Application of Electrodeposited Ni-P Film for the Improvement of Corrosion Resistance in Au-Co/Ni Processes

An electroplated Ni–P film with about 0.9 wt% co-deposited phosphorus was obtained using a sulfamic-acid-type Ni electroplating solution containing 0.05 mol/dm3 of phosphoric acid for improvement of corrosion resistance. However, crack-formation-deposited Ni–P films were often observed under operati...

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Veröffentlicht in:	Hyōmen gijutsu 2012/04/01, Vol.63(4), pp.241
Hauptverfasser:	KATO, Ikuhiro, MURAKAMI, Yoshinori, WATANABE, Hideto, CORDONIER, Christopher, HONMA, Hideo
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Acetic acid Contact Resistance Corrosion Resistance Density Electrodeposition High Current Density Nickel Ni–P Deposited Film Organic acids pH Phosphorous acid Phosphorus Solder Spreadability
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