Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets

We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-st...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Soft matter 2013-01, Vol.9 (33), p.7942-795
Hauptverfasser: Lopes, Marcus C, Bonaccurso, Elmar
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 795
container_issue 33
container_start_page 7942
container_title Soft matter
container_volume 9
creator Lopes, Marcus C
Bonaccurso, Elmar
description We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-staining . The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a coffee stain - decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction. Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called coffee-staining .
doi_str_mv 10.1039/c3sm51184g
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1559655409</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1559655409</sourcerecordid><originalsourceid>FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</originalsourceid><addsrcrecordid>eNp9kM1LAzEQxRdRsFYv3oV4E2E1abIfOUrxo1DwouBtycdsiWw3MZNV-t-7tVJvnmbmze-9w8uyc0ZvGOXy1nBcF4zVYnWQTVglRF7Woj7c7_ztODtBfKeU14KVkwwXfdsN0BsgviU4aExRJSDQKUzOuLQhvidBxfHogFgIHl1yP1pKEHskbfRrAp8q-NHp-hX5GgNijq5zRo2RGKDHrcNGHzpIeJodtapDOPud0-z14f5l_pQvnx8X87tlbnhVp1xbKa1WVOiCq7KagWBypjkX0gKvdEVb0MaClbOqZKwsKC1ta4SlhumqliWfZle73BD9xwCYmrVDA12nevADNqwoZFkUgsoRvd6hJnrECG0ToluruGkYbbbNNn_NjvDlDo5o9tzfvwm2HZmL_xj-DaxahVs</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1559655409</pqid></control><display><type>article</type><title>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</title><source>Royal Society Of Chemistry Journals 2008-</source><source>Alma/SFX Local Collection</source><creator>Lopes, Marcus C ; Bonaccurso, Elmar</creator><creatorcontrib>Lopes, Marcus C ; Bonaccurso, Elmar</creatorcontrib><description>We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-staining . The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a coffee stain - decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction. Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called coffee-staining .</description><identifier>ISSN: 1744-683X</identifier><identifier>EISSN: 1744-6848</identifier><identifier>DOI: 10.1039/c3sm51184g</identifier><language>eng</language><subject>Contact ; Contact angle ; Droplets ; Elasticity ; Evaporation ; Friction ; Liquids ; Modulus of elasticity</subject><ispartof>Soft matter, 2013-01, Vol.9 (33), p.7942-795</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</citedby><cites>FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27903,27904</link.rule.ids></links><search><creatorcontrib>Lopes, Marcus C</creatorcontrib><creatorcontrib>Bonaccurso, Elmar</creatorcontrib><title>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</title><title>Soft matter</title><description>We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-staining . The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a coffee stain - decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction. Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called coffee-staining .</description><subject>Contact</subject><subject>Contact angle</subject><subject>Droplets</subject><subject>Elasticity</subject><subject>Evaporation</subject><subject>Friction</subject><subject>Liquids</subject><subject>Modulus of elasticity</subject><issn>1744-683X</issn><issn>1744-6848</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp9kM1LAzEQxRdRsFYv3oV4E2E1abIfOUrxo1DwouBtycdsiWw3MZNV-t-7tVJvnmbmze-9w8uyc0ZvGOXy1nBcF4zVYnWQTVglRF7Woj7c7_ztODtBfKeU14KVkwwXfdsN0BsgviU4aExRJSDQKUzOuLQhvidBxfHogFgIHl1yP1pKEHskbfRrAp8q-NHp-hX5GgNijq5zRo2RGKDHrcNGHzpIeJodtapDOPud0-z14f5l_pQvnx8X87tlbnhVp1xbKa1WVOiCq7KagWBypjkX0gKvdEVb0MaClbOqZKwsKC1ta4SlhumqliWfZle73BD9xwCYmrVDA12nevADNqwoZFkUgsoRvd6hJnrECG0ToluruGkYbbbNNn_NjvDlDo5o9tzfvwm2HZmL_xj-DaxahVs</recordid><startdate>20130101</startdate><enddate>20130101</enddate><creator>Lopes, Marcus C</creator><creator>Bonaccurso, Elmar</creator><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20130101</creationdate><title>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</title><author>Lopes, Marcus C ; Bonaccurso, Elmar</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c378t-bd99dba04b53a672e4192b3349de37b70febcded92761165006dfc4d0c1b78963</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Contact</topic><topic>Contact angle</topic><topic>Droplets</topic><topic>Elasticity</topic><topic>Evaporation</topic><topic>Friction</topic><topic>Liquids</topic><topic>Modulus of elasticity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lopes, Marcus C</creatorcontrib><creatorcontrib>Bonaccurso, Elmar</creatorcontrib><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Soft matter</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lopes, Marcus C</au><au>Bonaccurso, Elmar</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets</atitle><jtitle>Soft matter</jtitle><date>2013-01-01</date><risdate>2013</risdate><volume>9</volume><issue>33</issue><spage>7942</spage><epage>795</epage><pages>7942-795</pages><issn>1744-683X</issn><eissn>1744-6848</eissn><abstract>We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-staining . The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the pattern - which is an important characterizing parameter of a coffee stain - decreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction. Substrate elasticity was employed to control the evaporation patterns of droplets of water-silica suspensions and for reducing the so-called coffee-staining .</abstract><doi>10.1039/c3sm51184g</doi><tpages>9</tpages></addata></record>
fulltext fulltext
identifier ISSN: 1744-683X
ispartof Soft matter, 2013-01, Vol.9 (33), p.7942-795
issn 1744-683X
1744-6848
language eng
recordid cdi_proquest_miscellaneous_1559655409
source Royal Society Of Chemistry Journals 2008-; Alma/SFX Local Collection
subjects Contact
Contact angle
Droplets
Elasticity
Evaporation
Friction
Liquids
Modulus of elasticity
title Influence of substrate elasticity on particle deposition patterns from evaporating water-silica suspension droplets
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T07%3A36%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Influence%20of%20substrate%20elasticity%20on%20particle%20deposition%20patterns%20from%20evaporating%20water-silica%20suspension%20droplets&rft.jtitle=Soft%20matter&rft.au=Lopes,%20Marcus%20C&rft.date=2013-01-01&rft.volume=9&rft.issue=33&rft.spage=7942&rft.epage=795&rft.pages=7942-795&rft.issn=1744-683X&rft.eissn=1744-6848&rft_id=info:doi/10.1039/c3sm51184g&rft_dat=%3Cproquest_cross%3E1559655409%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1559655409&rft_id=info:pmid/&rfr_iscdi=true