Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic
A facile and palladium-free process for the electroless plating on poly(vinyl chloride) (PVC) plastic has been demonstrated. The process is based on the Cu adsorption capacity of semi-interpenetrating polymer network (semi-IPN) hydrogel chemically bonded to PVC surface via a simple and one-step appr...
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| Veröffentlicht in: | Journal of materials science 2013-10, Vol.48 (20), p.7224-7237 |
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| creator | Wang, Ming-Qiu Yan, Jun Du, Shi-Guo Zeng, Jian-Wei Chang, Wen-Ping Guo, Yi Li, Hong-Guang |
| description | A facile and palladium-free process for the electroless plating on poly(vinyl chloride) (PVC) plastic has been demonstrated. The process is based on the Cu adsorption capacity of semi-interpenetrating polymer network (semi-IPN) hydrogel chemically bonded to PVC surface via a simple and one-step approach that applying a chitosan/polyethylene glycol/glutaraldehyde system under mild stirring at room temperature. Therefore, electroless plating can be achieved in the following three steps, namely: (1) the functionalization of PVC by the semi-IPN hydrogel film (2) the adsorption and formation of the catalyst Cu
0
on the PVC surface, and (3) the electroless nickel plating in plating bath. Batch adsorption experiments are conducted to determine the effects of pH, initial Cu
2+
ions concentration and the dosage of crosslinking agent glutaraldehyde on copper adsorption and the surface resistance of the corresponding plated-PVC. The activated reaction progress and resulting nickel–phosphorus (Ni–P) layer were characterized by attenuated total reflection Fourier transform infrared, scanning electron microscopy, X-ray photoelectron spectroscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. The results show that the Cu nanoparticles chemisorbed on the functionalized PVC substrate, could effectively initial the subsequent electroless nickel plating; and a compact and continuous Ni–P layer with amorphous phase was successfully deposited on PVC by this process. Besides, the surface resistance of the plated-PVC as low as 0.5 Ω sq
−1
showed an excellent adhesion with the PVC substrate proved by Scotch-tape test. |
| doi_str_mv | 10.1007/s10853-013-7539-7 |
| format | Article |
| fullrecord | <record><control><sourceid>gale_proqu</sourceid><recordid>TN_cdi_proquest_miscellaneous_1439760362</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><galeid>A345073436</galeid><sourcerecordid>A345073436</sourcerecordid><originalsourceid>FETCH-LOGICAL-c422t-7af4406c122d418798793674a5ca9094701ba3fa9a3ab7e76ec942493959eaf3</originalsourceid><addsrcrecordid>eNp1kt1qHCEUgKU00O0mD5A7oTfJxaT-zbheLqE_gUChzb0Y58zE1NWpOiXb5-gD1-kUSgpF4YDn-zx6OAidU3JFCZFvMyW7ljeE8ka2XDXyBdrQVvJG7Ah_iTaEMNYw0dFX6HXOj4SQVjK6QT_3fY5pKi4GbB9MMrZAcrk4i-OAbZwmSLgmMzahx67UOE3eWfPbcAGDB1tS9JAzDs5-BY8nX7NhxBUw-OHYpziCb4Y52EUy3v2AHk_RHy--u3D0ta6PyfVwuZhL6VN0Mhif4exP3KK79-_urj82t58-3FzvbxsrGCuNNIMQpLOUsV7QnVR1804K01qjiBKS0HvDB6MMN_cSZAdWCSYUV60CM_AtulivnVL8NkMu-uCyBe9NgDhnTQVXsiO8YxV98w_6GOdU_5I1Y63q6E7V9m_R1UqNxoN2YYilNrSuHg7OxgCDq-d7LloiueBdFS6fCZUp8FRGM-esb758fs7SlbUp5pxg0FNyB5OOmhK9zIBeZ0DXGdDLDGhZHbY6ubJhhPT32f-XfgHUvrVO</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2259618985</pqid></control><display><type>article</type><title>Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic</title><source>SpringerNature Journals</source><creator>Wang, Ming-Qiu ; Yan, Jun ; Du, Shi-Guo ; Zeng, Jian-Wei ; Chang, Wen-Ping ; Guo, Yi ; Li, Hong-Guang</creator><creatorcontrib>Wang, Ming-Qiu ; Yan, Jun ; Du, Shi-Guo ; Zeng, Jian-Wei ; Chang, Wen-Ping ; Guo, Yi ; Li, Hong-Guang</creatorcontrib><description>A facile and palladium-free process for the electroless plating on poly(vinyl chloride) (PVC) plastic has been demonstrated. The process is based on the Cu adsorption capacity of semi-interpenetrating polymer network (semi-IPN) hydrogel chemically bonded to PVC surface via a simple and one-step approach that applying a chitosan/polyethylene glycol/glutaraldehyde system under mild stirring at room temperature. Therefore, electroless plating can be achieved in the following three steps, namely: (1) the functionalization of PVC by the semi-IPN hydrogel film (2) the adsorption and formation of the catalyst Cu
0
on the PVC surface, and (3) the electroless nickel plating in plating bath. Batch adsorption experiments are conducted to determine the effects of pH, initial Cu
