A new method for the hermeticity testing of wafer-level packaging

Until now, the determination of microelectronic packages hermeticity has been related to the MIL-STD-883 method 1014 which is based on the helium leak detection method. But this method is no longer suited for small packages due to the resolution limit of the apparatus. Indeed, leaks induced by nonhe...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Journal of micromechanics and microengineering 2010-02, Vol.20 (2), p.025031-025031
Hauptverfasser:	Lellouchi, Djemel, Dhennin, Jérémie, Lafontan, Xavier, Veyrie, David, Le Neal, Jean-François, Pressecq, Francis
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Deflection Electronics Exact sciences and technology Helium Instruments, apparatus, components and techniques common to several branches of physics and astronomy Leaks Mathematical analysis Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Micromechanics Packages Physics Precision engineering, watch making Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!