Local damage simulations of printed circuit boards based on in-plane cohesive zone parameters
Purpose - The purpose of this paper is to analyse, in a finite element simulation, the failure of a multilayer printed circuit board (PCB), exposed to an impact load, to better evaluate the reliability and lifetime. Thereby the focus was set on failures in the outermost epoxy layer.Design methodolog...
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| Veröffentlicht in: | Circuit world 2013-05, Vol.39 (2), p.60-66 |
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| container_title | Circuit world |
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| creator | Filipp Fuchs, Peter Fellner, Klaus Pinter, Gerald |
| description | Purpose - The purpose of this paper is to analyse, in a finite element simulation, the failure of a multilayer printed circuit board (PCB), exposed to an impact load, to better evaluate the reliability and lifetime. Thereby the focus was set on failures in the outermost epoxy layer.Design methodology approach - The fracture behaviour of the affected material was characterized. The parameters of a cohesive zone law were determined by performing a double cantilever beam test and a corresponding simulation. The cohesive zone law was used in an enriched finite element local simulation model to predict the crack initiation and crack propagation. Using the determined location of the initial crack, the energy release rate at the crack tip was calculated, allowing an evaluation of the local loading situation.Findings - A good concurrence between the simulated and the experimentally observed failure pattern was observed. Calculating the energy release rate of two example PCBs, the significant influence of the chosen type on the local failure behaviour was proven.Originality value - The work presented in this paper allows for the simulation and evaluation of failure in the outermost epoxy layers of printed circuit boards due to impact loads. |
| doi_str_mv | 10.1108/03056121311315774 |
| format | Article |
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Thereby the focus was set on failures in the outermost epoxy layer.Design methodology approach - The fracture behaviour of the affected material was characterized. The parameters of a cohesive zone law were determined by performing a double cantilever beam test and a corresponding simulation. The cohesive zone law was used in an enriched finite element local simulation model to predict the crack initiation and crack propagation. Using the determined location of the initial crack, the energy release rate at the crack tip was calculated, allowing an evaluation of the local loading situation.Findings - A good concurrence between the simulated and the experimentally observed failure pattern was observed. 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Thereby the focus was set on failures in the outermost epoxy layer.Design methodology approach - The fracture behaviour of the affected material was characterized. The parameters of a cohesive zone law were determined by performing a double cantilever beam test and a corresponding simulation. The cohesive zone law was used in an enriched finite element local simulation model to predict the crack initiation and crack propagation. Using the determined location of the initial crack, the energy release rate at the crack tip was calculated, allowing an evaluation of the local loading situation.Findings - A good concurrence between the simulated and the experimentally observed failure pattern was observed. 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| subjects | Boards Cohesion Computer simulation Copper Crack initiation Crack propagation Epoxy resins Experiments Failure Failure analysis Finite element analysis Fracture mechanics Lifetime Mathematical models Printed circuit boards Printed circuits Simulation Stress concentration Studies |
| title | Local damage simulations of printed circuit boards based on in-plane cohesive zone parameters |
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