTFE, it is confirmed that the hydrophilic surface of the treated film contributes to uniform copper plating.</description><subject>Copper plating</subject><subject>fluorocarbon polymer</subject><subject>Fluorocarbons</subject><subject>graft-polymerization</subject><subject>nonthermal plasma</subject><subject>Peeling</subject><subject>Plating</subject><subject>Polymeric films</subject><subject>Polymerization</subject><subject>Polytetrafluoroethylenes</subject><subject>Scanning electron microscopy</subject><issn>0914-9244</issn><issn>1349-6336</issn><issn>1349-6336</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2008</creationdate><recordtype>article</recordtype><recordid>eNplkU1LAzEQhoMoWD9-gZeAFy9bN59ujiJWBVEP9RzSOGm3ZDdrkj3UX29KVURhmGGG531nYBA6I_WUcsUvh1XIYQh-00GcUlJC7aEJYVxVkjG5jya1IrxSlPNDdJTSuq4ZE0JNUHrxJrf9Es_Brvrgw3KDXYh45scQgzVxEXr8snPGs9Z3Cb-mLX-du5CGFcTWVkOElMYI-Cn0uYw643HxTZ3Bd9G4_G3QfpRdoT9BB874BKdf9Ri9zm7nN_fV4_Pdw831Y2WFbHIlDCwEE1cNKGiElJw6xxsQVjS0oUSShr8Japm1tAyJafjCCWapU7V7Kw07Rhc73yGG9xFS1l2bLHhveghj0kReESppTeuCnv9B12GMfblOE8655JIpXii2o2wMKUVweohtZ-JGk1pvH6F_P0JTUkIV1f1OtU7ZLOFHY2JurYf_mu-kfhC7MlFDzz4BpUedCg</recordid><startdate>20080101</startdate><enddate>20080101</enddate><creator>Okubo, Masaaki</creator><creator>Tahara, Mitsuru</creator><creator>Kuroki, Tomoyuki</creator><creator>Hibino, Toshitomo</creator><creator>Saeki, Noboru</creator><general>The Society of Photopolymer Science and Technology(SPST)</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>7U5</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20080101</creationdate><title>Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization</title><author>Okubo, Masaaki ; Tahara, Mitsuru ; Kuroki, Tomoyuki ; Hibino, Toshitomo ; Saeki, Noboru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c568t-5aeb53578e9e856642ff48e5c5828216184d52c3cc2e5c1a84bf53c2f90fd84b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2008</creationdate><topic>Copper plating</topic><topic>fluorocarbon polymer</topic><topic>Fluorocarbons</topic><topic>graft-polymerization</topic><topic>nonthermal plasma</topic><topic>Peeling</topic><topic>Plating</topic><topic>Polymeric films</topic><topic>Polymerization</topic><topic>Polytetrafluoroethylenes</topic><topic>Scanning electron microscopy</topic><toplevel>online_resources</toplevel><creatorcontrib>Okubo, Masaaki</creatorcontrib><creatorcontrib>Tahara, Mitsuru</creatorcontrib><creatorcontrib>Kuroki, Tomoyuki</creatorcontrib><creatorcontrib>Hibino, Toshitomo</creatorcontrib><creatorcontrib>Saeki, Noboru</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of Photopolymer Science and Technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Okubo, Masaaki</au><au>Tahara, Mitsuru</au><au>Kuroki, Tomoyuki</au><au>Hibino, Toshitomo</au><au>Saeki, Noboru</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization</atitle><jtitle>Journal of Photopolymer Science and Technology</jtitle><addtitle>J. Photopol. Sci. Technol.</addtitle><date>2008-01-01</date><risdate>2008</risdate><volume>21</volume><issue>2</issue><spage>219</spage><epage>224</epage><pages>219-224</pages><issn>0914-9244</issn><issn>1349-6336</issn><eissn>1349-6336</eissn><abstract>A low-environmental load surface modification technique for plating the fluorocarbon polymers films is developed using an atmospheric-pressure argon and acrylic acid vapor nonthermal plasma graft polymerization. The results of the T-type peeling test show that the peeling strength of copper plating on the treated PTFE (polytetrafluoroethylene) film is approximately 46 times greater than that on the untreated film. With scanning electron microscope analysis of the surface of the copper plating on the treated PTFE, it is confirmed that the hydrophilic surface of the treated film contributes to uniform copper plating.</abstract><cop>Hiratsuka</cop><pub>The Society of Photopolymer Science and Technology(SPST)</pub><doi>10.2494/photopolymer.21.219</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Copper plating fluorocarbon polymer Fluorocarbons graft-polymerization nonthermal plasma Peeling Plating Polymeric films Polymerization Polytetrafluoroethylenes Scanning electron microscopy |
title | Plating Technology for Fluorocarbon Polymer Films Using Atmospheric-pressure Nonthermal Plasma Graft Polymerization |
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