The failure analysis and lifetime prediction for the solder joint of the magnetic head

Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling e...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Applied physics. A, Materials science & processing Materials science & processing, 2015-02, Vol.118 (2), p.691-697
Hauptverfasser:	Xiao, Xianghui, Peng, Minfang, Cardoso, Jaime S., Tang, Rongjun, Zhou, YingLiang
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Characterization and Evaluation of Materials Condensed Matter Physics Constants Failure analysis Machines Manufacturing Mathematical models Methodology Nanotechnology Optical and Electronic Materials Permissible error Physics Physics and Astronomy Processes Sliders Solders Surfaces and Interfaces Thin Films
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!