A novel integrated structure of thin film GaN LED with ultra-low thermal resistance

This study proposes a novel packaging structure for vertical thin-GaN LED applications by integration of LED chip and silicon-based packaging process. The vertical thin film LED is directly mounted on package submount. The shortest thermal path structure from junction to package submount achieves th...

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Veröffentlicht in:	Optics express 2014-05, Vol.22 Suppl 3 (S3), p.A601-A606
Hauptverfasser:	Wen, Shih-Yi, Hu, Hung-Lieh, Tsai, Yao-Jun, Hsu, Chen-Peng, Lin, Re-Ching, Horng, Ray Hua
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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