Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

Through-silicon vias (TSVs) using benzocyclobutene (BCB)-liners as the insulator have the potential for reducing the TSV capacitances and the thermal expansion stresses. This paper reports the assessments of BCB-liner TSVs with respect to thermal and electrical properties. The C-V and I-V characteri...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2014-12, Vol.4 (12), p.1936-1946
Hauptverfasser:	Huang, Cui, Pan, Liyang, Liu, Ran, Wang, Zheyao
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integration Assessments benzocyclobutene (BCB) Capacitance Dielectrics Electrical properties Insulators Integrated circuits Interconnections Leakage current Packaging Reliability Silicon Thermal cycling Thermal expansion Thermal properties Thermal stability through-silicon via (TSV) Through-silicon vias
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