Structural Response of Nano-scale Damascene Copper Lines to Annealing

Structural Response of Nano-scale Damascene Copper Lines to Annealing

The high-resolution electron backscatter diffraction (EBSD) technique was applied to study microstructure and texture changes in the overburden layer as well as in upper and bottom parts of nano-scale damascene copper lines during annealing in a temperature range of 200–500°C. The microstructure in...

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Veröffentlicht in:Denki kagaku oyobi kōgyō butsuri kagaku 2013/08/05, Vol.81(8), pp.616-622
Hauptverfasser: KONKOVA, Tatyana, KE, Yiqing, MIRONOV, Sergey, ONUKI, Jin
Format: Artikel
Sprache:eng
Schlagworte:
ANNEALING PROCESSES
Copper
Electron Backscatter Diffraction
Grain Growth
Microstructure and Texture
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creator KONKOVA, Tatyana
KE, Yiqing
MIRONOV, Sergey
ONUKI, Jin
description The high-resolution electron backscatter diffraction (EBSD) technique was applied to study microstructure and texture changes in the overburden layer as well as in upper and bottom parts of nano-scale damascene copper lines during annealing in a temperature range of 200–500°C. The microstructure in overburden layer was found to coarsen significantly at 200°C. At higher temperatures, however, it was established that the overburden layer and both parts of the lines were surprisingly stable. It was also shown that the microstructure in all studied regions was stabilized after achieving the same level of total grain-boundary area per unit volume. This observation has been interpreted as indirect evidence that grain growth behavior in the lines was governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.
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fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_1494334017</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>3184676681</sourcerecordid><originalsourceid>FETCH-LOGICAL-c537t-a9752be186445c95d14c82db8089749d770915008e86e3ec628e9fff212c2afb3</originalsourceid><addsrcrecordid>eNptkD1v2zAQhomiBWok_g0V0KWLXB5JieRouG4awEjRNJkJmj7ZMmRSJakh_z40HHgIutwtz3MfLyFfgC4aqdvvOKDLMbgDnvqU48tCwaKF9gOZMVBtzUQDH8kMuBA1bwT7TOYpHSmlQHWrmZ6R9d8cJ5enaIfqEdMYfMIqdNWD9aFOzg5Y_bAnmxx6rFZhHDFWm95jqnKolt6jHXq_vyWfOjsknL_1G_L8c_20-lVvft_dr5ab2jVc5tpq2bAtlsuEaJxudiCcYrutokpLoXdSUg0NpQpVixxdyxTqrusYMMdst-U35Ntl7hjDvwlTNuVth8NgPYYpGRBacC4oyIJ-fYcewxR9ua5QUpVFikOh5IVyMaQUsTNj7E82vhig5pyweZ-wUWBKwsX8czGPKds9Xj0bc-8G_K-nzgW44WbNWtBX1h1sNOj5K6BpkOk</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1478091831</pqid></control><display><type>article</type><title>Structural Response of Nano-scale Damascene Copper Lines to Annealing</title><source>J-STAGE Free</source><source>EZB-FREE-00999 freely available EZB journals</source><creator>KONKOVA, Tatyana ; KE, Yiqing ; MIRONOV, Sergey ; ONUKI, Jin</creator><creatorcontrib>KONKOVA, Tatyana ; KE, Yiqing ; MIRONOV, Sergey ; ONUKI, Jin</creatorcontrib><description>The high-resolution electron backscatter diffraction (EBSD) technique was applied to study microstructure and texture changes in the overburden layer as well as in upper and bottom parts of nano-scale damascene copper lines during annealing in a temperature range of 200–500°C. The microstructure in overburden layer was found to coarsen significantly at 200°C. At higher temperatures, however, it was established that the overburden layer and both parts of the lines were surprisingly stable. It was also shown that the microstructure in all studied regions was stabilized after achieving the same level of total grain-boundary area per unit volume. This observation has been interpreted as indirect evidence that grain growth behavior in the lines was governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.</description><identifier>ISSN: 1344-3542</identifier><identifier>EISSN: 2186-2451</identifier><identifier>DOI: 10.5796/electrochemistry.81.616</identifier><language>eng</language><publisher>Tokyo: The Electrochemical Society of Japan</publisher><subject>ANNEALING PROCESSES ; Copper ; Electron Backscatter Diffraction ; Grain Growth ; Microstructure and Texture</subject><ispartof>Electrochemistry, 2013/08/05, Vol.81(8), pp.616-622</ispartof><rights>2013 The Electrochemical Society of Japan</rights><rights>Copyright Japan Science and Technology Agency 2013</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c537t-a9752be186445c95d14c82db8089749d770915008e86e3ec628e9fff212c2afb3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1882,27923,27924</link.rule.ids></links><search><creatorcontrib>KONKOVA, Tatyana</creatorcontrib><creatorcontrib>KE, Yiqing</creatorcontrib><creatorcontrib>MIRONOV, Sergey</creatorcontrib><creatorcontrib>ONUKI, Jin</creatorcontrib><title>Structural Response of Nano-scale Damascene Copper Lines to Annealing</title><title>Denki kagaku oyobi kōgyō butsuri kagaku</title><addtitle>Electrochemistry</addtitle><description>The high-resolution electron backscatter diffraction (EBSD) technique was applied to study microstructure and texture changes in the overburden layer as well as in upper and bottom parts of nano-scale damascene copper lines during annealing in a temperature range of 200–500°C. The microstructure in overburden layer was found to coarsen significantly at 200°C. At higher temperatures, however, it was established that the overburden layer and both parts of the lines were surprisingly stable. It was also shown that the microstructure in all studied regions was stabilized after achieving the same level of total grain-boundary area per unit volume. This observation has been interpreted as indirect evidence that grain growth behavior in the lines was governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.