2+
ions concentration and the dosage of crosslinking agent glutaraldehyde on copper adsorption and the surface resistance of the corresponding plated-PVC. The activated reaction progress and resulting nickel–phosphorus (Ni–P) layer were characterized by attenuated total reflection Fourier transform infrared, scanning electron microscopy, X-ray photoelectron spectroscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. The results show that the Cu nanoparticles chemisorbed on the functionalized PVC substrate, could effectively initial the subsequent electroless nickel plating; and a compact and continuous Ni–P layer with amorphous phase was successfully deposited on PVC by this process. Besides, the surface resistance of the plated-PVC as low as 0.5 Ω sq
−1
showed an excellent adhesion with the PVC substrate proved by Scotch-tape test.</description><identifier>ISSN: 0022-2461</identifier><identifier>EISSN: 1573-4803</identifier><identifier>DOI: 10.1007/s10853-013-7539-7</identifier><language>eng</language><publisher>Boston: Springer US</publisher><subject>Adhesion tests ; Adsorption ; Characterization and Evaluation of Materials ; Chemical bonds ; Chemical properties ; Chemistry and Materials Science ; Chitosan ; Chlorides ; Classical Mechanics ; Copper ; Copper plating ; Crosslinked polymers ; Crosslinking ; Crystallography and Scattering Methods ; Electroless nickel plating ; Electroless plating ; Energy dispersive X ray spectroscopy ; Fourier transforms ; Glutaraldehyde ; Hydrogels ; Infrared reflection ; Interpenetrating networks ; Materials Science ; Nanoparticles ; Nickel ; Organic chemistry ; Palladium ; Photoelectrons ; Plating baths ; Polyethylene glycol ; Polymer Sciences ; Polymers ; Polyols ; Polyvinyl chloride ; Polyvinyl chlorides ; Scanning electron microscopy ; Solid Mechanics ; Spectrum analysis ; Substrates ; Surface chemistry ; Surface resistance ; Vinyl chloride ; X-ray diffraction ; X-ray spectroscopy</subject><ispartof>Journal of materials science, 2013-10, Vol.48 (20), p.7224-7237</ispartof><rights>Springer Science+Business Media New York 2013</rights><rights>COPYRIGHT 2013 Springer</rights><rights>Journal of Materials Science is a copyright of Springer, (2013). All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c422t-7af4406c122d418798793674a5ca9094701ba3fa9a3ab7e76ec942493959eaf3</citedby><cites>FETCH-LOGICAL-c422t-7af4406c122d418798793674a5ca9094701ba3fa9a3ab7e76ec942493959eaf3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s10853-013-7539-7$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s10853-013-7539-7$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Wang, Ming-Qiu</creatorcontrib><creatorcontrib>Yan, Jun</creatorcontrib><creatorcontrib>Du, Shi-Guo</creatorcontrib><creatorcontrib>Zeng, Jian-Wei</creatorcontrib><creatorcontrib>Chang, Wen-Ping</creatorcontrib><creatorcontrib>Guo, Yi</creatorcontrib><creatorcontrib>Li, Hong-Guang</creatorcontrib><title>Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic</title><title>Journal of materials science</title><addtitle>J Mater Sci</addtitle><description>A facile and palladium-free process for the electroless plating on poly(vinyl chloride) (PVC) plastic has been demonstrated. The process is based on the Cu adsorption capacity of semi-interpenetrating polymer network (semi-IPN) hydrogel chemically bonded to PVC surface via a simple and one-step approach that applying a chitosan/polyethylene glycol/glutaraldehyde system under mild stirring at room temperature. Therefore, electroless plating can be achieved in the following three steps, namely: (1) the functionalization of PVC by the semi-IPN hydrogel film (2) the adsorption and formation of the catalyst Cu
0
on the PVC surface, and (3) the electroless nickel plating in plating bath. Batch adsorption experiments are conducted to determine the effects of pH, initial Cu
2+
ions concentration and the dosage of crosslinking agent glutaraldehyde on copper adsorption and the surface resistance of the corresponding plated-PVC. The activated reaction progress and resulting nickel–phosphorus (Ni–P) layer were characterized by attenuated total reflection Fourier transform infrared, scanning electron microscopy, X-ray photoelectron spectroscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. The results show that the Cu nanoparticles chemisorbed on the functionalized PVC substrate, could effectively initial the subsequent electroless nickel plating; and a compact and continuous Ni–P layer with amorphous phase was successfully deposited on PVC by this process. Besides, the surface resistance of the plated-PVC as low as 0.5 Ω sq
