Computer study of the removal of Cu from the graphene surface using Ar clusters
[Display omitted] •The Ar13 bombardment of copper film on graphene has been simulated using molecular dynamics.•Incident angle θ=45° is the most effective one for graphene cleaning of copper.•Local stresses in graphene relax slowly due to the presence of hard bonds.•Cluster bombardment of the target...
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Veröffentlicht in: | Computational materials science 2015-02, Vol.98, p.123-128 |
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creator | Galashev, Alexander Y. |
description | [Display omitted]
•The Ar13 bombardment of copper film on graphene has been simulated using molecular dynamics.•Incident angle θ=45° is the most effective one for graphene cleaning of copper.•Local stresses in graphene relax slowly due to the presence of hard bonds.•Cluster bombardment of the target leads to the large surface roughness of graphene.
The method of molecular dynamics has been used to study the bombardment of a copper film on supported graphene by Ar13 clusters with kinetic energies of 5, 10, 20 and 30eV and different angles of incidence. It is obtained that the cluster energy should be in the interval 20–30eV for effective graphene cleaning. There is no cleaning effect at vertical incidence (θ=0°) of Ar13 clusters. The bombardments at 45° and 90° incident angles are the most effective ones at a moderate and big amount of deposited copper respectively. |
doi_str_mv | 10.1016/j.commatsci.2014.11.002 |
format | Article |
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•The Ar13 bombardment of copper film on graphene has been simulated using molecular dynamics.•Incident angle θ=45° is the most effective one for graphene cleaning of copper.•Local stresses in graphene relax slowly due to the presence of hard bonds.•Cluster bombardment of the target leads to the large surface roughness of graphene.
The method of molecular dynamics has been used to study the bombardment of a copper film on supported graphene by Ar13 clusters with kinetic energies of 5, 10, 20 and 30eV and different angles of incidence. It is obtained that the cluster energy should be in the interval 20–30eV for effective graphene cleaning. There is no cleaning effect at vertical incidence (θ=0°) of Ar13 clusters. The bombardments at 45° and 90° incident angles are the most effective ones at a moderate and big amount of deposited copper respectively.</description><identifier>ISSN: 0927-0256</identifier><identifier>EISSN: 1879-0801</identifier><identifier>DOI: 10.1016/j.commatsci.2014.11.002</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>Argon cluster bombardment ; Bombardment ; Cleaning ; Clusters ; Copper ; Copper film ; Deposition ; Graphene ; Incidence ; Kinetic energy</subject><ispartof>Computational materials science, 2015-02, Vol.98, p.123-128</ispartof><rights>2014 Elsevier B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c348t-fc6b3dabb851aaf36e2f0bea677471fbfc3757298d8ee0aed2ce3223528ea43f3</citedby><cites>FETCH-LOGICAL-c348t-fc6b3dabb851aaf36e2f0bea677471fbfc3757298d8ee0aed2ce3223528ea43f3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.commatsci.2014.11.002$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>315,781,785,3551,27929,27930,46000</link.rule.ids></links><search><creatorcontrib>Galashev, Alexander Y.</creatorcontrib><title>Computer study of the removal of Cu from the graphene surface using Ar clusters</title><title>Computational materials science</title><description>[Display omitted]
•The Ar13 bombardment of copper film on graphene has been simulated using molecular dynamics.•Incident angle θ=45° is the most effective one for graphene cleaning of copper.•Local stresses in graphene relax slowly due to the presence of hard bonds.•Cluster bombardment of the target leads to the large surface roughness of graphene.
The method of molecular dynamics has been used to study the bombardment of a copper film on supported graphene by Ar13 clusters with kinetic energies of 5, 10, 20 and 30eV and different angles of incidence. It is obtained that the cluster energy should be in the interval 20–30eV for effective graphene cleaning. There is no cleaning effect at vertical incidence (θ=0°) of Ar13 clusters. The bombardments at 45° and 90° incident angles are the most effective ones at a moderate and big amount of deposited copper respectively.</description><subject>Argon cluster bombardment</subject><subject>Bombardment</subject><subject>Cleaning</subject><subject>Clusters</subject><subject>Copper</subject><subject>Copper film</subject><subject>Deposition</subject><subject>Graphene</subject><subject>Incidence</subject><subject>Kinetic energy</subject><issn>0927-0256</issn><issn>1879-0801</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNqFkMtOwzAQRS0EEqXwDXjJJsGPJHaWVcRLqtQNrC3HGbepkrjYcSX-HpcitqxGM7r3SHMQuqckp4RWj_vcuHHUczB9zggtckpzQtgFWlAp6oxIQi_RgtRMZISV1TW6CWFPUrOWbIE2jRsPcQaPwxy7L-wsnneAPYzuqIfT2kRsvRt_zluvDzuYAIforTaAY-inLV55bIYYEiXcoiurhwB3v3OJPp6f3pvXbL15eWtW68zwQs6ZNVXLO922sqRaW14Bs6QFXQlRCGpba7goBatlJwGIho4Z4IzxkknQBbd8iR7O3IN3nxHCrMY-GBgGPYGLQdGqIqQsEyFFxTlqvAvBg1UH34_afylK1Emh2qs_heqkUFGqksLUXJ2bkD459uBVSsBkoOs9mFl1rv-X8Q3AJX_E</recordid><startdate>20150215</startdate><enddate>20150215</enddate><creator>Galashev, Alexander Y.</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>20150215</creationdate><title>Computer study of the removal of Cu from the graphene surface using Ar clusters</title><author>Galashev, Alexander Y.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c348t-fc6b3dabb851aaf36e2f0bea677471fbfc3757298d8ee0aed2ce3223528ea43f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Argon cluster bombardment</topic><topic>Bombardment</topic><topic>Cleaning</topic><topic>Clusters</topic><topic>Copper</topic><topic>Copper film</topic><topic>Deposition</topic><topic>Graphene</topic><topic>Incidence</topic><topic>Kinetic energy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Galashev, Alexander Y.</creatorcontrib><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>Computational materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Galashev, Alexander Y.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Computer study of the removal of Cu from the graphene surface using Ar clusters</atitle><jtitle>Computational materials science</jtitle><date>2015-02-15</date><risdate>2015</risdate><volume>98</volume><spage>123</spage><epage>128</epage><pages>123-128</pages><issn>0927-0256</issn><eissn>1879-0801</eissn><abstract>[Display omitted]
•The Ar13 bombardment of copper film on graphene has been simulated using molecular dynamics.•Incident angle θ=45° is the most effective one for graphene cleaning of copper.•Local stresses in graphene relax slowly due to the presence of hard bonds.•Cluster bombardment of the target leads to the large surface roughness of graphene.
The method of molecular dynamics has been used to study the bombardment of a copper film on supported graphene by Ar13 clusters with kinetic energies of 5, 10, 20 and 30eV and different angles of incidence. It is obtained that the cluster energy should be in the interval 20–30eV for effective graphene cleaning. There is no cleaning effect at vertical incidence (θ=0°) of Ar13 clusters. The bombardments at 45° and 90° incident angles are the most effective ones at a moderate and big amount of deposited copper respectively.</abstract><pub>Elsevier B.V</pub><doi>10.1016/j.commatsci.2014.11.002</doi><tpages>6</tpages></addata></record> |
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subjects | Argon cluster bombardment Bombardment Cleaning Clusters Copper Copper film Deposition Graphene Incidence Kinetic energy |
title | Computer study of the removal of Cu from the graphene surface using Ar clusters |
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