Enhanced Ni sub(3)Sn sub(4) nucleation and suppression of metastable NiSn sub(3) in the solid state interfacial reactions between Sn and cone-structured Ni

Interfacial reactions of Ni micro cones with Sn at solid state temperatures from 373 K to 473 K were studied and compared with Sn/flat Ni diffusion couples. Due to its morphological characteristics, cone-structured Ni enhanced the nucleation of Ni sub(3)Sn sub(4), resulting in thicker Ni sub(3)Sn sub(4), which is also smaller in grain size and different in texture. At lower annealing temperatures (