Anodic Dissolution of Copper in Oxygenated Sulfuric Acid Solution as Examined by Rotating Ring-Disk Electrode
The anodic dissolution of copper was examined in oxygenated sulfuric acid solution. A characteristic property of the anodic process is that the oxidation process Cu → Cu2+ involves the detectable intermediate Cu+, which should disproportionate into Cu and Cu2+ in the thermodynamic equilibrium state....
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Veröffentlicht in: | Denki kagaku oyobi kōgyō butsuri kagaku 2013/07/05, Vol.81(7), pp.547-552 |
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description | The anodic dissolution of copper was examined in oxygenated sulfuric acid solution. A characteristic property of the anodic process is that the oxidation process Cu → Cu2+ involves the detectable intermediate Cu+, which should disproportionate into Cu and Cu2+ in the thermodynamic equilibrium state. On the other hand, H2O2 was formed during anodic dissolution in oxygenated solution by the reaction of Cu+ with O2. The intermediate Cu+ and the byproduct H2O2 were detected in this study using a rotating ring-disk electrode. The anodic dissolution process including the role of oxygen was elucidated through the detection of Cu+ and H2O2. The decrease in the activity of Cu+ in the presence of O2 involved a negative shift of the partial current of Cu → Cu2+ (or Cu+), and resulted in a negative shift of the corrosion potential with increasing stirring rate of the solution. In addition, Cu+ was found to be not a transient intermediate, but rather, a thermodynamic equilibrium species. The acceleration of the corrosion rate in the presence of O2 was elucidated successfully to be due to the couple of the partial currents for Cu → Cu+ and O2 → H2O2. |
doi_str_mv | 10.5796/electrochemistry.81.547 |
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A characteristic property of the anodic process is that the oxidation process Cu → Cu2+ involves the detectable intermediate Cu+, which should disproportionate into Cu and Cu2+ in the thermodynamic equilibrium state. On the other hand, H2O2 was formed during anodic dissolution in oxygenated solution by the reaction of Cu+ with O2. The intermediate Cu+ and the byproduct H2O2 were detected in this study using a rotating ring-disk electrode. The anodic dissolution process including the role of oxygen was elucidated through the detection of Cu+ and H2O2. The decrease in the activity of Cu+ in the presence of O2 involved a negative shift of the partial current of Cu → Cu2+ (or Cu+), and resulted in a negative shift of the corrosion potential with increasing stirring rate of the solution. In addition, Cu+ was found to be not a transient intermediate, but rather, a thermodynamic equilibrium species. The acceleration of the corrosion rate in the presence of O2 was elucidated successfully to be due to the couple of the partial currents for Cu → Cu+ and O2 → H2O2.</description><identifier>ISSN: 1344-3542</identifier><identifier>EISSN: 2186-2451</identifier><identifier>DOI: 10.5796/electrochemistry.81.547</identifier><language>eng</language><publisher>Tokyo: The Electrochemical Society of Japan</publisher><subject>Anodic Dissolution ; Byproducts ; Copper ; Electrodes ; Mixed Potential ; Oxygen ; Oxygenated ; Rotating ; Sulfuric acid ; Thermodynamic equilibrium</subject><ispartof>Electrochemistry, 2013/07/05, Vol.81(7), pp.547-552</ispartof><rights>2013 The Electrochemical Society of Japan</rights><rights>Copyright Japan Science and Technology Agency 2013</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c592t-cf2625cc24c429d2e950ddf2a6a3c3bf1d3552ff0b34573d6f7ee15ccd3a9fa63</citedby><cites>FETCH-LOGICAL-c592t-cf2625cc24c429d2e950ddf2a6a3c3bf1d3552ff0b34573d6f7ee15ccd3a9fa63</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>315,781,785,1884,27925,27926</link.rule.ids></links><search><creatorcontrib>KANZAKI, Yasushi</creatorcontrib><creatorcontrib>BRUCKENSTEIN, Stanley</creatorcontrib><title>Anodic Dissolution of Copper in Oxygenated Sulfuric Acid Solution as Examined by Rotating Ring-Disk Electrode</title><title>Denki kagaku oyobi kōgyō butsuri kagaku</title><addtitle>Electrochemistry</addtitle><description>The anodic dissolution of copper was examined in oxygenated sulfuric acid solution. A characteristic property of the anodic process is that the oxidation process Cu → Cu2+ involves the detectable intermediate Cu+, which should disproportionate into Cu and Cu2+ in the thermodynamic equilibrium state. On the other hand, H2O2 was formed during anodic dissolution in oxygenated solution by the reaction of Cu+ with O2. The intermediate Cu+ and the byproduct H2O2 were detected in this study using a rotating ring-disk electrode. The anodic dissolution process including the role of oxygen was elucidated through the detection of Cu+ and H2O2. The decrease in the activity of Cu+ in the presence of O2 involved a negative shift of the partial current of Cu → Cu2+ (or Cu+), and resulted in a negative shift of the corrosion potential with increasing stirring rate of the solution. In addition, Cu+ was found to be not a transient intermediate, but rather, a thermodynamic equilibrium species. The acceleration of the corrosion rate in the presence of O2 was elucidated successfully to be due to the couple of the partial currents for Cu → Cu+ and O2 → H2O2.