Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation
We present roll-to-roll printing compatible techniques for manufacturing organic thin film transistors using two separately processed foils that are laminated together. The introduction of heat-assisted lamination opens up possibilities for material and processing combinations. The lamination of two...
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Veröffentlicht in: | Thin solid films 2014-11, Vol.571, p.212-217 |
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creator | Hassinen, Tomi Ruotsalainen, Teemu Laakso, Petri Penttilä, Raimo Sandberg, Henrik G.O. |
description | We present roll-to-roll printing compatible techniques for manufacturing organic thin film transistors using two separately processed foils that are laminated together. The introduction of heat-assisted lamination opens up possibilities for material and processing combinations. The lamination of two separately processed substrates together will allow usage of pre-patterned electrodes on both substrates and materials with non-compatible solvents. Also, the surface microstructure is formed differently when laminating dry films together compared to film formation from liquid phase. Demonstrator transistors, inverters and ring oscillators were produced using lamination techniques. Finally, a roll-to-roll compatible lamination concept is proposed where also the source and drain electrodes are patterned by laser ablation. The demonstrator transistors have shown very good lifetime in air, which is contributed partly to the good material combination and partly to the enhanced interface formation in heat-assisted lamination process.
•A roll-to-roll compatible lamination technique for printed electronics is proposed.•Laser ablation allows highly defined metal top and bottom electrodes.•Method opens up processing possibilities for incompatible materials and solvents.•Shearing forces may enhance molecular orientation and packing.•An air stable polymer transistor is demonstrated with a lifetime of years. |
doi_str_mv | 10.1016/j.tsf.2014.10.086 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1660093212</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0040609014010578</els_id><sourcerecordid>1660093212</sourcerecordid><originalsourceid>FETCH-LOGICAL-c360t-2d1eb47463a570ce3fdcd66c14deee0618bc1a23112f5e632405fd70417c522b3</originalsourceid><addsrcrecordid>eNp9kEFvFDEMhSMEEkvhB3DLBYlDZ7GTmcyuOKGqpZUqIaH2HGUyTptVJlmSLKL_vlm24sjJ8tPzs_0x9hFhjYDqy25di1sLwL71a9ioV2yFm3HbiVHia7YC6KFTsIW37F0pOwBAIeSK_fmZQuhq6nKr3KZlb6qfAvGUH0z0ltdHH7nzYeE1m1h8qSnzxcSDM7Yeso8PvJJ9jP7Xgfj0xPdNqk0958EsPra0FM-5iXPrC2VupvBXe8_eOBMKfXipZ-z-6vLu4rq7_fH95uLbbWelgtqJGWnqx15JM4xgSbrZzkpZ7GciAoWbyaIRElG4gZQUPQxuHqHH0Q5CTPKMfT7l7nNqJ5aqF18shWAipUPRqBTAVgoUzYonq82plExOt2cWk580gj5S1jvdKOsj5aPUKLeZTy_xplgTXGNkffk3KLYwyEFsmu_ryUft19-esi7WU7Q0-0y26jn5_2x5Buh_lDk</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1660093212</pqid></control><display><type>article</type><title>Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation</title><source>Elsevier ScienceDirect Journals Complete</source><creator>Hassinen, Tomi ; Ruotsalainen, Teemu ; Laakso, Petri ; Penttilä, Raimo ; Sandberg, Henrik G.O.</creator><creatorcontrib>Hassinen, Tomi ; Ruotsalainen, Teemu ; Laakso, Petri ; Penttilä, Raimo ; Sandberg, Henrik G.O.</creatorcontrib><description>We present roll-to-roll printing compatible techniques for manufacturing organic thin film transistors using two separately processed foils that are laminated together. The introduction of heat-assisted lamination opens up possibilities for material and processing combinations. The lamination of two separately processed substrates together will allow usage of pre-patterned electrodes on both substrates and materials with non-compatible solvents. Also, the surface microstructure is formed differently when laminating dry films together compared to film formation from liquid phase. Demonstrator transistors, inverters and ring oscillators were produced using lamination techniques. Finally, a roll-to-roll compatible lamination concept is proposed where also the source and drain electrodes are patterned by laser ablation. The demonstrator transistors have shown very good lifetime in air, which is contributed partly to the good material combination and partly to the enhanced interface formation in heat-assisted lamination process.
