Controlled electropolishing of copper foils at elevated temperature
•Electrochemical polishing of copper foils at elevated temperature in H3PO4 electrolytes.•Copper foils electropolished at 65°C in 2.17M H3PO4 exhibited a lower surface roughness.•New prospects for the preparation of copper foils before the growth of high quality graphene layers. We have studied the...
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Veröffentlicht in: | Applied surface science 2014-07, Vol.307, p.731-735 |
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Hauptverfasser: | , , , , , , |
Format: | Artikel |
Sprache: | eng |
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