Etching and Post-Treatment Surface Stability of Track-Etched Polycarbonate Membranes by Plasma Processing Using Various Related Oxidizing Plasma Systems

Oxidizing plasmas (O2, CO2, H2O (g), and formic acid (g)) were used to modify track‐etched polycarbonate (PC) membranes and explore the mechanisms and species responsible for etching. Etch rates were measured using scanning electron microscopy; modified surfaces were characterized with X‐ray photoel...

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Veröffentlicht in:	Plasma processes and polymers 2014-09, Vol.11 (9), p.850-863
Hauptverfasser:	Tompkins, Brendan D., Dennison, Jordan M., Fisher, Ellen R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Carbon dioxide Contact angle Etching Formic acid Membranes Optical emission spectroscopy Oxidation Plasma etching plasma surface modification polycarbonate Polycarbonates polymer etching Spectrum analysis track-etched membrane
Online-Zugang:	Volltext
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