Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder
In the present study, nano-sized ZnO particle-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900°C for 2h. The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC3...
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| Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 2014-11, Vol.618, p.389-397 |
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| container_title | Materials science & engineering. A, Structural materials : properties, microstructure and processing |
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| creator | El-Daly, A.A. Elmosalami, T.A. Desoky, W.M. El-Shaarawy, M.G. Abdraboh, A.M. |
| description | In the present study, nano-sized ZnO particle-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900°C for 2h. The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC305 solder were explored. Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing both the β-Sn grain size and spacing between Ag3Sn and Cu6Sn5 particles. The refined microstructure, which resulted in a strong adsorption effect and high surface-free energy of ZnO nanoparticles, could obstruct the dislocation slipping, and thus provides classical dispersion strengthening mechanism. This apparently enhances the yield stress (0.2%YS) and ultimate tensile strength (UTS) of SAC(305)–0.7%ZnO composite solder, whereas its ductility is lower than that of the SAC305 solder. In addition, ZnO particles keep the melting temperature of composite solder nearly at the SAC305 level although the pasty range is decreased. Empirical equations for 0.2% YS, UTS and elastic modulus E with the strain rate have been developed and the predicted tensile parameters for both solders are reasonably close to the present experimental data. |
| doi_str_mv | 10.1016/j.msea.2014.09.028 |
| format | Article |
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The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC305 solder were explored. Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing both the β-Sn grain size and spacing between Ag3Sn and Cu6Sn5 particles. The refined microstructure, which resulted in a strong adsorption effect and high surface-free energy of ZnO nanoparticles, could obstruct the dislocation slipping, and thus provides classical dispersion strengthening mechanism. This apparently enhances the yield stress (0.2%YS) and ultimate tensile strength (UTS) of SAC(305)–0.7%ZnO composite solder, whereas its ductility is lower than that of the SAC305 solder. In addition, ZnO particles keep the melting temperature of composite solder nearly at the SAC305 level although the pasty range is decreased. Empirical equations for 0.2% YS, UTS and elastic modulus E with the strain rate have been developed and the predicted tensile parameters for both solders are reasonably close to the present experimental data.</description><identifier>ISSN: 0921-5093</identifier><identifier>EISSN: 1873-4936</identifier><identifier>DOI: 10.1016/j.msea.2014.09.028</identifier><language>eng</language><publisher>Kidlington: Elsevier B.V</publisher><subject>Applied sciences ; Brazing. Soldering ; Condensed matter: structure, mechanical and thermal properties ; Cross-disciplinary physics: materials science; rheology ; Dislocations ; Elasticity. Plasticity ; Exact sciences and technology ; Joining, thermal cutting: metallurgical aspects ; Lead-free composite solders ; Materials science ; Mechanical properties ; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology ; Melting ; Metals. Metallurgy ; Microstructure ; Nanoscale materials and structures: fabrication and characterization ; Nanostructure ; Other topics in nanoscale materials and structures ; Particulate composites ; Physics ; Solders ; Solid surfaces and solid-solid interfaces ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Tin ; Zinc oxide</subject><ispartof>Materials science & engineering. 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A, Structural materials : properties, microstructure and processing</title><description>In the present study, nano-sized ZnO particle-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900°C for 2h. The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC305 solder were explored. Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing both the β-Sn grain size and spacing between Ag3Sn and Cu6Sn5 particles. The refined microstructure, which resulted in a strong adsorption effect and high surface-free energy of ZnO nanoparticles, could obstruct the dislocation slipping, and thus provides classical dispersion strengthening mechanism. This apparently enhances the yield stress (0.2%YS) and ultimate tensile strength (UTS) of SAC(305)–0.7%ZnO composite solder, whereas its ductility is lower than that of the SAC305 solder. In addition, ZnO particles keep the melting temperature of composite solder nearly at the SAC305 level although the pasty range is decreased. Empirical equations for 0.2% YS, UTS and elastic modulus E with the strain rate have been developed and the predicted tensile parameters for both solders are reasonably close to the present experimental data.