A novel COB structure with integrated multifunction

A novel COB (chip-on-board) structure with integrated multifunction is presented. The structure is prepared by laminating copper plate with FR4 board and then coating with a silver layer to offer high reflectivity and high conductivity. In comparison with MCPCB (aluminum) and ceramics (Al sub(2)O su...

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Veröffentlicht in:	Journal of semiconductors 2013-05, Vol.34 (5), p.55001-1-4
Hauptverfasser:	Xie, Zhiguo, Li, Cheng, Yu, Binhai, Wang, Yaohao
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum Aluminum oxide Ceramics Cob High voltages Lighting Plating Semiconductors
Online-Zugang:	Volltext
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