Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets
We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-st...
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Veröffentlicht in: | Soft matter 2013-01, Vol.9 (33), p.7942-795 |
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creator | Lopes, Marcus C Bonaccurso, Elmar |
description | We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called
coffee-staining
. The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a
coffee stain
- decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction.
Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called
coffee-staining
. |
doi_str_mv | 10.1039/c3sm51184g |
format | Article |
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coffee-staining
. The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a
coffee stain
- decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction.
Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called
coffee-staining
.</description><identifier>ISSN: 1744-683X</identifier><identifier>EISSN: 1744-6848</identifier><identifier>DOI: 10.1039/c3sm51184g</identifier><language>eng</language><subject>Contact ; Contact angle ; Droplets ; Elasticity ; Evaporation ; Friction ; Liquids ; Modulus of elasticity</subject><ispartof>Soft matter, 2013-01, Vol.9 (33), p.7942-795</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</citedby><cites>FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids></links><search><creatorcontrib>Lopes, Marcus C</creatorcontrib><creatorcontrib>Bonaccurso, Elmar</creatorcontrib><title>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</title><title>Soft matter</title><description>We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called
coffee-staining
. The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a
coffee stain
- decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction.
Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called
coffee-staining
.</description><subject>Contact</subject><subject>Contact angle</subject><subject>Droplets</subject><subject>Elasticity</subject><subject>Evaporation</subject><subject>Friction</subject><subject>Liquids</subject><subject>Modulus of elasticity</subject><issn>1744-683X</issn><issn>1744-6848</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp9kM1LAzEQxRdRsFYv3oV4E2E1abIfOUrxo1DwouBtycdsiWw3MZNV-t-7tVJvnmbmze-9w8uyc0ZvGOXy1nBcF4zVYnWQTVglRF7Woj7c7_ztODtBfKeU14KVkwwXfdsN0BsgviU4aExRJSDQKUzOuLQhvidBxfHogFgIHl1yP1pKEHskbfRrAp8q-NHp-hX5GgNijq5zRo2RGKDHrcNGHzpIeJodtapDOPud0-z14f5l_pQvnx8X87tlbnhVp1xbKa1WVOiCq7KagWBypjkX0gKvdEVb0MaClbOqZKwsKC1ta4SlhumqliWfZle73BD9xwCYmrVDA12nevADNqwoZFkUgsoRvd6hJnrECG0ToluruGkYbbbNNn_NjvDlDo5o9tzfvwm2HZmL_xj-DaxahVs</recordid><startdate>20130101</startdate><enddate>20130101</enddate><creator>Lopes, Marcus C</creator><creator>Bonaccurso, Elmar</creator><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20130101</creationdate><title>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</title><author>Lopes, Marcus C ; Bonaccurso, Elmar</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Contact</topic><topic>Contact angle</topic><topic>Droplets</topic><topic>Elasticity</topic><topic>Evaporation</topic><topic>Friction</topic><topic>Liquids</topic><topic>Modulus of elasticity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lopes, Marcus C</creatorcontrib><creatorcontrib>Bonaccurso, Elmar</creatorcontrib><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Soft matter</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lopes, Marcus C</au><au>Bonaccurso, Elmar</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</atitle><jtitle>Soft matter</jtitle><date>2013-01-01</date><risdate>2013</risdate><volume>9</volume><issue>33</issue><spage>7942</spage><epage>795</epage><pages>7942-795</pages><issn>1744-683X</issn><eissn>1744-6848</eissn><abstract>We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called
coffee-staining
. The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a
coffee stain
- decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction.
Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called
coffee-staining
.</abstract><doi>10.1039/c3sm51184g</doi><tpages>9</tpages></addata></record> |
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source | Royal Society Of Chemistry Journals 2008-; Alma/SFX Local Collection |
subjects | Contact Contact angle Droplets Elasticity Evaporation Friction Liquids Modulus of elasticity |
title | Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets |
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