•A roll-to-roll compatible lamination technique for printed electronics is proposed.•Laser ablation allows highly defined metal top and bottom electrodes.•Method opens up processing possibilities for incompatible materials and solvents.•Shearing forces may enhance molecular orientation and packing.•An air stable polymer transistor is demonstrated with a lifetime of years.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/j.tsf.2014.10.086</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Applied sciences ; Compatibility ; Condensed matter: structure, mechanical and thermal properties ; Cross-disciplinary physics: materials science; rheology ; Electrodes ; Electronics ; Exact sciences and technology ; Foils ; Formations ; Lamination ; Laser ablation ; Laser deposition ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Organic transistor ; Physics ; Printed electronics ; Printing ; Roll-to-roll ; Semiconductor devices ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Structure and morphology; thickness ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thin film structure and morphology ; Thin film transistors ; Transistors</subject><ispartof>Thin solid films, 2014-11, Vol.571, p.212-217</ispartof><rights>2014 Elsevier B.V.</rights><rights>2015 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c360t-2d1eb47463a570ce3fdcd66c14deee0618bc1a23112f5e632405fd70417c522b3</citedby><cites>FETCH-LOGICAL-c360t-2d1eb47463a570ce3fdcd66c14deee0618bc1a23112f5e632405fd70417c522b3</cites><orcidid>0000-0002-2367-5639</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.tsf.2014.10.086$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27922,27923,45993</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=29053528$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Hassinen, Tomi</creatorcontrib><creatorcontrib>Ruotsalainen, Teemu</creatorcontrib><creatorcontrib>Laakso, Petri</creatorcontrib><creatorcontrib>Penttilä, Raimo</creatorcontrib><creatorcontrib>Sandberg, Henrik G.O.</creatorcontrib><title>Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation</title><title>Thin solid films</title><description>We present roll-to-roll printing compatible techniques for manufacturing organic thin film transistors using two separately processed foils that are laminated together. The introduction of heat-assisted lamination opens up possibilities for material and processing combinations. The lamination of two separately processed substrates together will allow usage of pre-patterned electrodes on both substrates and materials with non-compatible solvents. Also, the surface microstructure is formed differently when laminating dry films together compared to film formation from liquid phase. Demonstrator transistors, inverters and ring oscillators were produced using lamination techniques. Finally, a roll-to-roll compatible lamination concept is proposed where also the source and drain electrodes are patterned by laser ablation. The demonstrator transistors have shown very good lifetime in air, which is contributed partly to the good material combination and partly to the enhanced interface formation in heat-assisted lamination process.
•A roll-to-roll compatible lamination technique for printed electronics is proposed.•Laser ablation allows highly defined metal top and bottom electrodes.•Method opens up processing possibilities for incompatible materials and solvents.•Shearing forces may enhance molecular orientation and packing.•An air stable polymer transistor is demonstrated with a lifetime of years.</description><subject>Applied sciences</subject><subject>Compatibility</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electrodes</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Foils</subject><subject>Formations</subject><subject>Lamination</subject><subject>Laser ablation</subject><subject>Laser deposition</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Organic transistor</subject><subject>Physics</subject><subject>Printed electronics</subject><subject>Printing</subject><subject>Roll-to-roll</subject><subject>Semiconductor devices</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Structure and morphology; thickness</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thin film structure and morphology</subject><subject>Thin film transistors</subject><subject>Transistors</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNp9kEFvFDEMhSMEEkvhB3DLBYlDZ7GTmcyuOKGqpZUqIaH2HGUyTptVJlmSLKL_vlm24sjJ8tPzs_0x9hFhjYDqy25di1sLwL71a9ioV2yFm3HbiVHia7YC6KFTsIW37F0pOwBAIeSK_fmZQuhq6nKr3KZlb6qfAvGUH0z0ltdHH7nzYeE1m1h8qSnzxcSDM7Yeso8PvJJ9jP7Xgfj0xPdNqk0958EsPra0FM-5iXPrC2VupvBXe8_eOBMKfXipZ-z-6vLu4rq7_fH95uLbbWelgtqJGWnqx15JM4xgSbrZzkpZ7GciAoWbyaIRElG4gZQUPQxuHqHH0Q5CTPKMfT7l7nNqJ5aqF18shWAipUPRqBTAVgoUzYonq82plExOt2cWk580gj5S1jvdKOsj5aPUKLeZTy_xplgTXGNkffk3KLYwyEFsmu_ryUft19-esi7WU7Q0-0y26jn5_2x5Buh_lDk</recordid><startdate>20141128</startdate><enddate>20141128</enddate><creator>Hassinen, Tomi</creator><creator>Ruotsalainen, Teemu</creator><creator>Laakso, Petri</creator><creator>Penttilä, Raimo</creator><creator>Sandberg, Henrik G.O.