UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process
Multi-chip packages (MCP) refers to a packaging configuration, connected via wirebonds to a multilayer circuit board, and protected by either a molded encapsulant or a low-cost ceramic package. As it requires high processing temperature, the adhesives for MCP need to show proper adhesion and thermal...
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| Veröffentlicht in: | International journal of adhesion and adhesives 2013-07, Vol.44, p.138-143 |
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| container_end_page | 143 |
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| container_title | International journal of adhesion and adhesives |
| container_volume | 44 |
| creator | Lee, Seung-Woo Park, Ji-Won Park, Cho-Hee Lim, Dong-Hyuk Kim, Hyun-Joong Song, Jun-Yeob Lee, Jae-Hak |
| description | Multi-chip packages (MCP) refers to a packaging configuration, connected via wirebonds to a multilayer circuit board, and protected by either a molded encapsulant or a low-cost ceramic package. As it requires high processing temperature, the adhesives for MCP need to show proper adhesion and thermal stability at high temperature. This study employed semi-interpenetrated (semi-IPN) structured polymer networks using UV-curing with acrylate terminated dual-curable urethane epoxy adhesive, a dipentaerythritol hexacrylate (DPHA), using hydroxydimethyl acetophenone as photo-initiator. UV-curing and thermal stability focused on different photo-initiator contents were investigated using photo-DSC, FTIR-ATR spectroscopy, gel content and TGA. The results show that UV-curable acrylic formulations with different content of photo-initiator affects UV-curing and thermal stability. |
| doi_str_mv | 10.1016/j.ijadhadh.2013.02.005 |
| format | Article |
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The results show that UV-curable acrylic formulations with different content of photo-initiator affects UV-curing and thermal stability.</description><subject>Adhesive bonding</subject><subject>Adhesives</subject><subject>Circuit boards</subject><subject>Networks</subject><subject>Packages</subject><subject>Temporary bonding adhesives</subject><subject>Thermal stability</subject><subject>Three dimensional</subject><subject>Urethane epoxy adhesives</subject><subject>Urethanes</subject><subject>UV-curing</subject><issn>0143-7496</issn><issn>1879-0127</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNqFkc1r3DAQxUVpoNuk_0LRsRc7ow9b9q0l_UghkEvTq5ClcVZb23IlOXRP_derZZtzYGBgeO8Njx8h7xnUDFh7faj9wbh9mZoDEzXwGqB5RXasU30FjKvXZAdMikrJvn1D3qZ0AGAKpNiRvw8_K7tFvzxSszia9xhnM9GUzeAnn480jNRt5VJEZpiQbhHz3ixIcQ1_jrR8xeSfMNExRJpxXkM08UiHsLhTqF-o-Eznbcq-snu_0tXYX-YR6RqDxZSuyMVopoTv_u9L8vD1y4-b2-ru_tv3m093lRWqy1XTst7ZHo0aRCcltLLtWwFCcs7RdciZQjH23SgVjlZZMTIL3IiOycbB4MQl-XDOLX9_b5iynn2yOE2lStiSZg0rYYIx_rJUyk41LShRpO1ZamNIKeKo1-jn0l8z0Cc4-qCf4egTHA1cFzjF-PFsxNL5yWPUyXpcLDof0Wbtgn8p4h-zh5xG</recordid><startdate>20130701</startdate><enddate>20130701</enddate><creator>Lee, Seung-Woo</creator><creator>Park, Ji-Won</creator><creator>Park, Cho-Hee</creator><creator>Lim, Dong-Hyuk</creator><creator>Kim, Hyun-Joong</creator><creator>Song, Jun-Yeob</creator><creator>Lee, Jae-Hak</creator><general>Elsevier Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QQ</scope><scope>7SR</scope><scope>7TB</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>JG9</scope><scope>KR7</scope></search><sort><creationdate>20130701</creationdate><title>UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process</title><author>Lee, Seung-Woo ; Park, Ji-Won ; Park, Cho-Hee ; Lim, Dong-Hyuk ; Kim, Hyun-Joong ; Song, Jun-Yeob ; Lee, Jae-Hak</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c378t-5619dc9ea7b38440646963034222ed8e217e3f98f47efc7c3f1c02a38145d0bd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Adhesive bonding</topic><topic>Adhesives</topic><topic>Circuit boards</topic><topic>Networks</topic><topic>Packages</topic><topic>Temporary bonding adhesives</topic><topic>Thermal stability</topic><topic>Three dimensional</topic><topic>Urethane epoxy adhesives</topic><topic>Urethanes</topic><topic>UV-curing</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Seung-Woo</creatorcontrib><creatorcontrib>Park, Ji-Won</creatorcontrib><creatorcontrib>Park, Cho-Hee</creatorcontrib><creatorcontrib>Lim, Dong-Hyuk</creatorcontrib><creatorcontrib>Kim, Hyun-Joong</creatorcontrib><creatorcontrib>Song, Jun-Yeob</creatorcontrib><creatorcontrib>Lee, Jae-Hak</creatorcontrib><collection>CrossRef</collection><collection>Ceramic Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Materials Research Database</collection><collection>Civil Engineering Abstracts</collection><jtitle>International journal of adhesion and adhesives</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Seung-Woo</au><au>Park, Ji-Won</au><au>Park, Cho-Hee</au><au>Lim, Dong-Hyuk</au><au>Kim, Hyun-Joong</au><au>Song, Jun-Yeob</au><au>Lee, Jae-Hak</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process</atitle><jtitle>International journal of adhesion and adhesives</jtitle><date>2013-07-01</date><risdate>2013</risdate><volume>44</volume><spage>138</spage><epage>143</epage><pages>138-143</pages><issn>0143-7496</issn><eissn>1879-0127</eissn><abstract>Multi-chip packages (MCP) refers to a packaging configuration, connected via wirebonds to a multilayer circuit board, and protected by either a molded encapsulant or a low-cost ceramic package. 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| fulltext | fulltext |
| identifier | ISSN: 0143-7496 |
| ispartof | International journal of adhesion and adhesives, 2013-07, Vol.44, p.138-143 |
| issn | 0143-7496 1879-0127 |
| language | eng |
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| source | ScienceDirect Journals (5 years ago - present) |
| subjects | Adhesive bonding Adhesives Circuit boards Networks Packages Temporary bonding adhesives Thermal stability Three dimensional Urethane epoxy adhesives Urethanes UV-curing |
| title | UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process |
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