−1
showed an excellent adhesion with the PVC substrate proved by Scotch-tape test.</description><subject>Adhesion tests</subject><subject>Adsorption</subject><subject>Characterization and Evaluation of Materials</subject><subject>Chemical bonds</subject><subject>Chemical properties</subject><subject>Chemistry and Materials Science</subject><subject>Chitosan</subject><subject>Chlorides</subject><subject>Classical Mechanics</subject><subject>Copper</subject><subject>Copper plating</subject><subject>Crosslinked polymers</subject><subject>Crosslinking</subject><subject>Crystallography and Scattering Methods</subject><subject>Electroless nickel plating</subject><subject>Electroless plating</subject><subject>Energy dispersive X ray spectroscopy</subject><subject>Fourier transforms</subject><subject>Glutaraldehyde</subject><subject>Hydrogels</subject><subject>Infrared reflection</subject><subject>Interpenetrating networks</subject><subject>Materials Science</subject><subject>Nanoparticles</subject><subject>Nickel</subject><subject>Organic chemistry</subject><subject>Palladium</subject><subject>Photoelectrons</subject><subject>Plating baths</subject><subject>Polyethylene glycol</subject><subject>Polymer Sciences</subject><subject>Polymers</subject><subject>Polyols</subject><subject>Polyvinyl chloride</subject><subject>Polyvinyl chlorides</subject><subject>Scanning electron microscopy</subject><subject>Solid Mechanics</subject><subject>Spectrum analysis</subject><subject>Substrates</subject><subject>Surface chemistry</subject><subject>Surface resistance</subject><subject>Vinyl chloride</subject><subject>X-ray diffraction</subject><subject>X-ray spectroscopy</subject><issn>0022-2461</issn><issn>1573-4803</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNp1kt1qHCEUgKU00O0mD5A7oTfJxaT-zbheLqE_gUChzb0Y58zE1NWpOiXb5-gD1-kUSgpF4YDn-zx6OAidU3JFCZFvMyW7ljeE8ka2XDXyBdrQVvJG7Ah_iTaEMNYw0dFX6HXOj4SQVjK6QT_3fY5pKi4GbB9MMrZAcrk4i-OAbZwmSLgmMzahx67UOE3eWfPbcAGDB1tS9JAzDs5-BY8nX7NhxBUw-OHYpziCb4Y52EUy3v2AHk_RHy--u3D0ta6PyfVwuZhL6VN0Mhif4exP3KK79-_urj82t58-3FzvbxsrGCuNNIMQpLOUsV7QnVR1804K01qjiBKS0HvDB6MMN_cSZAdWCSYUV60CM_AtulivnVL8NkMu-uCyBe9NgDhnTQVXsiO8YxV98w_6GOdU_5I1Y63q6E7V9m_R1UqNxoN2YYilNrSuHg7OxgCDq-d7LloiueBdFS6fCZUp8FRGM-esb758fs7SlbUp5pxg0FNyB5OOmhK9zIBeZ0DXGdDLDGhZHbY6ubJhhPT32f-XfgHUvrVO</recordid><startdate>20131001</startdate><enddate>20131001</enddate><creator>Wang, Ming-Qiu</creator><creator>Yan, Jun</creator><creator>Du, Shi-Guo</creator><creator>Zeng, Jian-Wei</creator><creator>Chang, Wen-Ping</creator><creator>Guo, Yi</creator><creator>Li, Hong-Guang</creator><general>Springer US</general><general>Springer</general><general>Springer Nature B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>ISR</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M7S</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>7SR</scope><scope>7U5</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>L7M</scope></search><sort><creationdate>20131001</creationdate><title>Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic</title><author>Wang, Ming-Qiu ; Yan, Jun ; Du, Shi-Guo ; Zeng, Jian-Wei ; Chang, Wen-Ping ; Guo, Yi ; Li, Hong-Guang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c422t-7af4406c122d418798793674a5ca9094701ba3fa9a3ab7e76ec942493959eaf3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Adhesion tests</topic><topic>Adsorption</topic><topic>Characterization and Evaluation of Materials</topic><topic>Chemical bonds</topic><topic>Chemical properties</topic><topic>Chemistry and Materials Science</topic><topic>Chitosan</topic><topic>Chlorides</topic><topic>Classical Mechanics</topic><topic>Copper</topic><topic>Copper plating</topic><topic>Crosslinked polymers</topic><topic>Crosslinking</topic><topic>Crystallography and Scattering Methods</topic><topic>Electroless nickel plating</topic><topic>Electroless plating</topic><topic>Energy dispersive X ray spectroscopy</topic><topic>Fourier transforms</topic><topic>Glutaraldehyde</topic><topic>Hydrogels</topic><topic>Infrared reflection</topic><topic>Interpenetrating networks</topic><topic>Materials Science</topic><topic>Nanoparticles</topic><topic>Nickel</topic><topic>Organic chemistry</topic><topic>Palladium</topic><topic>Photoelectrons</topic><topic>Plating