</description><subject>Anodic Dissolution</subject><subject>Byproducts</subject><subject>Copper</subject><subject>Electrodes</subject><subject>Mixed Potential</subject><subject>Oxygen</subject><subject>Oxygenated</subject><subject>Rotating</subject><subject>Sulfuric acid</subject><subject>Thermodynamic equilibrium</subject><issn>1344-3542</issn><issn>2186-2451</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNptkc1qGzEUhUVoIcbJM1SQTTfj6nc0WhrXTQuBgNuuhawfR-5YciUNxG8fGadZhIK4QvB9h4sOAJ8wWnAh-y9udKbmZJ7cIZSaT4sBLzgTV2BG8NB3hHH8AcwwZayjnJFrcFvKHiGEkewlkTNwWMZkg4FfQylpnGpIESYPV-l4dBmGCB-fTzsXdXUW_pxGP-UGL01or3-4LnD9rA8hNmR7gptUdQ1xBzdtdC33D1xftrTuBnz0eizu9vWeg9_f1r9W37uHx_sfq-VDZ7gktTOe9IQbQ5hhRFriJEfWeqJ7TQ3demwp58R7tKWMC2p7L5zDTbBUS697OgefL7nHnP5OrlTVvse4cdTRpakozNggMB-aPAd379B9mnJs2zVKDEhiMZwDxYUyOZWSnVfHHA46nxRG6tyEet-EGrBqTTRzczH3peqde_N0rsGM7r-eOA9MzmdNesTfYPOks3KRvgBNB6Ex</recordid><startdate>20130701</startdate><enddate>20130701</enddate><creator>KANZAKI, Yasushi</creator><creator>BRUCKENSTEIN, Stanley</creator><general>The Electrochemical Society of Japan</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7QL</scope><scope>7QO</scope><scope>7QQ</scope><scope>7SC</scope><scope>7SE</scope><scope>7SP</scope><scope>7SR</scope><scope>7TA</scope><scope>7TB</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>C1K</scope><scope>F28</scope><scope>FR3</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>JQ2</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>P64</scope></search><sort><creationdate>20130701</creationdate><title>Anodic Dissolution of Copper in Oxygenated Sulfuric Acid Solution as Examined by Rotating Ring-Disk Electrode</title><author>KANZAKI, Yasushi ; BRUCKENSTEIN, Stanley</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c592t-cf2625cc24c429d2e950ddf2a6a3c3bf1d3552ff0b34573d6f7ee15ccd3a9fa63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Anodic Dissolution</topic><topic>Byproducts</topic><topic>Copper</topic><topic>Electrodes</topic><topic>Mixed Potential</topic><topic>Oxygen</topic><topic>Oxygenated</topic><topic>Rotating</topic><topic>Sulfuric acid</topic><topic>Thermodynamic equilibrium</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>KANZAKI, Yasushi</creatorcontrib><creatorcontrib>BRUCKENSTEIN, Stanley</creatorcontrib><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Bacteriology Abstracts (Microbiology B)</collection><collection>Biotechnology Research Abstracts</collection><collection>Ceramic Abstracts</collection><collection>Computer and Information Systems Abstracts</collection><collection>Corrosion Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Materials Business File</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Biotechnology and BioEngineering Abstracts</collection><jtitle>Denki kagaku oyobi kōgyō butsuri kagaku</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>KANZAKI, Yasushi</au><au>BRUCKENSTEIN, Stanley</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Anodic Dissolution of Copper in Oxygenated Sulfuric Acid Solution as Examined by Rotating Ring-Disk Electrode</atitle><jtitle>Denki kagaku oyobi kōgyō butsuri kagaku</jtitle><addtitle>Electrochemistry</addtitle><date>2013-07-01</date><risdate>2013</risdate><volume>81</volume><issue>7</issue><spage>547</spage><epage>552</epage><pages>547-552</pages><issn>1344-3542</issn><eissn>2186-2451</eissn><abstract>The anodic dissolution of copper was examined in oxygenated sulfuric acid solution. A characteristic property of the anodic process is that the oxidation process Cu → Cu2+ involves the detectable intermediate Cu+, which should disproportionate into Cu and Cu2+ in the thermodynamic equilibrium state. On the other hand, H2O2 was formed during anodic dissolution in oxygenated solution by the reaction of Cu+ with O2. The intermediate Cu+ and the byproduct H2O2 were detected in this study using a rotating ring-disk electrode. The anodic dissolution process including the role of oxygen was elucidated through the detection of Cu+ and H2O2. The decrease in the activity of Cu+ in the presence of O2 involved a negative shift of the partial current of Cu → Cu2+ (or Cu+), and resulted in a negative shift of the corrosion potential with increasing stirring rate of the solution. In addition, Cu+ was found to be not a transient intermediate, but rather, a thermodynamic equilibrium species. The acceleration of the corrosion rate in the presence of O2 was elucidated successfully to be due to the couple of the partial currents for Cu → Cu+ and O2 → H2O2.</abstract><cop>Tokyo</cop><pub>The Electrochemical Society of Japan</pub><doi>10.5796/electrochemistry.81.547</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Anodic Dissolution Byproducts Copper Electrodes Mixed Potential Oxygen Oxygenated Rotating Sulfuric acid Thermodynamic equilibrium |
title | Anodic Dissolution of Copper in Oxygenated Sulfuric Acid Solution as Examined by Rotating Ring-Disk Electrode |
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