Controlled electropolishing of copper foils at elevated temperature

•Electrochemical polishing of copper foils at elevated temperature in H3PO4 electrolytes.•Copper foils electropolished at 65°C in 2.17M H3PO4 exhibited a lower surface roughness.•New prospects for the preparation of copper foils before the growth of high quality graphene layers. We have studied the...

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Veröffentlicht in:Applied surface science 2014-07, Vol.307, p.731-735
Hauptverfasser: Kwon, Gi Duk, Kim, Young Woo, Moyen, Eric, Keum, Dong Hoon, Lee, Young Hee, Baik, Seunghyun, Pribat, Didier
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Sprache:eng
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