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7SR</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>JG9</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-2367-5639</orcidid></search><sort><creationdate>20141128</creationdate><title>Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation</title><author>Hassinen, Tomi ; Ruotsalainen, Teemu ; Laakso, Petri ; Penttilä, Raimo ; Sandberg, Henrik G.O.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c360t-2d1eb47463a570ce3fdcd66c14deee0618bc1a23112f5e632405fd70417c522b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Applied sciences</topic><topic>Compatibility</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electrodes</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Foils</topic><topic>Formations</topic><topic>Lamination</topic><topic>Laser ablation</topic><topic>Laser deposition</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Organic transistor</topic><topic>Physics</topic><topic>Printed electronics</topic><topic>Printing</topic><topic>Roll-to-roll</topic><topic>Semiconductor devices</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Structure and morphology; thickness</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thin film structure and morphology</topic><topic>Thin film transistors</topic><topic>Transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hassinen, Tomi</creatorcontrib><creatorcontrib>Ruotsalainen, Teemu</creatorcontrib><creatorcontrib>Laakso, Petri</creatorcontrib><creatorcontrib>Penttilä, Raimo</creatorcontrib><creatorcontrib>Sandberg, Henrik G.O.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hassinen, Tomi</au><au>Ruotsalainen, Teemu</au><au>Laakso, Petri</au><au>Penttilä, Raimo</au><au>Sandberg, Henrik G.O.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation</atitle><jtitle>Thin solid films</jtitle><date>2014-11-28</date><risdate>2014</risdate><volume>571</volume><spage>212</spage><epage>217</epage><pages>212-217</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>We present roll-to-roll printing compatible techniques for manufacturing organic thin film transistors using two separately processed foils that are laminated together. The introduction of heat-assisted lamination opens up possibilities for material and processing combinations. The lamination of two separately processed substrates together will allow usage of pre-patterned electrodes on both substrates and materials with non-compatible solvents. Also, the surface microstructure is formed differently when laminating dry films together compared to film formation from liquid phase. Demonstrator transistors, inverters and ring oscillators were produced using lamination techniques. Finally, a roll-to-roll compatible lamination concept is proposed where also the source and drain electrodes are patterned by laser ablation. The demonstrator transistors have shown very good lifetime in air, which is contributed partly to the good material combination and partly to the enhanced interface formation in heat-assisted lamination process.
•A roll-to-roll compatible lamination technique for printed electronics is proposed.•Laser ablation allows highly defined metal top and bottom electrodes.•Method opens up processing possibilities for incompatible materials and solvents.•Shearing forces may enhance molecular orientation and packing.•An air stable polymer transistor is demonstrated with a lifetime of years.</abstract><cop>Amsterdam</cop><pub>Elsevier B.V</pub><doi>10.1016/j.tsf.2014.10.086</doi><tpages>6</tpages><orcidid>https://orcid.org/0000-0002-2367-5639</orcidid></addata></record> |
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subjects | Applied sciences Compatibility Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Electrodes Electronics Exact sciences and technology Foils Formations Lamination Laser ablation Laser deposition Materials science Methods of deposition of films and coatings film growth and epitaxy Organic transistor Physics Printed electronics Printing Roll-to-roll Semiconductor devices Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology Thin film transistors Transistors |
title | Roll-to-roll compatible organic thin film transistor manufacturing technique by printing, lamination, and laser ablation |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T02%3A16%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Roll-to-roll%20compatible%20organic%20thin%20film%20transistor%20manufacturing%20technique%20by%20printing,%20lamination,%20and%20laser%20ablation&rft.jtitle=Thin%20solid%20films&rft.au=Hassinen,%20Tomi&rft.date=2014-11-28&rft.volume=571&rft.spage=212&rft.epage=217&rft.pages=212-217&rft.issn=0040-6090&rft.eissn=1879-2731&rft.coden=THSFAP&rft_id=info:doi/10.1016/j.tsf.2014.10.086&rft_dat=%3Cproquest_cross%3E1660093212%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1660093212&rft_id=info:pmid/&rft_els_id=S0040609014010578&rfr_iscdi=true |