Enhancement of pressure-free bonding with Cu particles by the addition of Cu–Ni alloy nanoparticles

Cu-Ni alloy nanoparticles ( similar to 20 nm) were synthesized with precise control over the resulting Cu and Ni proportions. Nanoparticles composed of 29 wt% Cu and 71 wt% Ni exhibited significant resistance to surface oxidation and were readily sintered, suggesting that they could serve as bonding...

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Veröffentlicht in:	Journal of materials chemistry. C, Materials for optical and electronic devices Materials for optical and electronic devices, 2014-01, Vol.2 (18), p.3542-3548
Hauptverfasser:	Watanabe, Ryota, Ishizaki, Toshitaka
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloy plating Alloying additive Binary systems BONDING COPPER ALLOYS (40 TO 99.3 CU) Copper base alloys Copper |m Binary systems Electrical conductivity Nanoparticles Nickel |m Binary systems PARTICLES PLATING SINTERING
Online-Zugang:	Volltext
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