P.12: Development of Post-annealing Method for Flexible Oxide TFTs Application
Microwave annealing was used instead of furnace annealing to post‐treat a nitridated amorphous InGaZnO thin film transistor (a‐IGZO:N TFT), and obviously improved its electrical performance and reliability. This performance of a‐IGZO:N TFT with microwave annealing process of 300s is well competitive...
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Veröffentlicht in: | SID International Symposium Digest of technical papers 2013-06, Vol.44 (1), p.1026-1028 |
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creator | Fuh, Chur-Shyang Liu, Po-Tsun Teng, Li-Feng Fan, Yang-Shun Chang, Chih-Hsiang Wu, Yu-Ta Huang, Sih-Wei Shieh, Han-Ping D. |
description | Microwave annealing was used instead of furnace annealing to post‐treat a nitridated amorphous InGaZnO thin film transistor (a‐IGZO:N TFT), and obviously improved its electrical performance and reliability. This performance of a‐IGZO:N TFT with microwave annealing process of 300s is well competitive with its counterpart with furnace annealing at 350°C for 1 hr. Owing to its low thermal budget and selective heating to materials of interest, microwave annealing is highly promising for flexible oxide TFTs application. |
doi_str_mv | 10.1002/j.2168-0159.2013.tb06397.x |
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Owing to its low thermal budget and selective heating to materials of interest, microwave annealing is highly promising for flexible oxide TFTs application.</description><subject>Annealing</subject><subject>Budgeting</subject><subject>Furnaces</subject><subject>Heating</subject><subject>Microwaves</subject><subject>Oxides</subject><subject>Semiconductor devices</subject><subject>Thin film transistors</subject><issn>0097-966X</issn><issn>2168-0159</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqVkE1P3DAQhq2KSiy0_8FqL1wSxrEdx5xAC0srvlZiK7hZ3uykePHGIc7S8O-baBGH3nqakeZ5X40eQr4xSBlAdrxOM5YXCTCp0wwYT7sl5FyrtP9EJh-nPTIB0CrRef64Tw5iXANwLoSekNt5yrITeo6v6EOzwbqjoaLzELvE1jVa7-rf9Aa7p7CiVWjpzGPvlh7pXe9WSBezRaRnTeNdaTsX6i_kc2V9xK_v85D8ml0spj-S67vLn9Oz66TMQKmEWVtqlVlVZcJKzhiggCXylS2GnWcFk1hwDcgtCisqWa4UKAGol1KrgvFDcrTrbdrwssXYmY2LJXpvawzbaFieA0guWTGg3_9B12Hb1sN3A8ULIQvgYqBOdlTZhhhbrEzTuo1t3wwDM6o2azP6NKNPM6o276pNP4RPd-E_zuPbfyTN_fliPq5DRbKrcLHD_qPCts8mV1xJ83B7aaaPV-IG-JW5538BscWTEQ</recordid><startdate>201306</startdate><enddate>201306</enddate><creator>Fuh, Chur-Shyang</creator><creator>Liu, Po-Tsun</creator><creator>Teng, Li-Feng</creator><creator>Fan, Yang-Shun</creator><creator>Chang, Chih-Hsiang</creator><creator>Wu, Yu-Ta</creator><creator>Huang, Sih-Wei</creator><creator>Shieh, Han-Ping D.</creator><general>Blackwell Publishing Ltd</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SP</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>7SR</scope><scope>JG9</scope></search><sort><creationdate>201306</creationdate><title>P.12: Development of Post-annealing Method for Flexible Oxide TFTs Application</title><author>Fuh, Chur-Shyang ; Liu, Po-Tsun ; Teng, Li-Feng ; Fan, Yang-Shun ; Chang, Chih-Hsiang ; Wu, Yu-Ta ; Huang, Sih-Wei ; Shieh, Han-Ping D.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2077-1aac972a7f24a53110e40be3da811032815e8390e3ae4a4f5cd70740e9b597813</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Annealing</topic><topic>Budgeting</topic><topic>Furnaces</topic><topic>Heating</topic><topic>Microwaves</topic><topic>Oxides</topic><topic>Semiconductor devices</topic><topic>Thin film transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fuh, Chur-Shyang</creatorcontrib><creatorcontrib>Liu, Po-Tsun</creatorcontrib><creatorcontrib>Teng, Li-Feng</creatorcontrib><creatorcontrib>Fan, Yang-Shun</creatorcontrib><creatorcontrib>Chang, Chih-Hsiang</creatorcontrib><creatorcontrib>Wu, Yu-Ta</creatorcontrib><creatorcontrib>Huang, Sih-Wei</creatorcontrib><creatorcontrib>Shieh, Han-Ping D.</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Engineered Materials Abstracts</collection><collection>Materials Research Database</collection><jtitle>SID International Symposium Digest of technical papers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fuh, Chur-Shyang</au><au>Liu, Po-Tsun</au><au>Teng, Li-Feng</au><au>Fan, Yang-Shun</au><au>Chang, Chih-Hsiang</au><au>Wu, Yu-Ta</au><au>Huang, Sih-Wei</au><au>Shieh, Han-Ping D.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>P.12: Development of Post-annealing Method for Flexible Oxide TFTs Application</atitle><jtitle>SID International Symposium Digest of technical papers</jtitle><date>2013-06</date><risdate>2013</risdate><volume>44</volume><issue>1</issue><spage>1026</spage><epage>1028</epage><pages>1026-1028</pages><issn>0097-966X</issn><eissn>2168-0159</eissn><abstract>Microwave annealing was used instead of furnace annealing to post‐treat a nitridated amorphous InGaZnO thin film transistor (a‐IGZO:N TFT), and obviously improved its electrical performance and reliability. This performance of a‐IGZO:N TFT with microwave annealing process of 300s is well competitive with its counterpart with furnace annealing at 350°C for 1 hr. Owing to its low thermal budget and selective heating to materials of interest, microwave annealing is highly promising for flexible oxide TFTs application.</abstract><cop>Oxford, UK</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1002/j.2168-0159.2013.tb06397.x</doi><tpages>3</tpages></addata></record> |
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subjects | Annealing Budgeting Furnaces Heating Microwaves Oxides Semiconductor devices Thin film transistors |
title | P.12: Development of Post-annealing Method for Flexible Oxide TFTs Application |
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