Parameters optimization of electroless deposition of Cu on Cr-coated diamond
Electroless copper plating on diamond particles precoated with 1% Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by...
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| Veröffentlicht in: | Transactions of Nonferrous Metals Society of China 2014-01, Vol.24 (1), p.136-145 |
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| container_title | Transactions of Nonferrous Metals Society of China |
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| creator | NIAZI, A.R. LI, Shu-kui WANG, Ying-chun LIU, Jin-xu HU, Zhi-yu USMAN, Zahid |
| description | Electroless copper plating on diamond particles precoated with 1% Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20% NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 °C, pH=13 and stirring at (350±15) r/min under ultrasonication. |
| doi_str_mv | 10.1016/S1003-6326(14)63039-9 |
| format | Article |
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The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20% NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 °C, pH=13 and stirring at (350±15) r/min under ultrasonication.</description><identifier>ISSN: 1003-6326</identifier><identifier>DOI: 10.1016/S1003-6326(14)63039-9</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Activation ; Chromium ; Coating ; COATINGS ; Copper ; Cr-coated diamond ; Diamonds ; Electroless copper plating ; ELECTROLESS PLATING ; Etching ; parameter optimization ; PLATING ; X RAYS</subject><ispartof>Transactions of Nonferrous Metals Society of China, 2014-01, Vol.24 (1), p.136-145</ispartof><rights>2014 The Nonferrous Metals Society of China</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c342t-2f46a05c9fdb1e08819fb368f14c58bb03b582e3da8930d63c90fac07217d2663</citedby><cites>FETCH-LOGICAL-c342t-2f46a05c9fdb1e08819fb368f14c58bb03b582e3da8930d63c90fac07217d2663</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S1003632614630399$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,776,780,3537,27901,27902,65534</link.rule.ids></links><search><creatorcontrib>NIAZI, A.R.</creatorcontrib><creatorcontrib>LI, Shu-kui</creatorcontrib><creatorcontrib>WANG, Ying-chun</creatorcontrib><creatorcontrib>LIU, Jin-xu</creatorcontrib><creatorcontrib>HU, Zhi-yu</creatorcontrib><creatorcontrib>USMAN, Zahid</creatorcontrib><title>Parameters optimization of electroless deposition of Cu on Cr-coated diamond</title><title>Transactions of Nonferrous Metals Society of China</title><description>Electroless copper plating on diamond particles precoated with 1% Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20% NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 °C, pH=13 and stirring at (350±15) r/min under ultrasonication.</description><subject>Activation</subject><subject>Chromium</subject><subject>Coating</subject><subject>COATINGS</subject><subject>Copper</subject><subject>Cr-coated diamond</subject><subject>Diamonds</subject><subject>Electroless copper plating</subject><subject>ELECTROLESS PLATING</subject><subject>Etching</subject><subject>parameter optimization</subject><subject>PLATING</subject><subject>X RAYS</subject><issn>1003-6326</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNqFkE9LxDAQxXNQcF39CEKP66E6adq0OYkU_8GCgnoOaTKBSNvUJCvop7e7q149zTDz3oP3I-SMwgUFyi-fKQDLOSv4ipbnnAETuTggi7_zETmO8Q2gLDmnC7J-UkENmDDEzE_JDe5LJefHzNsMe9Qp-B5jzAxOPrrfT7vJ5qUNufYqocmMU4MfzQk5tKqPePozl-T19ualvc_Xj3cP7fU616wsUl7YkiuotLCmowhNQ4XtGG8sLXXVdB2wrmoKZEY1goHhTAuwSkNd0NoUnLMlWe1zp-DfNxiTHFzU2PdqRL-Jkla8hprWopml1V6qg48xoJVTcIMKn5KC3BKTO2Jyi0bSUu6ISTH7rvY-nHt8OAwyaoejRuPCTEUa7_5J-AYxfHTg</recordid><startdate>201401</startdate><enddate>201401</enddate><creator>NIAZI, A.R.</creator><creator>LI, Shu-kui</creator><creator>WANG, Ying-chun</creator><creator>LIU, Jin-xu</creator><creator>HU, Zhi-yu</creator><creator>USMAN, Zahid</creator><general>Elsevier Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>201401</creationdate><title>Parameters optimization of electroless deposition of Cu on Cr-coated diamond</title><author>NIAZI, A.R. ; LI, Shu-kui ; WANG, Ying-chun ; LIU, Jin-xu ; HU, Zhi-yu ; USMAN, Zahid</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c342t-2f46a05c9fdb1e08819fb368f14c58bb03b582e3da8930d63c90fac07217d2663</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Activation</topic><topic>Chromium</topic><topic>Coating</topic><topic>COATINGS</topic><topic>Copper</topic><topic>Cr-coated diamond</topic><topic>Diamonds</topic><topic>Electroless copper plating</topic><topic>ELECTROLESS PLATING</topic><topic>Etching</topic><topic>parameter optimization</topic><topic>PLATING</topic><topic>X RAYS</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>NIAZI, A.R.</creatorcontrib><creatorcontrib>LI, Shu-kui</creatorcontrib><creatorcontrib>WANG, Ying-chun</creatorcontrib><creatorcontrib>LIU, Jin-xu</creatorcontrib><creatorcontrib>HU, Zhi-yu</creatorcontrib><creatorcontrib>USMAN, Zahid</creatorcontrib><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Transactions of Nonferrous Metals Society of China</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>NIAZI, A.R.</au><au>LI, Shu-kui</au><au>WANG, Ying-chun</au><au>LIU, Jin-xu</au><au>HU, Zhi-yu</au><au>USMAN, Zahid</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Parameters optimization of electroless deposition of Cu on Cr-coated diamond</atitle><jtitle>Transactions of Nonferrous Metals Society of China</jtitle><date>2014-01</date><risdate>2014</risdate><volume>24</volume><issue>1</issue><spage>136</spage><epage>145</epage><pages>136-145</pages><issn>1003-6326</issn><abstract>Electroless copper plating on diamond particles precoated with 1% Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20% NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4·5H2O, 35 mL/L formaldehyde (HCHO), 23 g/L KNaC4H4O6 at 60 °C, pH=13 and stirring at (350±15) r/min under ultrasonication.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/S1003-6326(14)63039-9</doi><tpages>10</tpages></addata></record> |
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| source | Elsevier ScienceDirect Journals; Alma/SFX Local Collection |
| subjects | Activation Chromium Coating COATINGS Copper Cr-coated diamond Diamonds Electroless copper plating ELECTROLESS PLATING Etching parameter optimization PLATING X RAYS |
| title | Parameters optimization of electroless deposition of Cu on Cr-coated diamond |
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