Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level
SUMMARY This paper investigates the electrical performance of innovative carbon‐based nano‐interconnects made by carbon nanotubes and graphene nanoribbons. The electronic transport in the carbon materials is modeled in the frame of the Transmission Line theory, where the classical per‐unit‐length ci...
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Veröffentlicht in: | International journal of numerical modelling 2013-11, Vol.26 (6), p.560-572 |
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creator | Chiariello, Andrea G. Maffucci, Antonio Miano, Giovanni |
description | SUMMARY
This paper investigates the electrical performance of innovative carbon‐based nano‐interconnects made by carbon nanotubes and graphene nanoribbons. The electronic transport in the carbon materials is modeled in the frame of the Transmission Line theory, where the classical per‐unit‐length circuital parameters are corrected by new terms arising from the quantistic nature of the transport. These parameters are related to the number of the conducting channels and the mean free path, which in turn, are expressed as functions of temperature and size. By coupling this model to the heat equation, a simple electro‐thermal model is derived. Case‐studies are carried out with reference to 22‐nm technology node applications. Copyright © 2013 John Wiley & Sons, Ltd. |
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This paper investigates the electrical performance of innovative carbon‐based nano‐interconnects made by carbon nanotubes and graphene nanoribbons. The electronic transport in the carbon materials is modeled in the frame of the Transmission Line theory, where the classical per‐unit‐length circuital parameters are corrected by new terms arising from the quantistic nature of the transport. These parameters are related to the number of the conducting channels and the mean free path, which in turn, are expressed as functions of temperature and size. By coupling this model to the heat equation, a simple electro‐thermal model is derived. Case‐studies are carried out with reference to 22‐nm technology node applications. Copyright © 2013 John Wiley & Sons, Ltd.</description><identifier>ISSN: 0894-3370</identifier><identifier>EISSN: 1099-1204</identifier><identifier>DOI: 10.1002/jnm.1884</identifier><language>eng</language><publisher>Bognor Regis: Blackwell Publishing Ltd</publisher><subject>carbon nanotubes ; Channels ; graphene nanoribbons ; interconnects ; multiphysics modeling</subject><ispartof>International journal of numerical modelling, 2013-11, Vol.26 (6), p.560-572</ispartof><rights>Copyright © 2013 John Wiley & Sons, Ltd.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3644-f55c17353194742376a739dfc4f66e6d57b0d60b67f7c2254719e488a26a6a453</citedby><cites>FETCH-LOGICAL-c3644-f55c17353194742376a739dfc4f66e6d57b0d60b67f7c2254719e488a26a6a453</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fjnm.1884$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fjnm.1884$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,780,784,1417,27924,27925,45574,45575</link.rule.ids></links><search><creatorcontrib>Chiariello, Andrea G.</creatorcontrib><creatorcontrib>Maffucci, Antonio</creatorcontrib><creatorcontrib>Miano, Giovanni</creatorcontrib><title>Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level</title><title>International journal of numerical modelling</title><addtitle>Int. J. Numer. Model</addtitle><description>SUMMARY
This paper investigates the electrical performance of innovative carbon‐based nano‐interconnects made by carbon nanotubes and graphene nanoribbons. The electronic transport in the carbon materials is modeled in the frame of the Transmission Line theory, where the classical per‐unit‐length circuital parameters are corrected by new terms arising from the quantistic nature of the transport. These parameters are related to the number of the conducting channels and the mean free path, which in turn, are expressed as functions of temperature and size. By coupling this model to the heat equation, a simple electro‐thermal model is derived. Case‐studies are carried out with reference to 22‐nm technology node applications. Copyright © 2013 John Wiley & Sons, Ltd.</description><subject>carbon nanotubes</subject><subject>Channels</subject><subject>graphene nanoribbons</subject><subject>interconnects</subject><subject>multiphysics modeling</subject><issn>0894-3370</issn><issn>1099-1204</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp10M9LHTEQB_AgLfhqBf-EgBcva_M7u0fRalv01YMieAnzshPd526yTfbV-t93rcXSQk8zMJ8Zhi8he5wdcsbEh3UcDnldqy2y4KxpKi6YekMWrG5UJaVl2-RdKWvGmORaLMj6CocRM0ybjBRDQD8VmiLFfu5y56Gn8zikPED0SFOgHvIqxWoFBVsaIaaqixNmn2L8tQwT9ffdSCG2dAT_AHdIe_yO_XvyNkBfcPd33SHXpx-vjj9V51_PPh8fnVdeGqWqoLXnVmrJG2WVkNaAlU0bvArGoGm1XbHWsJWxwXohtLK8QVXXIAwYUFrukIOXu2NO3zZYJjd0xWPfQ8S0KY4rq7VmqhYz3f-HrtMmx_m7WSkjGi4s_3PQ51RKxuDG3A2Qnxxn7jl0N4funkOfafVCH7sen_7r3Jflxd--KxP-ePWQH5yx0mp3szxzt_rkYnl52ril_AnOtJFu</recordid><startdate>201311</startdate><enddate>201311</enddate><creator>Chiariello, Andrea G.</creator><creator>Maffucci, Antonio</creator><creator>Miano, Giovanni</creator><general>Blackwell Publishing Ltd</general><general>Wiley Subscription Services, Inc</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7TB</scope><scope>8FD</scope><scope>FR3</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>7SP</scope></search><sort><creationdate>201311</creationdate><title>Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level</title><author>Chiariello, Andrea G. ; Maffucci, Antonio ; Miano, Giovanni</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3644-f55c17353194742376a739dfc4f66e6d57b0d60b67f7c2254719e488a26a6a453</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>carbon nanotubes</topic><topic>Channels</topic><topic>graphene nanoribbons</topic><topic>interconnects</topic><topic>multiphysics modeling</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chiariello, Andrea G.</creatorcontrib><creatorcontrib>Maffucci, Antonio</creatorcontrib><creatorcontrib>Miano, Giovanni</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Electronics & Communications Abstracts</collection><jtitle>International journal of numerical modelling</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chiariello, Andrea G.</au><au>Maffucci, Antonio</au><au>Miano, Giovanni</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level</atitle><jtitle>International journal of numerical modelling</jtitle><addtitle>Int. J. Numer. Model</addtitle><date>2013-11</date><risdate>2013</risdate><volume>26</volume><issue>6</issue><spage>560</spage><epage>572</epage><pages>560-572</pages><issn>0894-3370</issn><eissn>1099-1204</eissn><abstract>SUMMARY
This paper investigates the electrical performance of innovative carbon‐based nano‐interconnects made by carbon nanotubes and graphene nanoribbons. The electronic transport in the carbon materials is modeled in the frame of the Transmission Line theory, where the classical per‐unit‐length circuital parameters are corrected by new terms arising from the quantistic nature of the transport. These parameters are related to the number of the conducting channels and the mean free path, which in turn, are expressed as functions of temperature and size. By coupling this model to the heat equation, a simple electro‐thermal model is derived. Case‐studies are carried out with reference to 22‐nm technology node applications. Copyright © 2013 John Wiley & Sons, Ltd.</abstract><cop>Bognor Regis</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1002/jnm.1884</doi><tpages>13</tpages></addata></record> |
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subjects | carbon nanotubes Channels graphene nanoribbons interconnects multiphysics modeling |
title | Temperature effects on electrical performance of carbon-based nano-interconnects at chip and package level |
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