Parasitic Consideration of Package Design within Press Pack IGBT

Simulation technology provides a powerful tool for the package design. Parasitic are one of the most important factors for press pack IGBT. By the aid of the simulation software, the package parasitic is extracted and the current distribution among paralleled chips is analyzed. Simulation results co...

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Veröffentlicht in:Applied Mechanics and Materials 2013-10, Vol.433-435 (Advances in Mechatronics and Control Engineering II), p.1782-1785
Hauptverfasser: Yu, Kun Shan, Zhang, Yu, Jin, Rui, Che, Jia Jie, Liu, Jun, Han, Rong Gang, Bao, Hai Long, Liu, Wen Guang, Su, Ying Ying, Zhang, Peng
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Sprache:eng
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Zusammenfassung:Simulation technology provides a powerful tool for the package design. Parasitic are one of the most important factors for press pack IGBT. By the aid of the simulation software, the package parasitic is extracted and the current distribution among paralleled chips is analyzed. Simulation results confirm the theoretical analysis and verify the efficacy of the new approach.
ISSN:1660-9336
1662-7482
1662-7482
DOI:10.4028/www.scientific.net/AMM.433-435.1782