</description><subject>Applied sciences</subject><subject>Brazing. Soldering</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Dislocations</subject><subject>Elasticity. Plasticity</subject><subject>Exact sciences and technology</subject><subject>Joining, thermal cutting: metallurgical aspects</subject><subject>Lead-free composite solders</subject><subject>Materials science</subject><subject>Mechanical properties</subject><subject>Mechanical properties and methods of testing. Rheology. Fracture mechanics. 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Metallurgy</subject><subject>Microstructure</subject><subject>Nanoscale materials and structures: fabrication and characterization</subject><subject>Nanostructure</subject><subject>Other topics in nanoscale materials and structures</subject><subject>Particulate composites</subject><subject>Physics</subject><subject>Solders</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Tin</subject><subject>Zinc oxide</subject><issn>0921-5093</issn><issn>1873-4936</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNp9kM2KFDEUhYMo2La-gKtsBDdV3qS6Ugm4GRp_BgZm4bhxE9LJzZgmlbRJ9cCIC9_BN_RJJk0PLl2dxT3nXM5HyGsGPQMm3u37uaLpObBND6oHLp-QFZPT0G3UIJ6SFSjOuhHU8Jy8qHUP0JwwrsivG0w1RKQOfS6zWUJOdIffzV3IhZrk6IxxCemWHko-YFnuafY0mZS7Gn6io9_SNT2YsgQbsdKCIbUe2w5f0t_ff4YeLm6bQj9ujzSicZ0viLTm6LC8JM-8iRVfPeqafP344Wb7ubu6_nS5vbjq7CCGpZvGySrjcZomsTPc7NxGTtLxAZlHJ4U3QlnHUQjgoJSTTI0O-eiVl8wbM6zJ23Nv2_DjiHXRc6gWYzQJ87Fq1pIwCBCiWfnZakuutaDXhxJmU-41A31Crff6hFqfUGtQuqFuoTeP_aZaE30xyYb6L8mllLBp7Nfk_dmHbexdwKKrDZgarVDQLtrl8L83D0qQl7s</recordid><startdate>20141117</startdate><enddate>20141117</enddate><creator>El-Daly, A.A.</creator><creator>Elmosalami, T.A.</creator><creator>Desoky, W.M.</creator><creator>El-Shaarawy, M.G.</creator><creator>Abdraboh, A.M.</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20141117</creationdate><title>Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder</title><author>El-Daly, A.A. ; Elmosalami, T.A. ; Desoky, W.M. ; El-Shaarawy, M.G. ; Abdraboh, A.M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c363t-757c9afe7776ba2abd4878d23e1fed86fa69cd2e6602099d8195de25f9f81faa3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Applied sciences</topic><topic>Brazing. 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A, Structural materials : properties, microstructure and processing</jtitle><date>2014-11-17</date><risdate>2014</risdate><volume>618</volume><spage>389</spage><epage>397</epage><pages>389-397</pages><issn>0921-5093</issn><eissn>1873-4936</eissn><abstract>In the present study, nano-sized ZnO particle-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900°C for 2h. The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC305 solder were explored. Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing both the β-Sn grain size and spacing between Ag3Sn and Cu6Sn5 particles. The refined microstructure, which resulted in a strong adsorption effect and high surface-free energy of ZnO nanoparticles, could obstruct the dislocation slipping, and thus provides classical dispersion strengthening mechanism. This apparently enhances the yield stress (0.2%YS) and ultimate tensile strength (UTS) of SAC(305)–0.7%ZnO composite solder, whereas its ductility is lower than that of the SAC305 solder. In addition, ZnO particles keep the melting temperature of composite solder nearly at the SAC305 level although the pasty range is decreased. Empirical equations for 0.2% YS, UTS and elastic modulus E with the strain rate have been developed and the predicted tensile parameters for both solders are reasonably close to the present experimental data.</abstract><cop>Kidlington</cop><pub>Elsevier B.V</pub><doi>10.1016/j.msea.2014.09.028</doi><tpages>9</tpages></addata></record> |
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| subjects | Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Dislocations Elasticity. Plasticity Exact sciences and technology Joining, thermal cutting: metallurgical aspects Lead-free composite solders Materials science Mechanical properties Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Melting Metals. Metallurgy Microstructure Nanoscale materials and structures: fabrication and characterization Nanostructure Other topics in nanoscale materials and structures Particulate composites Physics Solders Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Tin Zinc oxide |
| title | Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder |
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