Bondability of Cu wire on Cu substrate with Sn plating by ultrasonic

This study evaluated both the joint strength of copper wire on a copper substrate with tin plating and the joint reliability of copper wire bonding after heat treatment. The suitable tin thickness and bonding conditions, which are stage temperature, wire bonding power and bonding time, were chosen b...

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Veröffentlicht in:	Yōsetsu Gakkai ronbunshū 2010-01, Vol.28 (4), p.362-368
Hauptverfasser:	Fujiwara, Shinichi, Dauskardt, Reinhold H
Format:	Artikel
Sprache:	eng
Schlagworte:	BONDING Copper Copper plating Gold HEAT TREATING Heat treatment INTERMETALLIC COMPOUNDS Peel strength PEEL TESTS PLATING Tin ULTRASONICS WIRE
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