baths</topic><topic>Polyethylene glycol</topic><topic>Polymer Sciences</topic><topic>Polymers</topic><topic>Polyols</topic><topic>Polyvinyl chloride</topic><topic>Polyvinyl chlorides</topic><topic>Scanning electron microscopy</topic><topic>Solid Mechanics</topic><topic>Spectrum analysis</topic><topic>Substrates</topic><topic>Surface chemistry</topic><topic>Surface resistance</topic><topic>Vinyl chloride</topic><topic>X-ray diffraction</topic><topic>X-ray spectroscopy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Wang, Ming-Qiu</creatorcontrib><creatorcontrib>Yan, Jun</creatorcontrib><creatorcontrib>Du, Shi-Guo</creatorcontrib><creatorcontrib>Zeng, Jian-Wei</creatorcontrib><creatorcontrib>Chang, Wen-Ping</creatorcontrib><creatorcontrib>Guo, Yi</creatorcontrib><creatorcontrib>Li, Hong-Guang</creatorcontrib><collection>CrossRef</collection><collection>Gale In Context: Science</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Engineering Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>Engineered Materials Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of materials science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Wang, Ming-Qiu</au><au>Yan, Jun</au><au>Du, Shi-Guo</au><au>Zeng, Jian-Wei</au><au>Chang, Wen-Ping</au><au>Guo, Yi</au><au>Li, Hong-Guang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic</atitle><jtitle>Journal of materials science</jtitle><stitle>J Mater Sci</stitle><date>2013-10-01</date><risdate>2013</risdate><volume>48</volume><issue>20</issue><spage>7224</spage><epage>7237</epage><pages>7224-7237</pages><issn>0022-2461</issn><eissn>1573-4803</eissn><abstract>A facile and palladium-free process for the electroless plating on poly(vinyl chloride) (PVC) plastic has been demonstrated. The process is based on the Cu adsorption capacity of semi-interpenetrating polymer network (semi-IPN) hydrogel chemically bonded to PVC surface via a simple and one-step approach that applying a chitosan/polyethylene glycol/glutaraldehyde system under mild stirring at room temperature. Therefore, electroless plating can be achieved in the following three steps, namely: (1) the functionalization of PVC by the semi-IPN hydrogel film (2) the adsorption and formation of the catalyst Cu
0
on the PVC surface, and (3) the electroless nickel plating in plating bath. Batch adsorption experiments are conducted to determine the effects of pH, initial Cu
2+
ions concentration and the dosage of crosslinking agent glutaraldehyde on copper adsorption and the surface resistance of the corresponding plated-PVC. The activated reaction progress and resulting nickel–phosphorus (Ni–P) layer were characterized by attenuated total reflection Fourier transform infrared, scanning electron microscopy, X-ray photoelectron spectroscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. The results show that the Cu nanoparticles chemisorbed on the functionalized PVC substrate, could effectively initial the subsequent electroless nickel plating; and a compact and continuous Ni–P layer with amorphous phase was successfully deposited on PVC by this process. Besides, the surface resistance of the plated-PVC as low as 0.5 Ω sq
−1
showed an excellent adhesion with the PVC substrate proved by Scotch-tape test.</abstract><cop>Boston</cop><pub>Springer US</pub><doi>10.1007/s10853-013-7539-7</doi><tpages>14</tpages></addata></record> |
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| subjects | Adhesion tests Adsorption Characterization and Evaluation of Materials Chemical bonds Chemical properties Chemistry and Materials Science Chitosan Chlorides Classical Mechanics Copper Copper plating Crosslinked polymers Crosslinking Crystallography and Scattering Methods Electroless nickel plating Electroless plating Energy dispersive X ray spectroscopy Fourier transforms Glutaraldehyde Hydrogels Infrared reflection Interpenetrating networks Materials Science Nanoparticles Nickel Organic chemistry Palladium Photoelectrons Plating baths Polyethylene glycol Polymer Sciences Polymers Polyols Polyvinyl chloride Polyvinyl chlorides Scanning electron microscopy Solid Mechanics Spectrum analysis Substrates Surface chemistry Surface resistance Vinyl chloride X-ray diffraction X-ray spectroscopy |
| title | Adsorption characteristic of copper ions and its application in electroless nickel plating on a hydrogel-functionalized poly(vinyl chloride) plastic |
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