Experience with 3D integration technologies in the framework of the ATLAS pixel detector upgrade for the HL-LHC

3D technologies are investigated for the upgrade of the ATLAS pixel detector at the HL-LHC. R&D focuses on both, IC design in 3D, as well as on post-processing 3D technologies such as Through Silicon Via (TSV). The first one uses a so-called via first technology, featuring the insertion of small...

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Veröffentlicht in:	Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Accelerators, spectrometers, detectors and associated equipment, 2013-12, Vol.731, p.97-102
Hauptverfasser:	Aruntinov, D., Barbero, M., Gonella, L., Hemperek, T., Hügging, F., Krüger, H., Wermes, N., Breugnon, P., Chantepie, B., Clemens, J.C., Fei, R., Fougeron, D., Godiot, S., Pangaud, P., Rozanov, A., Garcia-Sciveres, M., Mekkaoui, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	3D electronics Accelerators Detectors Etching HL-LHC Insertion Large Hadron Collider Pixel detector Pixels Silicon Three dimensional TSV Upgrading
Online-Zugang:	Volltext
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