Dilute H2SO4 solution for copper seed cleaning in electroplating

The effects of surface cleaning to eliminate the surface oxides formed on Cu seed layer with dilute H2SO4 solution were investigated. Cu seed layer formed on Ti/Si(100) wafer by sputter deposition was exposed to air to grow native Cu oxide. Dilute H2SO4 solutions and/or TS-40A alkaline soak cleaner...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Transactions of Nonferrous Metals Society of China 2013-02, Vol.23 (2), p.562-566
Hauptverfasser:	LEE, Youn-Seoung, YOON, Jae-Sik, JO, Yang-Rae, LEE, Heesoo, RHA, Sa-Kyun
Format:	Artikel
Sprache:	eng
Schlagworte:	Carbon CLEANING Copper COPPER OXIDE CUPRIC OXIDE CUPROUS OXIDE DEPOSITION DILUTION ELECTROPLATING H2SO4 OXIDES pretreatment Seeds sheet resistance XPS
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!