X-band dual channel transmit/receive module using heterojunction multilayer substrate
ABSTRACT This article presents a X‐band dual channel transmit/receive (T/R) Module for AESA radar applications. Instead of the conventional low temperature cofired ceramic technology, we suggested the heterojunction (Ceramic + FR4) multilayer substrate. This structure makes a simple T/R Module fabri...
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| Veröffentlicht in: | Microwave and optical technology letters 2014-08, Vol.56 (8), p.1850-1854 |
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| container_issue | 8 |
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| container_title | Microwave and optical technology letters |
| container_volume | 56 |
| creator | Jang, Sung-Hoon Nam, Byung-Chang Kim, Jong-Phil Kim, and Seon-Joo |
| description | ABSTRACT
This article presents a X‐band dual channel transmit/receive (T/R) Module for AESA radar applications. Instead of the conventional low temperature cofired ceramic technology, we suggested the heterojunction (Ceramic + FR4) multilayer substrate. This structure makes a simple T/R Module fabrication process with low cost. Dual channel allows reducing the size and weight of the T/R Module. Substrates has RF cavities to attach each MMIC chips. RF cavity has a subcover to seal the MMIC and to give an additional area for charging capacitors. The T/R Module's output power is 10 W, efficiency 23%, and noise figure is under 3 dB. © 2014 Wiley Periodicals, Inc. Microwave Opt Technol Lett 56:1850–1854, 2014 |
| doi_str_mv | 10.1002/mop.28470 |
| format | Article |
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This article presents a X‐band dual channel transmit/receive (T/R) Module for AESA radar applications. Instead of the conventional low temperature cofired ceramic technology, we suggested the heterojunction (Ceramic + FR4) multilayer substrate. This structure makes a simple T/R Module fabrication process with low cost. Dual channel allows reducing the size and weight of the T/R Module. Substrates has RF cavities to attach each MMIC chips. RF cavity has a subcover to seal the MMIC and to give an additional area for charging capacitors. The T/R Module's output power is 10 W, efficiency 23%, and noise figure is under 3 dB. © 2014 Wiley Periodicals, Inc. Microwave Opt Technol Lett 56:1850–1854, 2014</description><identifier>ISSN: 0895-2477</identifier><identifier>EISSN: 1098-2760</identifier><identifier>DOI: 10.1002/mop.28470</identifier><identifier>CODEN: MOTLEO</identifier><language>eng</language><publisher>New York: Blackwell Publishing Ltd</publisher><subject>active electronically scanning array ; Ceramics ; Channels ; heterojunction multilayer ; Heterojunctions ; Holes ; Microwaves ; Modules ; monolithic microwave integrated circuit ; Multilayers ; subcover ; transmit/receive module ; X-band</subject><ispartof>Microwave and optical technology letters, 2014-08, Vol.56 (8), p.1850-1854</ispartof><rights>Copyright © 2014 Wiley Periodicals, Inc.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3680-23a49cacff30a33fae8a828bc5d71bf49f72699f8e4253113565d523905f60463</citedby><cites>FETCH-LOGICAL-c3680-23a49cacff30a33fae8a828bc5d71bf49f72699f8e4253113565d523905f60463</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fmop.28470$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fmop.28470$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids></links><search><creatorcontrib>Jang, Sung-Hoon</creatorcontrib><creatorcontrib>Nam, Byung-Chang</creatorcontrib><creatorcontrib>Kim, Jong-Phil</creatorcontrib><creatorcontrib>Kim, and Seon-Joo</creatorcontrib><title>X-band dual channel transmit/receive module using heterojunction multilayer substrate</title><title>Microwave and optical technology letters</title><addtitle>Microw. Opt. Technol. Lett</addtitle><description>ABSTRACT