</description><subject>ANNEALING PROCESSES</subject><subject>Copper</subject><subject>Electron Backscatter Diffraction</subject><subject>Grain Growth</subject><subject>Microstructure and Texture</subject><issn>1344-3542</issn><issn>2186-2451</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNptkD1v2zAQhomiBWok_g0V0KWLXB5JieRouG4awEjRNJkJmj7ZMmRSJakh_z40HHgIutwtz3MfLyFfgC4aqdvvOKDLMbgDnvqU48tCwaKF9gOZMVBtzUQDH8kMuBA1bwT7TOYpHSmlQHWrmZ6R9d8cJ5enaIfqEdMYfMIqdNWD9aFOzg5Y_bAnmxx6rFZhHDFWm95jqnKolt6jHXq_vyWfOjsknL_1G_L8c_20-lVvft_dr5ab2jVc5tpq2bAtlsuEaJxudiCcYrutokpLoXdSUg0NpQpVixxdyxTqrusYMMdst-U35Ntl7hjDvwlTNuVth8NgPYYpGRBacC4oyIJ-fYcewxR9ua5QUpVFikOh5IVyMaQUsTNj7E82vhig5pyweZ-wUWBKwsX8czGPKds9Xj0bc-8G_K-nzgW44WbNWtBX1h1sNOj5K6BpkOk</recordid><startdate>20130801</startdate><enddate>20130801</enddate><creator>KONKOVA, Tatyana</creator><creator>KE, Yiqing</creator><creator>MIRONOV, Sergey</creator><creator>ONUKI, Jin</creator><general>The Electrochemical Society of Japan</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7QL</scope><scope>7QO</scope><scope>7QQ</scope><scope>7SC</scope><scope>7SE</scope><scope>7SP</scope><scope>7SR</scope><scope>7TA</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>C1K</scope><scope>F28</scope><scope>FR3</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>P64</scope></search><sort><creationdate>20130801</creationdate><title>Structural Response of Nano-scale Damascene Copper Lines to Annealing</title><author>KONKOVA, Tatyana ; KE, Yiqing ; MIRONOV, Sergey ; ONUKI, Jin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c537t-a9752be186445c95d14c82db8089749d770915008e86e3ec628e9fff212c2afb3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ANNEALING PROCESSES</topic><topic>Copper</topic><topic>Electron Backscatter Diffraction</topic><topic>Grain Growth</topic><topic>Microstructure and Texture</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>KONKOVA, Tatyana</creatorcontrib><creatorcontrib>KE, Yiqing</creatorcontrib><creatorcontrib>MIRONOV, Sergey</creatorcontrib><creatorcontrib>ONUKI, Jin</creatorcontrib><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Bacteriology Abstracts (Microbiology B)</collection><collection>Biotechnology Research Abstracts</collection><collection>Ceramic Abstracts</collection><collection>Computer and Information Systems Abstracts</collection><collection>Corrosion Abstracts</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Materials Business File</collection><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts – Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Biotechnology and BioEngineering Abstracts</collection><jtitle>Denki kagaku oyobi kōgyō butsuri kagaku</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>KONKOVA, Tatyana</au><au>KE, Yiqing</au><au>MIRONOV, Sergey</au><au>ONUKI, Jin</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Structural Response of Nano-scale Damascene Copper Lines to Annealing</atitle><jtitle>Denki kagaku oyobi kōgyō butsuri kagaku</jtitle><addtitle>Electrochemistry</addtitle><date>2013-08-01</date><risdate>2013</risdate><volume>81</volume><issue>8</issue><spage>616</spage><epage>622</epage><pages>616-622</pages><issn>1344-3542</issn><eissn>2186-2451</eissn><abstract>The high-resolution electron backscatter diffraction (EBSD) technique was applied to study microstructure and texture changes in the overburden layer as well as in upper and bottom parts of nano-scale damascene copper lines during annealing in a temperature range of 200–500°C. The microstructure in overburden layer was found to coarsen significantly at 200°C. At higher temperatures, however, it was established that the overburden layer and both parts of the lines were surprisingly stable. It was also shown that the microstructure in all studied regions was stabilized after achieving the same level of total grain-boundary area per unit volume. This observation has been interpreted as indirect evidence that grain growth behavior in the lines was governed by the pinning effect of second-phase particles entrapped during the electrodeposition process.</abstract><cop>Tokyo</cop><pub>The Electrochemical Society of Japan</pub><doi>10.5796/electrochemistry.81.616</doi><tpages>7</tpages><oa>free_for_read</oa></addata></record>
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source J-STAGE Free; EZB-FREE-00999 freely available EZB journals
subjects ANNEALING PROCESSES
Copper
Electron Backscatter Diffraction
Grain Growth
Microstructure and Texture
title Structural Response of Nano-scale Damascene Copper Lines to Annealing
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T07%3A17%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Structural%20Response%20of%20Nano-scale%20Damascene%20Copper%20Lines%20to%20Annealing&rft.jtitle=Denki%20kagaku%20oyobi%20k%C5%8Dgy%C5%8D%20butsuri%20kagaku&rft.au=KONKOVA,%20Tatyana&rft.date=2013-08-01&rft.volume=81&rft.issue=8&rft.spage=616&rft.epage=622&rft.pages=616-622&rft.issn=1344-3542&rft.eissn=2186-2451&rft_id=info:doi/10.5796/electrochemistry.81.616&rft_dat=%3Cproquest_cross%3E3184676681%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1478091831&rft_id=info:pmid/&rfr_iscdi=true