Diffraction residual stress analysis in technical components — Status and prospects
Over the years residual stress analysis using diffraction techniques developed to an important approach to solve basic scientific as well as application oriented problems in materials science and technology. In particular it became an indispensable tool for the dimensioning of highly loaded componen...
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Veröffentlicht in: | Thin solid films 2013-03, Vol.530, p.53-61 |
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Hauptverfasser: | , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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