Grain size stabilization of nanocrystalline copper at high temperatures by alloying with tantalum

•A mean grain size of 167nm is retained after annealing at 97% of the melting point.•Hardness surpasses conventional pure nanocrystalline Cu by 2.5GPa.•Extreme stability is attributed to both thermodynamic and kinetic stabilization. Nanocrystalline Cu–Ta alloys belong to an emerging class of immisci...

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Veröffentlicht in:	Journal of alloys and compounds 2013-10, Vol.573, p.142-150
Hauptverfasser:	Darling, K.A., Roberts, A.J., Mishin, Y., Mathaudhu, S.N., Kecskes, L.J.
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloying Alloys Annealing ANNEALING PROCESSES Applied sciences Binary alloys Condensed matter: structure, mechanical and thermal properties Copper COPPER ALLOYS (40 TO 99.3 CU) Copper base alloys CRYSTAL STRUCTURE DIFFUSION ELEVATED TEMPERATURE Equations of state, phase equilibria, and phase transitions Exact sciences and technology Grain-growth HARDNESS Heat treatment Immiscible systems Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology MELTING POINT Metals. Metallurgy Microstructure MICROSTRUCTURES Nanocrystalline alloys Nanocrystals Physics Production techniques Solubility, segregation, and mixing phase separation Stability Stabilization Structure of solids and liquids crystallography Structure of specific crystalline solids Thermal analysis Vickers microhardness
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