A Cu-Pd-V System Filler Alloy for Silicon Nitride Ceramic Joining and the Interfacial Reactions

A Cu–Pd–V brazing alloy with the composition of Cu–(38.0~42.0)Pd–(7.0~10.0)V (in wt.%) was designed as a filler for joining Si3N4. Its wettability on Si3N4 ceramic was measured with the sessile drop method. It was shown that the Cu–Pd–V alloy gave a contact angle of 71° at 1473 K. The filler alloy w...

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Veröffentlicht in:	Journal of the American Ceramic Society 2014-08, Vol.97 (8), p.2447-2454
Hauptverfasser:	Xiong, Hua-Ping, Chen, Bo, Pan, Yu, Zhao, Hai-Sheng, Mao, Wei, Cheng, Yao-Yong
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Brazed joints Ceramics Chemical reactions Copper Copper base alloys Fillers Interface reactions Microscopy Palladium Silicon nitride Solid solutions
Online-Zugang:	Volltext
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