The failure analysis and lifetime prediction for the solder joint of the magnetic head
Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling e...
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| Veröffentlicht in: | Applied physics. A, Materials science & processing Materials science & processing, 2015-02, Vol.118 (2), p.691-697 |
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| container_title | Applied physics. A, Materials science & processing |
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| creator | Xiao, Xianghui Peng, Minfang Cardoso, Jaime S. Tang, Rongjun Zhou, YingLiang |
| description | Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. And the diffusion constant under work condition 60 °C is 0.015354; the solder lifetime t is 14.46 years . |
| doi_str_mv | 10.1007/s00339-014-8781-9 |
| format | Article |
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By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. 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A, Materials science & processing</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Xiao, Xianghui</au><au>Peng, Minfang</au><au>Cardoso, Jaime S.</au><au>Tang, Rongjun</au><au>Zhou, YingLiang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The failure analysis and lifetime prediction for the solder joint of the magnetic head</atitle><jtitle>Applied physics. A, Materials science & processing</jtitle><stitle>Appl. Phys. A</stitle><date>2015-02-01</date><risdate>2015</risdate><volume>118</volume><issue>2</issue><spage>691</spage><epage>697</epage><pages>691-697</pages><issn>0947-8396</issn><eissn>1432-0630</eissn><abstract>Micro-solder joint (MSJ) lifetime prediction methodology and failure analysis (FA) are to assess reliability by fatigue model with a series of theoretical calculations, numerical simulation and experimental method. Due to shortened time of solder joints on high-temperature, high-frequency sampling error that is not allowed in productions may exist in various models, including round-off error. Combining intermetallic compound (IMC) growth theory and the FA technology for the magnetic head in actual production, this thesis puts forward a new growth model to predict life expectancy for solder joint of the magnetic head. And the impact of IMC, generating from interface reaction between slider (magnetic head, usually be called slider) and bonding pad, on mechanical performance during aging process is analyzed in it. By further researching on FA of solder ball bonding, thesis chooses AuSn4 growth model that affects least to solder joint mechanical property to indicate that the IMC methodology is suitable to forecast the solder lifetime. 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| source | Springer Nature - Complete Springer Journals |
| subjects | Bonding Characterization and Evaluation of Materials Condensed Matter Physics Constants Failure analysis Machines Manufacturing Mathematical models Methodology Nanotechnology Optical and Electronic Materials Permissible error Physics Physics and Astronomy Processes Sliders Solders Surfaces and Interfaces Thin Films |
| title | The failure analysis and lifetime prediction for the solder joint of the magnetic head |
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