This article presents a X‐band dual channel transmit/receive (T/R) Module for AESA radar applications. Instead of the conventional low temperature cofired ceramic technology, we suggested the heterojunction (Ceramic + FR4) multilayer substrate. This structure makes a simple T/R Module fabrication process with low cost. Dual channel allows reducing the size and weight of the T/R Module. Substrates has RF cavities to attach each MMIC chips. RF cavity has a subcover to seal the MMIC and to give an additional area for charging capacitors. The T/R Module's output power is 10 W, efficiency 23%, and noise figure is under 3 dB. © 2014 Wiley Periodicals, Inc. Microwave Opt Technol Lett 56:1850–1854, 2014</description><subject>active electronically scanning array</subject><subject>Ceramics</subject><subject>Channels</subject><subject>heterojunction multilayer</subject><subject>Heterojunctions</subject><subject>Holes</subject><subject>Microwaves</subject><subject>Modules</subject><subject>monolithic microwave integrated circuit</subject><subject>Multilayers</subject><subject>subcover</subject><subject>transmit/receive module</subject><subject>X-band</subject><issn>0895-2477</issn><issn>1098-2760</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2014</creationdate><recordtype>article</recordtype><recordid>eNp10DFv1DAYxnGrAqlHYeAbROoCQ3qv7Th2xlJBAR20Q0tRF8vnvKY-HOewY-C-PYGjDEidvPz-r6yHkOcUTigAWw7j9oSpRsIBWVDoVM1kC4_IAlQnatZIeUie5LwBAC4lW5Drz_XaxL7qiwmVvTMxYqimZGIe_LRMaNF_x2oY-xKwKtnHL9UdTpjGTYl28mOshhImH8wOU5XLOs_thE_JY2dCxmd_3yNy_eb11dnbenVx_u7sdFVb3iqoGTdNZ411joPh3BlURjG1tqKXdO2azknWdp1T2DDBKeWiFb1gvAPhWmhafkRe7O9u0_itYJ704LPFEEzEsWRNhaDQsA7UTI__o5uxpDj_blZM0YYyzmf1cq9sGnNO6PQ2-cGknaagfw-s54H1n4Fnu9zbHz7g7mGoP1xc3hf1vvB5wp__CpO-6lZyKfTNx3O9ev-J3l6yV_qG_wK014vY</recordid><startdate>201408</startdate><enddate>201408</enddate><creator>Jang, Sung-Hoon</creator><creator>Nam, Byung-Chang</creator><creator>Kim, Jong-Phil</creator><creator>Kim, and Seon-Joo</creator><general>Blackwell Publishing Ltd</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><scope>7QQ</scope><scope>JG9</scope></search><sort><creationdate>201408</creationdate><title>X-band dual channel transmit/receive module using heterojunction multilayer substrate</title><author>Jang, Sung-Hoon ; Nam, Byung-Chang ; Kim, Jong-Phil ; Kim, and Seon-Joo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3680-23a49cacff30a33fae8a828bc5d71bf49f72699f8e4253113565d523905f60463</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2014</creationdate><topic>active electronically scanning array</topic><topic>Ceramics</topic><topic>Channels</topic><topic>heterojunction multilayer</topic><topic>Heterojunctions</topic><topic>Holes</topic><topic>Microwaves</topic><topic>Modules</topic><topic>monolithic microwave integrated circuit</topic><topic>Multilayers</topic><topic>subcover</topic><topic>transmit/receive module</topic><topic>X-band</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jang, Sung-Hoon</creatorcontrib><creatorcontrib>Nam, Byung-Chang</creatorcontrib><creatorcontrib>Kim, Jong-Phil</creatorcontrib><creatorcontrib>Kim, and Seon-Joo</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Ceramic Abstracts</collection><collection>Materials Research Database</collection><jtitle>Microwave and optical technology letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Jang, Sung-Hoon</au><au>Nam, Byung-Chang</au><au>Kim, Jong-Phil</au><au>Kim, and Seon-Joo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>X-band dual channel transmit/receive module using heterojunction multilayer substrate</atitle><jtitle>Microwave and optical technology letters</jtitle><addtitle>Microw. Opt. Technol. Lett</addtitle><date>2014-08</date><risdate>2014</risdate><volume>56</volume><issue>8</issue><spage>1850</spage><epage>1854</epage><pages>1850-1854</pages><issn>0895-2477</issn><eissn>1098-2760</eissn><coden>MOTLEO</coden><abstract>ABSTRACT
This article presents a X‐band dual channel transmit/receive (T/R) Module for AESA radar applications. Instead of the conventional low temperature cofired ceramic technology, we suggested the heterojunction (Ceramic + FR4) multilayer substrate. This structure makes a simple T/R Module fabrication process with low cost. Dual channel allows reducing the size and weight of the T/R Module. Substrates has RF cavities to attach each MMIC chips. RF cavity has a subcover to seal the MMIC and to give an additional area for charging capacitors. The T/R Module's output power is 10 W, efficiency 23%, and noise figure is under 3 dB. © 2014 Wiley Periodicals, Inc. Microwave Opt Technol Lett 56:1850–1854, 2014</abstract><cop>New York</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1002/mop.28470</doi><tpages>5</tpages></addata></record> |
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| subjects | active electronically scanning array Ceramics Channels heterojunction multilayer Heterojunctions Holes Microwaves Modules monolithic microwave integrated circuit Multilayers subcover transmit/receive module X-band |
| title | X-band dual channel transmit/receive module using heterojunction multilayer substrate |
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